SOLDER PASTE, INDIUM 5.1, TYPE 3 Search Results

LGA voiding

Abstract: NC-SMQ230 Indalloy 181 Solder Paste, Indium, Type 3 AN2920 7313 28 pin freescale ltcc BGA cte hcte ipc 610D
Contextual Info: Freescale Semiconductor Application Note Document Number: AN2920 Rev. 2, 12/2008 Manufacturing with the Land Grid Array Package by Networking & Multimedia Group Freescale Semiconductor, Inc. Austin, TX Freescale has introduced the High Coefficient of Thermal

tamura solder paste

Abstract: AN-1035 SN63 PB37 multicore SN62 PB36 ag2 kester SN62 MP AN1035 tamura solder paste PROFILE Litton SN62 PB36 ag2 100N
Contextual Info: Application Note AN-1035 DirectFET Technology Board Mounting Table of Contents Page Device construction Design considerations Assembly considerations Mechanical test results Model-specific data 2 2 3 5 8 DirectFET™ is a new surface mount semiconductor technology designed primarily for boardmounted power applications. It eliminates unnecessary elements of packaging that contribute to

tamura tlf-206-93f

Abstract: p10 LED matrix single color module CANADA ICES 003. CLASS B mother board tamura tlf sac305 S131CL-5-RMM-2450S tamura solder paste SAC305 indium MMCX connector Sn 4011 SAC387 solder
Contextual Info: PRELIMINARY DATA SHEET MATRIX Transceiver Modules ZMXM-400 Series Integrated Transceiver Module for ZigBee / IEEE 802.15.4 Evaluation Kits available DESCRIPTION The Matrix module is a 2.4 GHz IEEE 802.15.4 RF transceiver providing a cost- effective solution for data links and wireless networks. The module design is

LGA rework

Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework
Contextual Info: Freescale Semiconductor Application Note Document Number: AN3241 Rev. 1.0, 10/2009 Land Grid Array LGA Package Rework 1 Introduction This application note describes rework considerations for the Land Grid Array (LGA) style package. Freescale has introduced radio frequency (RF) modules

tamura tlf-206-93f

Abstract: SAC387 IPC-7711 Tamura kaken TLF-206-93F tamura solder paste tamura tlf tamura No clean solder paste S131CL-5-RMM-2450S TLF 206-93F lead free
Contextual Info: MATRIX TRANSCEIVER MODULES ZMXM-400 Series Integrated Transceiver Module for ZigBee / IEEE 802.15.4 Evaluation Kits available DESCRIPTION The Matrix module is a 2.4 GHz IEEE 802.15.4 RF transceiver providing a cost- effective solution for data links and wireless networks. The module design is

IPC-7527

Abstract: IPC-7525 koki solder paste IPC7527
Contextual Info: Application Note 100 June 2005 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single

Cu3Sn

Abstract: ipc 610 non-wetting
Contextual Info: AN10365 Surface mount reflow soldering Rev. 6 — 30 July 2012 Application note Document information Info Content Keywords surface mount, reflow soldering, component handling Abstract This application note provides guidelines for the board mounting and handling of NXP semiconductor packages.

p10 LED matrix single color module

Abstract: tamura tlf-206-93f ZMXM-400 SAC-387
Contextual Info: MATRIX Transceiver Modules ZMXM-400 Series Integrated Transceiver Module for ZigBee / IEEE 802.15.4 N O T FO R R EC N O EW M M D EN ES D IG ED N Evaluation Kits available DESCRIPTION The Matrix module is a 2.4 GHz IEEE 802.15.4 RF transceiver providing a cost-

IPC-7527

Abstract: LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT
Contextual Info: Application Note 100 February 2006 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single

LGA voiding

Abstract: IPC-7527 IPC7525 lga material koki solder paste LTM4600 an100fc AN100 IPC7525 reflowing profiles lga Water soluble flux
Contextual Info: Application Note 100 February 2006 Revised January 2008 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 Introduction The Linear Technology Module solution combines integrated circuits and passive components in a single package.

Cu3Sn

Abstract: HVQFN48 J-STD-020D SSOP20 Cu6Sn5 Solder Paste, Indium 5.1, Type 3 AN10365
Contextual Info: AN10365 Surface mount reflow soldering description Rev. 03 — 22 April 2008 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.

AN3281

Abstract: LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate
Contextual Info: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.1, 12/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style

LGA voiding

Abstract: AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale
Contextual Info: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.0, 10/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style

AN10365

Abstract: ipc 610D Cu3Sn JEDEC J-STD-033b.1 SSOP20 LAND PATTERN JEDEC J-STD-033b J-STD-033b.1 Cu6Sn5 ipc 610 non-wetting Solder Paste, Indium, Type 3
Contextual Info: AN10365 Surface mount reflow soldering description Rev. 04 — 13 August 2009 Application note Document information Info Content Keywords surface mount, reflow soldering, component handling Abstract This application note provides guidelines for the board mounting and

Cu3Sn

Abstract: Solder Paste, Indium, Type 3 SSOP20 LAND PATTERN Solder Paste Indium reflow process control Solder Paste, Indium 5.1, Type 3 HVQFN48 SSOP20 philips pb-free products SOT266-1 LAND PATTERN
Contextual Info: AN10365 Surface mount reflow soldering description Rev. 02 — 26 July 2006 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.

Lead Free reflow soldering profile BGA

Abstract: AN10365 HVQFN48 SSOP20 Solder Paste, Indium, Type 3 Cu3Sn philips pb-free products
Contextual Info: AN10365 Surface mount reflow soldering description Rev. 01 — 24 May 2005 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.

AN-1035

Abstract: technical data sheet of tamura solder paste 100N AN-1050 AN-1080 A142A 663n tamura solder paste PROFILE
Contextual Info: Application Note AN-1035 DirectFET Technology Board Mounting Application Note Table of Contents Page Device construction . 2 Design considerations . 3 Assembly considerations. 4

E11663-001

Abstract: Loctite 7452 honeywell pcm45 DDR2-667 DDR2-800 PCM45F FLUKE 79 intel chipset g 41 motherboard no display chipset dual core intel BGA heatsink compressive force
Contextual Info: Intel 3210 and 3200 Chipset Thermal/Mechanical Design Guide November 2007 Reference Number: 318465 Revision: 001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

Contextual Info: AN11183 Mounting and soldering of RF transistors in over-molded plastic packages Rev. 1 — 6 November 2012 Application note Document information Info Content Keywords Over-Molded Plastic OMP packages, heat sink, footprint, surface mount, reflow soldering, component handling, exposed heat spreader, SMDP,

d9258

Abstract: d92580 Loctite 7452 82X38 AVC cool indium paste TT-T-36 5SRTC-TT-T36-72 FLUKE 79 42SN
Contextual Info: Intel X38 Express Chipset Thermal and Mechanical Design Guidelines — For the Intel® 82X38 Memory Controller Hub MCH September 2007 Revision -001 Document Number: 317612-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR

AN10896

Abstract: finger print sensor pcb with circuit Mounting and Soldering of RF transistors heller 1700 ipc 610D JEDEC J-STD-020d Moisture/Reflow sensitivity HVQFN48 J-STD-020D bga rework graphite thermal spreader
Contextual Info: AN10896 Mounting and Soldering of RF transistors Rev. 01 — 17 May 2010 Application note Document information Info Content Keywords Surface mount, reflow soldering, bolt down Abstract This application note provides bolt down and soldering guidelines for NXP’s RF transistor packages

AN10896

Contextual Info: AN10896 Mounting and Soldering of RF transistors Rev. 2 — 13 Nov 2012 Application note Document information Info Content Keywords Surface mount, reflow soldering, bolt down Abstract This application note provides bolt down and soldering guidelines for NXP’s RF transistor packages

ultrasonic proximity detector report file

Abstract: laser chirp parameter QT510-ISG R604 capacitive touch slider 850C E510 QT510 QT510-ISSG rotary KEY ROW ic
Contextual Info: QT510 lQ QWHEEL TOUCH SLIDER IC z Rotary finger-touch ‘wheel’ slider control z Extremely simple circuit - no external active components z Completely passive sensing element: no moving parts VDD 1 14 GND SDO 2 13 DRDY /SS 3 QT510 12 PROX SCLK 4 11 SDI

Solder Paste, Indium 5.1, Type 3

Abstract: ultrasonic proximity detector report file capacitive touch screen panel TOUCH CONTROL volume control multi touch screens capacitive touch screen paste resistor thick film slide potentiometer 100k for dimmer 651 T2 HP lcd connector 40 pin to 30 pin to 7 pin
Contextual Info: QT401 lQ QSLIDE TOUCH SLIDER IC 1-dimensional finger-touch slider Extremely simple circuit - no external active components VDD 1 14 GND Completely passive sensing strip: no moving parts SDO 2 13 DRDY /SS 3 QT401 12 SCLK 4 11 PROX SDI 5 10 N/A SNS1B 6 9