SOL20 PACKAGE Search Results

SOL24

Abstract: SOL-24 SSOP20 SOL20
Contextual Info: TD74ABT Series A4 Type No. Package TD74ABT 240F/FS/FW Octal Bus Buffer/lnvertlng/3-state SOP20/SSOP20/SOL20 TD74ABT 241F/FW Octal Bus Buffer/Non-lnverting/3-state SOP20/SOL20 TD74ABT 244F/FS/FW Octal Bus Bufler/Non-lnverting/3-state SOP20/SSOP20/SOL20 TD74ABT 245F/FS/FW

SOP20

Abstract: SOL20 DIP20 DIP-20
Contextual Info: BiCMOS Standard Logics TD74BC Series A4 Typo No. Package Function TD74BC00P Quad 2-Input NAND Gate DIP14 TD74BC08P Quad 2-Input AND Gate DIP14 TD74BC32P Quad 2-Input OR Gate DIP14 TD74BC230P/F/FW Octal Bus Butter/Inverting and Non-lnvertlng/3-state DIP20/SOP20/SOL20

SSOP20-P-225A

Contextual Info: 7-2 Package SOP 14PIN 150mil BODY OUTLINE DRAW IN G (SOI14-P-150) 16 9 W eight : 0.13g(TYP.) 88 U nit in mm SO P 20PIN (300mil B O D Y ) OU TLIN E D R A W IN G (SOL20-P-300) U nit in mm 7^45' it W eight 0.46g (TYP.) 89 SO P 14PIN (200mil B O D Y ) O U TLIN E D R A W IN G (SOP14-P-300)

Common collector 8 bit darlington

Abstract: TB62705AF 16-Bit sipo Shift Register 8ch FET driver SOP18 TD62M8601 DIP18 darlington buffer array push-pull driver led constant current driver 500mA 8ch driver SOP18
Contextual Info: A4 Type No. Function Output Output No. of Clamp Output Voltage Current Circuite V (*A) Diode Input RasMor (O) Recommended System Power Supply Package TD62591AP Single transistor array (emitter common) 8 50 200 Not provided Free DIP 18 TD62592AP Single transistor array (emitter common)

74BC645

Abstract: 74bc244 BC242 bc540 BC541 BC244 bc574 BC240 bc564 BC241
Contextual Info: Bi-CMOS Logic TD74ABT/TD74BC Series Toshiba Bi-CMOS Logic TD74ABT / TD74BC Series Outline , High-speed bus systems based on today s advanced CPUs require more than just standard logic. In particular, the bus interfaces of such systems demand very high-performance devices. To meet these needs, Toshiba

SOL20 package

Abstract: sol 20 Package thermal simulation of IC package EL1501 dremel
Contextual Info: Measuring the Thermal Resistance of Power Surface-Mount Packages by B Harvey 8 Modern miniature IC packages have allowed great space savings in products but frustrate the designer by concentrating the heat generated by circuits into smaller volumes Increasing IC

SOL20 package

Abstract: sol 20 Package AN1091 EL1501
Contextual Info: Measuring the Thermal Resistance of Power Surface-Mount Packages Application Note March 23, 1998 AN1091 Author: B. Harvey Modern miniature IC packages have allowed great space savings in products, but frustrate the designer by concentrating the heat generated by circuits into smaller

compliance matrix

Abstract: datadelay
Contextual Info: Data Delay Devices, Inc 3 Mount Prospect Ave Clifton, NJ 07013 Tel: 973-773-2299 Fax: 973-773-9672 www.datadelay.com Monolithic RoHS-Compliance Matrix as of 3/7/2013 SMD Package ID Series Z D R S SOIC8 SOIC14 SOIC16 SOL16 3D3215 0901 Y 3D3220 Y Y 3D3225

SOL28 package

Abstract: SOL20 sol-20 SOL20 package sol 20 Package SOL-24 sol28 SOL-28 SO20 Package SOL package
Contextual Info: Plastic Packages for Integrated Circuits Small Outline Package Family SO A D h X 45° (N/2)+1 N A PIN #1 I.D. MARK E1 E c SEE DETAIL “X” 1 (N/2) B L1 0.010 M C A B e H C A2 GAUGE PLANE SEATING PLANE A1 0.004 C 0.010 M C A B L b 0.010 4° ±4° DETAIL X

Contextual Info: BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

SOL28 package

Abstract: SO20 SO24 SOL-24 SOL-28 sol 20 Package SOL-20 SOL20 package
Contextual Info: Plastic Packages for Integrated Circuits Small Outline Package Family SO A D h X 45° (N/2)+1 N A PIN #1 I.D. MARK E1 E c SEE DETAIL “X” 1 (N/2) B L1 0.010 M C A B e H C A2 GAUGE PLANE SEATING PLANE A1 0.004 C 0.010 M C A B L b 0.010 4° ±4° DETAIL X

TOSHIBA CR2032

Abstract: ali m1489 c86 sot23 74F03 RN7 SOT23 74f06d RC0805 M1487 ali m5042 TIL311
Contextual Info: Am486PCI_21_BOM.xls Am486 Microprocessor PCI Customer Development Board Revised: Friday, December 18, 1998 Revision: 2.1A C Advanced Micro Devices, Inc. (800) 222-9323 5204 E. Ben White Blvd. Austin, TX 78741 AMD Proprietary/All Rights Reserved Bill Of Materials

TB62006P

Abstract: TB62003 TB62003F TB62003FW TB62003P TB62004F TB62004FW TB62004P TB62006F TB62006FW
Contextual Info: TB62003,004,006～009P/F/FW TOSHIBA Bi−CMOS INTEGRATED CIRCUIT SILICON MONOLITHIC TB62008FW,TB62009P,TB62009F,TB62009FW 8CH DMOS TRANSISTOR ARRAY WITH GATE

sprague DIP

Abstract: sprague catalog resistors
Contextual Info: Hi i'.vt SPRAGUE CUSTOM DESIGN NETWORKS • Custom Design Networks 4 - ,v o •4PV CUSTOM DESIGN NETWORKS £ * Features — • High-Performance • Design Flexibility • All Package Configurations Available • Lead-Times Comparable to Standard Networks

74LS541 equivalent

Abstract: 74LS541 N74LS541N
Contextual Info: Signetics I 74LS540, 74LS541 Buffers/Drivers Octal B uffer/Line Driver 3-State Product Specification Logic Products TYPICAL PROPAGATION DELAY TYPE TYPICAL SUPPLY CURRENT (TOTAL) 74LS540 9ns 22mA 74LS541 10ns 23mA ORDERING CODE FUNCTION TABLE PACKAGES mlI

sol18 package

Abstract: MS-012AA Package PLCC-44 SMD SOL18 64 CERAMIC LEADLESS CHIP CARRIER LCC MS 013AA sol 20 Package PLCC-20 SOL-18
Contextual Info: APPLICATIONS INFORMATION SURFACE-MOUNT IC PACKAGES Significant benefits can be achieved through the use of surfacemounted devices SMDs and general surface-mount technology as it applies to all components, both active and passive. The major benefits are reduced size and weight, and improved system reliability through

sol18 package

Abstract: PLCC-44 SMD SOL 18 package SOL18 ELECTRICAL WIRING SOL-28 64 CERAMIC LEADLESS CHIP CARRIER LCC SOL-24B MS 013AA sol 20 Package
Contextual Info: SURFACE-MOUNT IC PACKAGES APPLICATIONS INFORMATION SURFACE-MOUNT IC PACKAGES Significant benefits can be achieved through the use of surfacemounted devices SMDs and general surface-mount technology as it applies to all components, both active and passive. The major benefits

EL7154

Abstract: EL7154CN EL7154CNZ EL7154CS EL7154CS-T13 EL7154CS-T7 EL7154CSZ EL7154CSZ-T13 EL7154CSZ-T7 7154cs
Contextual Info: EL7154 FN7278.2 High Speed, Monolithic Pin Driver The EL7154 three-state pin driver is particularly well suited for ATE and level shifting applications. The 4A peak drive 1 EL7154 Ordering Information PART NUMBER PART MARKING TAPE AND REEL PKG. DWG. # PACKAGE

Contextual Info: HtGH PERFO RMANCE Ä Ö 8 INTEGRATED CIRCUITS Measuring the Thermal Resistance o f Power Surface-Mount Packages Measuring the Thermal Resistance of Power Surface-Mount Packages by B. Harvey M odern m iniature IC packages have allow ed great space savings in products, but frustrate the designer

rma 291

Abstract: Solder paste RMA-291 SOL-28 SOL28 package
Contextual Info: before wave soldering Rosin mildly activated RMA flux or organic flux is needed Wave soldering using a dual wave system at 250 C g 10 C for a maximum of two seconds per wave is preferable Thorough cleaning of boards after soldering is required Soldering Packages to PC Boards

Contextual Info: SURFACE MOUNT CLOCK OSCILLATORS PLETRONICS INC 42E » SM I 100 SERIES 755GS7M OOQODST S * P L E DESCRIPTION: SPECIFICATIONS: These new plastic-molded, surface mountable crystalcontrolled clock oscillators are available in two different lead configurations:

EIA-481-2-A

Abstract: sol18 package SOL18 EIA-481-2A Allegro Packing tape SOL28 package Allegro Packing Tape Dimensions allegro date code Allegro Packing Tape Dimensions SO-8 PLCC44J
Contextual Info: Publication 26010* GENERAL INFORMATION Tape and Reel of Surface-Mount Components for Automatic Handling by Robert Couture Introduction Electrical specifications Allegro MicroSystems, Inc., makes selected surfacemount parts available in an embossed carrier tape component delivery system for use with automatic handling

74S244N

Abstract: LOGIC 74LS244 signetics 74LS244 74LS244 LOGIC OF 74LS244 74LS244 function 74LS244D 74LS244 pin configuration 74LS244 PIN CONFIGURATION AND SPECIFICATIONS
Contextual Info: 74LS244, S244 Signetics Buffers Octal Buffers 3-State Product Specification Logic Products TYPICAL PROPAGATION DELAY TYPE TYPICAL SUPPLY CURRENT (TOTAL) 74LS244 12ns 25mA 74S244 6ns 112mA FUNCTION TABLE OUTPUTS INPUTS OEa L L H u OEb lb Ya Yb L H X L L H

ttl buffer 74LS245

Abstract: 74ls245 74LS245PC function table of 74LS245 buffer 74LS245 TTL 74ls245 1N3064 1N916 74LS LS245
Contextual Info: Signetìcs 74LS245 Transceiver Octal Transceiver 3-State Product Specification Logic Products FEATURES • Octal bidirectional bus interface • 3-State buffer outputs • PNP inputs for reduced loading • Hysteresis on all Data inputs TYPE TYPICAL PROPAGATION