SOP20 Search Results

1414f

Abstract: QFP144-P-2626B QFP44-P-1414F RTC Real Time Clocks TC8521AM TC8512BY MC68B45
Contextual Info: Microcomputer Peripheral Controller LSI RTC Real Time Clocks Group Name Parts Name Function Summary Package TC8521AP DIP18-P-300A TC8521AM SOP20-P-300 RTC-2A Real Time Clock for Micro Computer. Hour, minutes, second, month, day, day of the week and year count with leap year operation. 4-bit I/O CPU Direct.

Contextual Info: Reliability Tests Report Product Name: TC74LCX244F Package Name: SOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC74ACT640F Package Name: SOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC74HCT688AF Package Name: SOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC74HCT573AF Package Name: SOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC74ACT521F Package Name: SOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC74HC7240AF Package Name: SOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC74HC240AF Package Name: SOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC74ACT273F Package Name: SOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC74VHC240F Package Name: SOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC74HC7244AF Package Name: SOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC74LCX540F Package Name: SOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC74HCT273AF Package Name: SOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC74HCT373AF Package Name: SOP20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Wuxi

Abstract: YD2025D YD2025
Contextual Info: YD2025D YOUDA INTEGRATED CIRCUIT 1.3W STEREO AUDIO AMPLIFIER——YD2025D DESCRIPTION The YD2025D is a monolithic integrated audio Amplifier in a SOP20. It is designed for portable cassette players and radios. FEATURES *Working voltage down to 3V; *Few external components;

20P2N-A

Abstract: 20P2N SOP20 Package
Contextual Info: 20P2N-A Plastic 20pin 300mil SOP EIAJ Package Code SOP20-P-300-1.27 JEDEC Code – Weight g 0.26 Lead Material Cu Alloy e 11 E Recommended Mount Pad 1 Symbol F 10 A D A2 A1 b y L e L1 HE e1 I2 20 b2 A A1 A2 b c D E e HE L L1 y c Detail F b2 e1 I2 Dimension in Millimeters

sop20

Abstract: Notice
Contextual Info: SOP20 LSI Assembly Units : mm • SOP20 12.5±0.2 11 1 10 1.8±0.1 0.11 0.3Min. 7.8±0.3 5.4±0.2 20 0.4±0.1 1.27 ∗ The contents described herein are subject to change without notice. 0.15±0.1 0.1

TFA 1001

Abstract: PQFP80 QFC44 P-QFP80 W018
Contextual Info: TOSHIBA / / t y ' r - v -K Î / - R /NÇ- V' P-DIP16-300-2.54A, P-SOP16-300-1.27 P-DIP20-300-2.54A, P-SOP20-300-1.27 P-SDIP28-400-1.78, P-SOP28-450-1.27 . 9- 3 P-SDIP30-400-1.78, P-SDIP42-600-1.78

TDA8844

Abstract: TDA8842 NE555 PHILIPS ic TDA8842 KA7500 lmc556 ICM555 LM358 UTC il1458 79xx voltage regulator
Contextual Info: INTEGRAL KOEA pn mfr case IL1085 IK-Semi TO-220/252/263 IL1084 IK-Semi TO-220/252/263 IL1083 IK-Semi TO-220/252/263 IL9270N IK-Semi DIP18 IL91350A IK-Semi DIP20/SOP20 IL6083B IK-Semi DIP8 IL6270 IK-Semi DIP8 IL91531N IK-Semi DIP16 IL9151-3 IK-Semi DIP16 IL91260C

0935L

Abstract: SOP20 Package PRSP0020DC-A PSOP-20 75x1 046b1
Contextual Info: JEITA Package Code P-SOP20-7.5x12.8-1.27 RENESAS Code PRSP0020DC-A *1 Previous Code FP-20DBV D MASS[Typ.] 0.52g F 20 NOTE 1. DIMENSIONS"*1 Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. 11 HE c *2 E bp Index mark Terminal cross section

SOP20 Package

Contextual Info: Small Outline Package 20pin SOP20 パッケージ エンボス方式テーピング寸法 EL テープ形状および寸法 単位 : mm 12.0 ±0.1 φ1.5 +0.1 –0 4.0 ±0.1 Y 1.75 ±0.1 2.0 ±0.1 0.3 ±0.1 X X’ 13.2 ±0.1 φ2.0 ±0.2 24.0 ±0.3 11.5 ±0.1

SOP20 Package

Abstract: SOP20
Contextual Info: Small Outline Package 20pin SOP20 パッケージ 外形図 パッケージ形状および寸法 0.43 +0.07 –0.04 1.27 0 ～10゜ 0.8 ±0.2 0.25 M 13.3 max 0.1 参考パッド寸法 A部拡大図 A 0.1 +0.1 –0.05 1.5 ±0.2 12.8 ±0.2 1.9 max 0.685 typ.

Contextual Info: SOP20 LSI Assembly Units : mm • SOP20 12.5 11 1 10 7.8 5.4 20 H=2.01Max. The contents described herein are subject to change without notice. Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any

SOP20 Package

Abstract: sop20
Contextual Info: PACKAGE DIMENSIONS SOP20 12.7±0.3 ~ 10° 0.5 5.4±0.2 7.8±0.4 11 20 10 1 +0.1 -0.05 1.8 ±0.15 0.15 +0.1 - 0.05 0.78MAX 0.05 0.15 1.27 0.4±0.1 0.12 M UNIT : mm