SN63PB37 SOLDER WIRE 245 Search Results

24-7068-1407

Abstract: 24-6337-8817 GR-63-CORE Zone 4 test 2460400010 24-6337-0027 K100LD sn62pb36ag2
Contextual Info: 2013 RECOMMENDED Electronics Assembly Materials Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information 3-7 8-11 12-13 14-15 16 17 18 19 | 800 253 7837 | WWW.kester.com

sn63pb37 solder wire

Abstract: SN63PB37 ROSIN FLUX TYPE ROL0 kester Sn63pB37 sn63pb37 solder wire flux 232
Contextual Info: 2011RECOMMENDED RECOMMENDED 2012 ElectronicsAssembly Assembly Materials Materials Electronics Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information

bellcore GR-78

Abstract: sn63pb37 solder wire sn63pb37 solder wire shelf life kester 245 solder wire GR-78 sn63pb37 Sn62Pb36Ag02 ROSIN FLUX TYPE ROL0 245 Rosin Flux Cored Solder Kester 245
Contextual Info: 245 No-Clean Cored W ire Product Description Reliability Properties Kester 245 No-clean Cored Wire was developed to complement low residue liquid fluxes being used by the electronics industry. The chemistry is based on some of the same principles that have

kester 245 solder wire

Abstract: bellcore GR-78 kester 245 sn63pb37 solder wire ROSIN FLUX TYPE ROL0 GR-78 sn63pb37 solder wire shelf life J-STD-004 Kester IPC-TM650
Contextual Info: 245 No-Clean Cored W ire Product Description Reliability Properties Kester 245 No-clean Cored Wire was developed to complement low residue liquid fluxes being used by the electronics industry. The chemistry is based on some of the same principles that have

SN63PB37

Contextual Info: 2009 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 EnviroMark™ 828 Application No-Clean Stencil Printing Water-Soluble Stencil Printing Alloys Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Product

GR-78-CORE

Abstract: ROSIN FLUX TYPE ROL0 sn63pb37 Sn62Pb36Ag2 J-STD-006A RF771 bellcore GR-78 sn63pb37 solder wire 959T TC-527
Contextual Info: 2010 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 Application EnviroMark™ 828 No-Clean Stencil Printing Water-Soluble Stencil Printing Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Designed to exceed customers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with

Sn62Pb36Ag02

Abstract: 959T kester 245 solder wire bellcore GR-78 Kester 275 sn63pb37 solder wire shelf life GR-78 IPC-TM-650 IPC-TM650 j-std-004
Contextual Info: 275 No-Clean Cored W ire For Lead-bearing and Lead-free alloys Product Description Reliability Properties Kester 275 No-Clean Flux for cored solder wire was developed to provide superior wetting performance for hand soldering in the electronics industry. The chemistry is based on some of the

J-STD-004

Abstract: Kester 275 Sn62Pb36Ag02 Sn63pB37 J-STD-004 solder wire sn63pb37 solder wire IPC-TM650 952-D6 Kester Sn63
Contextual Info: 275 No-Clean Cored W ire For Lead-bearing and Lead-free alloys Product Description Reliability Properties Kester 275 No-Clean Flux for cored solder wire was developed to provide superior wetting performance for hand soldering in the electronics industry. The chemistry is based on some of the

J-STD-004 solder wire rom1

Abstract: kester 285 solder wire J-STD-004 Kester Kester* 1544 kester 245 solder wire kester Sn62Pb36Ag02 Sn62Pb36Ag02 IPC-TM-650 IPC-TM650
Contextual Info: 48 Activated Rosin Cored W ire For Lead-bearing and Lead-free alloys Product Description Reliability Properties Kester 48 Activated Rosin Flux for cored solder wire was developed for lead-free applications to enable soldering of most common metals. Kester

Contextual Info: 275 No-Clean Cored W ire For Lead-bearing and Lead-free alloys Product Description Reliability Properties Kester 275 No-Clean Flux for cored solder wire was developed to provide superior wetting performance for hand soldering in the electronics industry. The chemistry is based on some of the

IPC-7525

Abstract: jedec package MO-220 MO-229 footprint MO-229 MO-226 MLP06J JEDEC Drawing MO-220 7mm IPC-9701 MLP32A Thin Quad flat package mo-220
Contextual Info: Fairchild Semiconductor Application Note September 2005 Revised September 2005 PCB Land Pattern Design and Surface Mount Guidelines for MLP Packages Introduction MLP Package Construction Overview The current miniaturization trend towards higher performance in

sn63pb37 solder SPHERES

Abstract: J-STD-020 SAC305 JEDEC J-STD-020d.1 Altera Flip Chip BGA warpage reflow profile SAC305 bga ALTERA AN81 sn63pb37 solder wire sn63pb37 solder wire shelf life pcb warpage in ipc standard J-STD-020D
Contextual Info: SMT Board Assembly Process Recommendations AN-353-4.0 Application Note This application note describes the board assembly process used in surface-mount technology SMT and focuses on the SMT component-to-board reflow soldering process and rework soldering if you are removing or replacing individual

S-311-P-822

Abstract: 311P822-MC-110-AS-D 311P822-FC-110-AS-D 311P822-FC-110-AG-D 311P822-MC-110-AG-D 311P822-FC-110-BS-D 311P822-FC-110-AS-D4 311P822MC 311P822-MK-05 EIA-364-87
Contextual Info: REVISIONS SYMBOL DESCRIPTION DATE Released Revised per RN A-149 -A APPROVAL 11/13/07 8/22/08 Source Control Drawing SHEET REVISION STATUS SH 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 REV A A A A A A A A A A A A A A A A A A A A SH 21 22 23 24 25 26

NASA-STD-8739

Abstract: MIL-W-16878/6 type ET SKT 24/02 MICRO-D 37S, 9P, M24308 EIA-364-87 Hysol 4215 Micro-D connectors SAE-AMS-QQ-P-416 mil-m-24519 GLCP-30F Hysol C9-4215
Contextual Info: Series 89 Nanominiature Connectors MIL-DTL-32139 Qualified Connectors for Mission-Critical Board-to-Wire Applications United States  United Kingdom  Germany  France  Nordic  Italy  Spain  Japan Series 89 Nanominiature Product Selection Guide

JEDEC SMT reflow profile

Abstract: AM-6000 S4 2A JEP113-B S4 1C J-STD-020A pcb warpage in ipc standard sn63pb37 solder wire shelf life steam trap S4 4C
Contextual Info: Soldering and Rework of the HDSM-40xx Series, HDSM-50xx Series Patented Surface Mount Seven Segment-Displays Application Note 1240 Contents • Introduction to the Surface Mount Seven Segment Display • Tape and Reel Packing • Moisture Barrier Bag • JEDEC Moisture Level Characterization

MLP-2216

Abstract: MLP-2230 MLP-2205 MLP-2030 MLP-2015 MLP-2233 mlp-2005 beta mlp-2205 MLP-2033 MLP-2212
Contextual Info: A Subsidiary of Data Device Corporation 40 Orville Drive, Bohemia, NY 11716-2529 Phone: 631 244-7393; Fax: (631) 244-8893 Web site: www.bttc-beta.com MLP-2000 SERIES MINIATURE LOW-PROFILE 0.185" MAXIMUM HEIGHT MIL-STD-1553 SMT TRANSFORMERS FEATURES • N

DSS-3330

Abstract: DSS-3305 DSS-3333 DSS-3000 beta TRANSFORMER IPC-9503 DSS-3315 dss3305 DSS-3312 JESD22-A121
Contextual Info: DSS-3000 SERIES A Subsidiary of Data Device Corporation 40 Orville Drive, Bohemia, NY 11716-2529 Phone: 631 244-7393; Fax: (631) 244-8893 Web site: www.bttc-beta.com DUAL SIDE-BY-SIDE MIL-STD-1553 SMT TRANSFORMERS FEATURES 0.351 Sq. In. Footprint 0.185" Max. Height

Contextual Info: Series 89 Nanominiature Connectors Two Row Thru Hole Right Angle Printed Circuit Board 891-008 and -009 Right Angle Mount PCB Nano Connectors feature gold alloy NanoPin contacts. These nanomimiature connectors offer premium performance and reliability for demanding

sn63pb37 solder wire 245

Contextual Info: Series 89 Nanominiature Connectors Two Row Right Angle Surface Mount 891-012 and -013 Right Angle Surface Mount PCB Nano Connectors feature gold alloy NanoPin contacts. These nanomimiature connectors offer premium performance and reliability for demanding applications. Available

Contextual Info: Double Row Connectors 891-008 and -009 Series 89 Nanominiature Connectors Double Row Thru Hole Right Angle Printed Circuit Board Right Angle Mount PCB Nano Connectors feature gold alloy TwistPin contacts. These nanomimiature connectors offer premium performance and reliability for demanding applications. Available with

Contextual Info: H ig h-Perfor m a n c e s eri es 8 9 Nanominiature Connectors for interconnect applications APRIL 2013 Series 89 nano miniature High density nanominiature Mil qualified and innovative Glenair circular and rectangular solutions N ow available from Glenair: Nanominiature circular and retangular connectors. The

skt 450

Contextual Info: Double Row Connectors 891-012 and -013 Series 89 Nanominiature Connectors Double Row Right Angle Surface Mount Right Angle Surface Mount PCB Nano Connectors feature gold alloy TwistPin contacts. These nanomimiature connectors offer premium performance and reliability for

MS5534AM

Abstract: DA5534 ic PRESSURE SENSOR FP4401 CAP tantal SMD "Pressure Sensor" digital output SENT protocol C6502 metal sensor interfacing with microcontroller silicon-gel-sensor MS5534
Contextual Info: MS5534A BAROMETER MODULE ♦ ♦ ♦ ♦ Integrated pressure sensor Pressure range 300-1100 mbar 15 Bit ADC 6 coefficients for a software compensation stored on-chip ♦ 3-wire serial interface ♦ 1 system clock line 32.768 kHz ♦ Low voltage / low power

Contextual Info: Double Row Connectors 891-008 and -009 Series 89 Nanominiature Connectors Double Row Thru Hole Right Angle Printed Circuit Board Right Angle Mount PCB Nano Connectors feature gold alloy TwistPin contacts. These nanomimiature connectors offer premium performance and reliability for demanding applications. Available with