MLP06J Search Results

IPC-7525

Abstract: jedec package MO-220 MO-229 footprint MO-229 MO-226 MLP06J JEDEC Drawing MO-220 7mm IPC-9701 MLP32A Thin Quad flat package mo-220
Contextual Info: Fairchild Semiconductor Application Note September 2005 Revised September 2005 PCB Land Pattern Design and Surface Mount Guidelines for MLP Packages Introduction MLP Package Construction Overview The current miniaturization trend towards higher performance in

FDMA3023PZ

Abstract: Bi-Directional P-Channel
Contextual Info: FDMA3023PZ tm Dual P-Channel PowerTrench MOSFET -30 V, -2.9 A, 90 mΩ Features General Description This device is designed specifically as a single package solution for the battery charge switch in cellular handset and other ultra-portable applications. It features two independent

Contextual Info: FDMA3023PZ Dual P-Channel PowerTrench MOSFET -30 V, -2.9 A, 90 mΩ Features tm General Description This device is designed specifically as a single package solution for the battery charge switch in cellular handset and other ultra-portable applications. It features two independent