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    IPC-7525

    Abstract: jedec package MO-220 MO-229 footprint MO-229 MO-226 MLP06J JEDEC Drawing MO-220 7mm IPC-9701 MLP32A Thin Quad flat package mo-220
    Contextual Info: Fairchild Semiconductor Application Note September 2005 Revised September 2005 PCB Land Pattern Design and Surface Mount Guidelines for MLP Packages Introduction MLP Package Construction Overview The current miniaturization trend towards higher performance in


    Original     		an-5067ipc-7525jedec package mo-220mo-229 footprint+7mo-229mo-226mlp06jjedec drawing mo-220 7mmipc-9701mlp32athin quad flat package mo-220 PDF