SGS-THOMSON RF TRANSISTORS Search Results
SGS-THOMSON RF TRANSISTORS Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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LXMSJZNCMH-225 | Murata Manufacturing Co Ltd | Ultra small RAIN RFID chip tag | |||
LXMS21NCMH-230 | Murata Manufacturing Co Ltd | Ultra small RAIN RFID chip tag | |||
LBAA0QB1SJ-295 | Murata Manufacturing Co Ltd | SX1262 MODULE WITH OPEN MCU | |||
GRM-KIT-OVER100-DE-D | Murata Manufacturing Co Ltd | 0805-1210 over100uF Cap Kit | |||
LBUA5QJ2AB-828 | Murata Manufacturing Co Ltd | QORVO UWB MODULE |
SGS-THOMSON RF TRANSISTORS Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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Contextual Info: ¿57 SGS-THOMSON Rf¡lD E[3 i[LiOT[3(s iD(Ei 2N5883/2N5885 2N5884/2N5886 COMPLEMENTARY SILICON HIGH POWER TRANSISTORS . 2N5884, 2N5885 AND 2N5886 ARE SGS-THOMSON PREFERRED SALESTYPES DESCRIPTION The 2N5885 and 2N5886 are silicon epitaxial-base NPN power transistor in Jedec |
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2N5883/2N5885 2N5884/2N5886 2N5884, 2N5885 2N5886 2N5885 2N5886 2N5883 2N5884 2N5883/2N5884/2N5885/2N5886 | |
Contextual Info: SGS-THOMSON sUICT»M SS TSD2922 RF & MICROWAVE TRANSISTORS HF/VHF/UHF N-CHANNEL MOSFETS PRODUCT DEVELOPMENT DATA SHEET This data sheet contains the design criteria and target specifications for a product which is currently under development by SGS-THOMSON. The design criteria and specifications of this item could change prior to |
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TSD2922 TSD2922 | |
TSD2903
Abstract: TSD2902 25x2mA
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TSD2902 TSD2902 TSD2903 25x2mA | |
Contextual Info: SGS-THOMSON S i. M iM TSD2922 iy RF & MICROWAVE TRANSISTORS HF/VHF/UHF N-CHANNEL MOSFETS PRODUCT DEVELOPMENT DATA SHEET This data sheet contains the design criteria and target specifications for a product which is currently under development by SGS-THOMSON. The design criteria and specifications of this item could change prior to |
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TSD2922 TSD2922 | |
TSD2921Contextual Info: rz T SGS-THOMSON ^ 7# HD »iLECÊ¥ Q !D(gI TSD2921 RF & MICROWAVE TRANSISTORS HF/VHF/UHF N-CHANNEL MOSFETS PRODUCT DEVELOPMENT DATA SHEET This data sheet contains the design criteria and target specitications tor a product which is currently under development by SGS-THOMSON. The design criteria and specitications ot this item could change prior to |
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TSD2921 TSD2921 | |
Contextual Info: 5 7 . SGS-THOMSON AM80912-030 m RF & MICROWAVE TRANSISTORS SPECIALITY AVIONICS/JTIDS APPLICATIONS REFRACTORY/GOLD METALLIZATION EMITTER SITE BALLASTED 15:1 VSWR CAPABILITY LOW RF THERMAL RESISTANCE INPUT/OUTPUT MATCHING OVERLAY GEOMETRY METAL/CERAMIC HERMETIC PACKAGE |
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AM80912-030 AM80912-030 J133102E 00bS043 | |
Contextual Info: / T T SGS-THOMSON ^ 7#• noM & E gM K S STM901-30 RF POWER MODULE LINEAR BASE STATION APPLICATIONS PRODUCT DEVELOPMENT DATA SHEET This data sheet contains the design criteria and target specifications for a product which is currently under development by SGS-THOMSON. The design criteria and specifications of this item could change prior to |
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STM901-30 STM901 | |
Contextual Info: rs 7 SGS-THOMSON ^ 7 / M g[li]mi TO[M(gg_ SD8250 RF & MICROWAVE TRANSISTORS AVIONICS APPLICATIONS . REFRACTORY/GOLD METALLIZATION . EMITTER SITE BALLASTED . 5:1 VSWR CAPABILITY @ 1.75 dB RF OVERDRIVE . LOW THERMAL RESISTANCE . INPUT/OUTPUT MATCHING |
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SD8250 STAN250A SD8250 7T2T237 | |
ic 7475Contextual Info: {Z ^ T SGS-THOMSON # . « @ [iL [iC T s M @ Ì_ S D 8 2 5 0 RF & MICROWAVE TRANSISTORS _ AVIONICS APPLICATIONS 7 • REFRACTORY/GOLD METALLIZATION . EMITTER SITE BALLASTED ■ 5:1 VSWR CAPABILITY @ 1.75 dB RF OVERDRIVE |
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SD8250 ic 7475 | |
Contextual Info: SGS-THOMSON ittJÈTMDigl MSC81035MP RF & MICROWAVE TRANSISTORS AVIONICS APPLICATIONS . REFRACTORY/GOLD METALLIZATION . EMITTER SITE BALLASTED . oo:1 VSWR CAPABILITY i LOW THERMAL RESISTANCE . INPUT MATCHING . OVERLAY GEOMETRY . METAL/CERAMIC HERMETIC PACKAGE |
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MSC81035MP 81035MP MSC81035MP MSC1035MP. | |
Dow Corning DC 11 compound
Abstract: TSTM901-30 D865 M12-022
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TSTM901 Dow Corning DC 11 compound TSTM901-30 D865 M12-022 | |
Contextual Info: SGS-THOMSON A T /. [¡¡» ilLlM M nigt_ MSC81400M RF & MICROWAVE TRANSISTORS AVIONICS APPLICATIONS . > . . . REFRACT0RYV30LD METALLIZATION RUGGEDIZED VSWR 25:1 INTERNAL INPUT/OUTPUT MATCHING LOW THERMAL RESISTANCE METAL/CERAMIC HERMETIC PACKAGE |
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MSC81400M REFRACT0RYV30LD MSC81400M | |
SD2904
Abstract: SD2921 SD2922 SD4013 M113 SD2900 SD2902 SD2903
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SD2900 SD2902 SD2903 SD4013 SD1470 SD1463 AM80610-030 SD2904 SD2921 SD2922 SD4013 M113 SD2900 SD2902 SD2903 | |
RF power transistors cross reference
Abstract: SD1470 M176 SD2903 uhf transistors
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SD2900 SD2902 SD2903 SD2904 SD2921 SD2922 SD4013 SD1470 SD1463 AM80610-030 RF power transistors cross reference M176 uhf transistors | |
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Contextual Info: /= 7 SGS-THOMSON * 7 # . IMígia@HlL[l TO@iDigl_ AM82731-025 RF & MICROWAVE TRANSISTORS _ _ S-BAND RADAR APPLICATIONS I LOW PARASITIC, DOUBLE LEVEL MET AL DESIGN » REFRACTORY/GOLD METALLIZATION . EM ITTER SITE BALLASTED • |
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AM82731-025 AM82731 | |
Contextual Info: rZ J SGS-THOMSON ^ 7 / [«»[lUglgTOMntgl_MSC81002 RF & MICROWAVE TRANSISTORS GENERAL PURPOSE AMPLIFIER APPLICATIONS . EMITTER BALLASTED . VSWR CAPABILITY oo:1 @ RATED CONDITIONS . HERMETIC ST RIP AC PACKAGE . Pout = 2.0 W MIN. WITH 10 dB GAIN @ |
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MSC81002 MSC810 MSC81002 C127317 | |
Contextual Info: C 7 SGS-THOMSON * 7 # . noæ iLl©Tf*Ri]0 gl MSC81450M RF & MICROWAVE TRANSISTORS AVIONICS APPLICATIONS . > • ■ . > REFRACTORY\GOLD METALLIZATION RUGGEDIZED VSWR 25:1 INTERNAL INPUT/OUTPUT MATCHING LOW THERMAL RESISTANCE METAL/CERAMIC HERMETIC PACKAGE |
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MSC81450M MSC81450M | |
TRANSISTOR 5DWContextual Info: SGS-THOMSON IU A M 0 9 1 2 -3 0 0 RF & MICROWAVE TRANSISTORS AVIONICS APPLICATIONS . • . . . . . . . REFRACTORY/GOLD METALLIZATION EMITTER SITE BALLASTED 15:1 VSWR CAPABILITY LOW THERMAL RESISTANCE INPUT/OUTPUT MATCHING OVERLAY GEOMETRY METAUCERAMIC HERMETIC PACKAGE |
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AM0912-300 C125519 J1350G6F r-4050 TRANSISTOR 5DW | |
Contextual Info: SGS-THOMSON AM80610-018 RF & MICROWAVE TRANSISTORS UHF COMMUNICATIONS APPLICATIONS REFRACTORY/GOLD METALLIZATION EMITTER SITE BALLASTED LOW THERMAL RESISTANCE INPUT/OUTPUT MATCHING OVERLAY GEOMETRY METAL/CERAMIC HERMETIC PACKAGE P o u t = 18 W MIN. WITH 8.6 dB GAIN |
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AM80610-018 AM80610-018 AM80610-Q18 | |
Contextual Info: SGS-THOMSON AM82731-050 1H[ RF & MICROWAVE TRANSISTORS S-BAND RADAR APPLICATIONS REFRACTORY/GOLD METALLIZATION EMITTER SITE BALLASTED RUGGEDIZED VSWR 3:1 @ 1 dB OVER DRIVE LOW THERMAL RESISTANCE INPUT/OUTPUT MATCHING OVERLAY GEOMETRY METAL/CERAMIC HERMETIC PACKAGE |
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AM82731-050 AM82731-050 | |
Contextual Info: / = T SGS-THOMSON _ SD1135 RF & MICROWAVE TRANSISTORS _ UHF MOBILE APPLICATIONS • . ■ . ■ 470 MHz 12.5 VOLTS EFFICIENCY 60% COMMON EMITTER P out = 5.0 W MIN. WITH 8.5 dB GAIN -> ' f î > .280 2L STU D M122 epoxy sealed |
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SD1135 SD1135 | |
BFR92
Abstract: BFR92A P1 BFR92A b41 Marking BFR92A Transistor BFR92 transistor
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BFR92 BFR92A BFR92A OT-23 SC06960 BFR92/BFR92A OT-23 BFR92A P1 b41 Marking BFR92A Transistor BFR92 transistor | |
Contextual Info: /=T SGS THOMSON ^ 7 / . H lMlLi gTMa>M(g§_ AM1011-400 RF & MICROWAVE TRANSISTORS L-BAND AVIONICS APPLICATIONS . REFRACTORY/GOLD METALLIZATION • EMITTER SITE BALLASTED a 15:1 VSWR CAPABILITY • LOW THERMAL RESISTANCE . INPUT/OUTPUT MATCHING . OVERLAY GEOMETRY |
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AM1011-400 AM1011-400 J135066F | |
Contextual Info: SGS-THOMSON MSC82001 lELC RF & MICROWAVE TRANSISTORS GENERAL PURPOSE AMPLIFIER APPLICATIONS EMITTER BALLASTED REFRACTORYyGOLD METALLIZATION VSWR CAPABILITY oo ;1 @ RATED CONDITIONS HERMETIC ST RIP AC PACKAGE P out = 1.0 W MIN. WITH 7 .0 dB GAIN @ 2 .0 GHz |
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MSC82001 MSC82001 J13502 |