RELIABILITY TEST METHODS FOR PACKAGED DEVICES Search Results

NEC Ga FET marking L

Abstract: tamagawa gaas fet marking B mmic amplifier marking code N5 NE272 FET marking code .N5 ne29200 NE23383B NE292 gaas fet marking a
Contextual Info: GET-30749, Revision C NEC NEC Corporation Tamagawa Plant 1753,Shimonumabe, Nakahara-lcu, Kawasaki, Kanagawa, 211-8666 Specification Control Drawing o f Grade L GaAs Devices fo r Satellite Applications Prepared on: September 28,2000 Prepared by: Masahito Kushima

post burn-in

Abstract: AN007 Reliability Test Methods for Packaged Devices
Contextual Info: Application Note AN-007 Nitronex Device Burn-in Introduction Packaged Device Burn-In Procedure Nitronex performs 100% burn-in of packaged devices to remove most of the shift of VT and IMAX over the device’s lifetime. Due to the difficultly of consistently

electrolytic ELITE

Contextual Info: QUALITY ASSURANCE and RELIABILITY PROGRAM 1. Introduction Samsung utilizes rigorous qualification and reliability programs to monitor the integrity of its devices. All industry stan­ dard {and various non-standard} stresses are run. Testing is done not only to collect data, but also to detect trends

JEDEC J-STD-020C

Abstract: JESD47 Reliability Test Methods for Packaged Devices Infineon moisture sensitive package JESD-47 JESD22-A120 AMD reflow soldering profile BGA J-STD-035 semiconductors cross reference ipc-sm-786A
Contextual Info: IPC/JEDEC J-STD-020C July 2004 Supersedes IPC/JEDEC J-STD-020B July 2002 JOINT INDUSTRY STANDARD Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices Notice IPC and JEDEC Standards and Publications are designed to serve the public

GA1A1S100WP

Abstract: GA1A1S100 eiaj-c3 ga1a
Contextual Info: ED-07G020 ay 25,2007 H E R E S OPTO-ANALOG DEVICES DIVISION ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION f DEVICE SPECIFICATION FOR OPIC LIGHTDETECTOR MODEL No. GA1A1S100WP Specified for Enclosed please find copies of the Specifications which consists of 17 pages including cover.

Contextual Info: Known Good Die: The Challenge of the Technology M ark Lippold and Sherburne Bridges National Semiconductor, Inc. South Portland, M aine Abstract The challenges of supplying high yield, high quality, cost effective Known Good Die KGD are discussed in detail. A review of the history behind die supply processing and technology drivers provide insight into the

maxim CODE TOP MARKING

Abstract: Pb95Sn5 maxim TOP MARKING garrou wafer-level packaging has arrived Maxim ic date code ANALOG DEVICES ASSEMBLY DATE CODE philip IC marking Maxim date code DS2431 dALLAS MARKING CODE maxim assembly of code
Contextual Info: Maxim > App Notes > 1-Wire Devices General Engineering Topics Keywords: flip, chip, scale, wafer, level, package, packages, packaging, wlp, ucsp, fchip, wlcsp, pb free, rohs, topmark, bump, die Apr 18, 2007 APPLICATION NOTE 4002 Understanding Flip-Chip and Chip-Scale Package Technologies and

3SF11

Abstract: CA95323 E64380
Contextual Info: SHARP OPTO-ELECTRONIC DEVICES DIVISION ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION f DEVICE SPECIFICATION FOR PHOTOTRIAC COUPLER MODEL No. 3SF11 Business dealing name o PC3SF11NTZBF PC3SF11YTZBF Specified for Enclosed please find copies of the Specifications which consists of 14 pages including cover.

HCC242

Abstract: JAN2N2907A
Contextual Info: @ OPTEK High-Reliability Devices High-reliability requirements demand that products be able to function under abnormally severe levels of mechanical, environmental, and electrical stress. This challenge has been met by Optek with prod­ uct designs and process control techniques that ensure high reliability and, thus, long life.

Contextual Info: SHARP OPTO-ELECTRONIC DEVICES DIVISION ELECTRO N IC COM PONENTS GROUP SHARP CORPORATION SPECIFICATION D EV ICE SPECIFICATION FO R PHOTOCOUPLER M O D EL No. PC815 Business dealing name PC815XJ0000F PC815XYJ000F Specified for Enclosed please find copies o f the Specifications which consists o f 14 pages including cover.

schematic WELDER

Abstract: gold melting furnace ultrasonic bond
Contextual Info: Bonding and Handling Procedures for Chip Devices DISCUSSION Chip diode devices for use in integrated circuit and hybrid integrated circuits have proliferated in the last few years. Today's circuit designer is faced with a multiplicity of alter­ natives in the selection of diodes and packaging with each

Contextual Info: PR33MA11NTZF PR33MA11NTZF IT rms ≤0.3A, Non-Zero Cross type DIP 6pin SSD •Description ■Agency approvals/Compliance PR33MA11NTZF Solid State Device (SSD) are an integration of an infrared emitting diode (IRED), a Phototriac Detector. These devices are ideally suited for controlling high

Contextual Info: PR33MA11NTZF PR33MA11NTZF IT rms ≤0.3A, Non-Zero Cross type DIP 6pin SSR •Description ■Agency approvals/Compliance PR33MA11NTZF Solid State Relays (SSR) are an integration of an infrared emitting diode (IRED), a Phototriac Detector. These devices are ideally suited for controlling high

eiaj-c3

Abstract: GA1A1S201WP ED-06G070
Contextual Info: SPEC. No. ED-06G070 ISSUE October 12,2006 SHARP OPTO-ANALOG DEVICES DIVISION ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION “ DEVICE SPECIFICATION FOR OPIC LIGHT DETECTOR MODEL No. GA1A1S201WP Specified for Enclosed please find copies of the Specifications which consists of 14 pages including cover.

MIL-STD-883 Method 2010

Contextual Info: DICE PRODUCTS INTRODUCTION Linear Technology Corporation LTC offers a wide variety of precision linear ICs in die form. It is our intent to offer dice electrically tested to levels which can be expected to yield the best possible performance in hybrid circuits.

MIL-STD-883 Method 2010

Contextual Info: DICE PRODUCTS INTRODUCTION Linear Technology Corporation LTC offers a wide variety of precision linear ICs in die form. It is our intent to offer dice electrically tested to levels which can be expected to yield the best possible performance in hybrid circuits.

MIL-STD-883 Method 2010

Contextual Info: DICE PRODUCTS INTRODUCTION Linear Technology Corporation LTC offers a wide variety of precision linear ICs in die form. It is our intent to offer dice electrically tested to levels which can be expected to yield the best possible performance in hybrid circuits.

PC123Y82FZ0F

Abstract: PC123Y92FZ0F PC123Y12FZ0F PC123Y22FZ0F pc123y22 PC123Y82 PC123Y52FZ0F pc123y52 PC123 VDE PC123 pin out
Contextual Info: I S H A R P I' jfU. SPEC. No. ED-04P126A p. ’:U ; .‘ '>>' J'V/ ^ " fP JSSUE -November24,200| OPTO-ELECTRONTC DEVICES DIVISION ELECTR O N IC CO M PO N EN TS GROUP SH A RP CORPORATION SPECIFICATION DEV ICE SPECIFICATION FO R PHOTOCOUPLER M O D EL No. PC123

PC123 VDE

Abstract: PC123X PC123X2YFZ0F High operating temp Photocoupler PC123XNYFZ0F PC123X2YF20F PC123 pin out PC123X9 PC123X1YFZ0F PC 123 photocoupler
Contextual Info: SHARP OPTO-ELECTRONIC DEVICES DIVISION ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION DEVICE SPECIFICATION FOR PHOTOCOUPLER MODEL No. PC 123 Business dealing name PC123XNNFZ0F PC123XNYFZ0F PC123X1NFZ0F PC123X1YFZ0F PC123X2NFZ0F PCI 23X2YFZOF PC123X5NFZ0F

Contextual Info: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK Standard & Custom Products, DC to 110 GHz! Analog, Digital & Mixed-Signal ICs, Modules, Subsystems & Instrumentation

Contextual Info: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK Space Qualified Processes, People & Facilities! Analog, Digital & Mixed-Signal ICs, Modules, Subsystems & Instrumentation

Reflow

Abstract: JEDEC J-STD-020d.1 JEP-140 JEP140 J-STD-035 JESD22-B112 JEDEC J-STD-020d JESD47 JESD22-B108 IPC-020d-5-1
Contextual Info: IPC/JEDEC J-STD-020D.1 March 2008 Supersedes IPC/JEDEC J-STD-020D August 2007 JOINT INDUSTRY STANDARD Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices Notice IPC and JEDEC Standards and Publications are designed to serve the public

Moisture Sensitivity Level Rating

Abstract: JESD22-A113 moisture sensitive handling and packaging moisture sensitivity s2083 JEDEC J-STD-033 moisture handling and packaging S2080 J-STD-033
Contextual Info: Moisture Effects on the Soldering of Plastic Encapsulated Devices S2080 V4 Introduction Improper packaging, storage, and handling of plastic encapsulated devices PED’s can trap moisture within the devices and lead to damage during reflow soldering to printed circuit boards. As part of reliability qualification

b1415

Abstract: GAAS FET CROSS REFERENCE gaas fet 70 mil micro-X Package power fet 70 mil micro-X Package EPA240BV N5 micro-X Package EPA060B-70 MIXER EMA 0.5w ,GaAs FET EPA480C-SOT89
Contextual Info: RTC/5/01/PSINTRO EXCELICS SEMICONDUCTOR, INC. PRODUCT SELECTION GUIDE Products Excelics Semiconductor, Inc. was founded in 1995 to become a world wide leading merchant supplier of high performance R.F. and microwave semiconductor discrete devices and integrated circuits ICs