REFLOW Search Results

Contextual Info: 4. Solder-mounting Flat Package ICs 1. Soldering conditions a. Soldering iron Solder a t lead tem p eratu re of 2 6 0 t for no m ore than 10 seconds or a t 350°C fo r no m ore th a n 3 seconds. b. Infrared reflow 1 W e recom m end heating m ethods in far-interm ediate infrared shown a t the top and bottom of

TOSHIBA ADDC

Contextual Info: TL19W01-D T32 TOSHIBA LED lamps TL19W01-D(T32 ○ Surface-mount devices Unit: mm 3.1 (L mm x 3.8 (W) mm × 0.65 (H) mm size • High luminous flux LED : 110 lm(typ.) @ IF=300 mA • Color: white (6500K) • Reflow-soldering is available • Applications : general lighting and etc.

SMD 0402

Contextual Info: 2381 553 2.6/MLV0402E3.3T Vishay BCcomponents SMD 0402 Multilayer Varistor FEATURES • Surface mount multilayer surge suppressor  Inherent bidirectional clamping  Excellent energy/volume ratio  Suitable for reflow soldering  Compliant to RoHS directive 2002/95/EC

9940

Abstract: mal215099xxxe3 MAL215099 99101E3 99804E3 150631-2 99103E3 99515E3 99603E3 MAL215
Contextual Info: 150 CRZ www.vishay.com Vishay BCcomponents Aluminum Capacitors SMD Chip , Very Low Z FEATURES • Polarized aluminum electrolytic capacitors, non-solid electrolyte, self healing • SMD-version with base plate, lead (Pb)-free reflow solderable • Very low impedance, very high ripple current

Asp1251

Abstract: J-STD-020 SAC305 land pattern for WLCSP RCN310 ASPIC320 ism Transceiver SAC305 reflow system in package SAC305 reflow csp IPD filter IPDiA filter
Contextual Info: Manual Handling recommendation These capacitors are designed to be mounted with a standard pick and place machine, with reflow. In case of manual handling, please follow below recommendations: x Minimize mechanical pressure on the capacitors use of a vacuum nozzle is recommended .

DSE12*101

Contextual Info: Technical Data Sheet Chip LED with Right Angle Lens 12-21UBC/C430/TR8 Features ԦPackage in 8mm tape on 7ϛdiameter reel. ԦCompatible with automatic placement equipment. ԦCompatible with infrared and vapor phase reflow solder process. ԦMono-color type.!!

SOD523 footprint

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted, 2 leads package SOD523 2.15 1.4 0.5 0.6 2x (2×) 1.2 0.4 (2×) 0.5 (2×) solder land solder land plus solder paste solder paste deposit solder resist occupied area

HVQFN24

Abstract: HVQFN-24 sot616
Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN24 package SOT616-1 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout

marking code 8A

Abstract: marking WM EN6100-4
Contextual Info: LESHAN RADIO COMPANY, LTD. LGSMF05CT1G Thyristor Surge Protective Devices MECHANICAL CHARACTERISTICS Features z z z z z z z Molded JEDEC SOT-563 Package Weight 3 milligrams Availble in Lead-Free Nickel-Paladium-Gold Plating Solder Reflow Temperature: Nicker-Paladium-Gold

2D 1002

Abstract: RH 2D 1002 2D 1406 RN41 RN412E RN412
Contextual Info: 1733 Reader's Spreads pg1-203:document 1/27/09 4:08 PM Page 87 fixed metal film melf resistors EU features • • • • • Suitable for reflow and wave soldering Higher stability in short and long term tests Meets or exceeds IEC 60115-8, EIAJ RC-2132A

pms 1-7-7

Abstract: CCF1N8 CCF1N6.3 CCF1N10 CCF1N5 CCF1N4 CCF1N15 ccf1n7 CCF1N0.4 CCF1N0.5
Contextual Info: 1733 Reader's Spreads pg1-203:document 1/27/09 4:14 PM Page 175 CCF chip fuse EU features circuit protection • Surface mount fuse suitable for primary and secondary circuits • Ceramic case provides excellent mechanical strength • Suitable for flow and reflow soldering

M705-GRN360-MZ

Abstract: M705-GRN360 M705-GRN360-M-Z NC257 senju solder bar WLCSP stencil design
Contextual Info: AN11046 DSN0603-2 SOD962 soldering requirements Rev. 1 — 1 June 2012 Application note Document information Info Content Keywords DSN0603-2 (SOD962), 0201 package size, reflow soldering, surface mount, solder paste, solder mask opening, Printed-Circuit Board (PCB),

2N06L35

Abstract: 2N06L v5856 GS6010 PCB REV 3.5 IPD26N06S2L-35 2N06L3
Contextual Info: IPD26N06S2L-35 OptiMOS Power-Transistor Product Summary Features • N-channel Logic Level - Enhancement mode • Automotive AEC Q101 qualified V DS 55 V R DS on ,max (SMD version) 35 mΩ ID 30 A • MSL1 up to 260°C peak reflow • 175°C operating temperature

2n0404

Contextual Info: IPB80N04S2-04 IPP80N04S2-04, IPI80N04S2-04 OptiMOS Power-Transistor Product Summary Features • N-channel - Enhancement mode • Automotive AEC Q101 qualified V DS 40 V R DS on ,max (SMD version) 3.4 mΩ ID 80 A • MSL1 up to 260°C peak reflow • 175°C operating temperature

Contextual Info: VLMK310. Vishay Semiconductors Standard SMD LED PLCC-2 FEATURES • SMD LED with exceptional brightness • Luminous intensity categorized • Compatible with automatic placement equipment • EIA and ICE standard package • Compatible with IR reflow, vapor phase

NCB1206B102TR030F

Abstract: NCB1206B121TR090F 0201 land pattern NCB1206B601TR040F NCB0603R600TR NCB0402P600TR030F NCB0805A152TR
Contextual Info: Ferrite Chip Beads NCB Series FEATURES • RUGGED CONSTRUCTION IN STANDARD EIA SIZES • EFFECTIVE EM/RFI SUPPRESSION UP TO 1 Ghz • CURRENT RATINGS UP TO 5 AMPS STYLE 2 • 100% CLOSED MAGNETIC CIRCUIT, AVOIDS CROSSTALK • BOTH FLOW AND REFLOW SOLDERING APPLICABLE

NTCS0805E3.....T

Abstract: NTCS0805E4474JXT NTCS0805E3T
Contextual Info: 2381 615 1./NTCS0805E4. Vishay BCcomponents Surface Mount, NTC Thermistors FEATURES • TCR from 6 to 2 %/K even at high temperatures • Tolerance on B25/85 down to 1 % • AgPd terminations • Suitable for wave or reflow soldering • Old part number was 2322 615 1.

Contextual Info: Type FCP Surface Mount Film Capacitors Stable Stacked Metallized Film PPS Chips for Reflow Soldering The Type FCP’s combination of high capacitance density and excellent high frequency response makes it a great choice for wireless and instrumentation applications.

LTST-C930KRKT

Contextual Info: LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Features * Meet ROHS, Green Product. * Dome lens Chip LED. * Ultra bright AlInGaP Chip LED. * Package in 8mm tape on 7" diameter reels. * Compatible with automatic placement equipment. * Compatible with infrared and vapor phase reflow solder process.

MAL2140

Abstract: 99113E3 99111E3 MAL214099
Contextual Info: 140 CRH www.vishay.com Vishay BCcomponents Aluminum Capacitors SMD Chip , High Temperature FEATURES • Extended useful life for MAL214099.E3 parts to 6000 h at 125 °C • Parts for advanced high temperature reflow soldering according to JEDEC J-STD-020

OVSRRGBCC3

Abstract: smd rgb led
Contextual Info: Full-Color 1204 SMD 150° Viewing Angle OVSRRGBCC3 • • • • Full-color RGB Top-view or side-view mounting options Compatible with automatic placement equipment Compatible with infrared and vapor phase reflow solder process The OVSRRGBCC3 is a compact full-color (RGB) in a miniature surface mount package with a 150° viewing

smd diode code met

Abstract: VLMV3100
Contextual Info: VLMV3100 Vishay Semiconductors Bicolor SMD LED PLCC-3 FEATURES • SMD LED with exceptional brightness • Multicolored • Luminous intensity categorized • Compatible with automatic placement equipment • EIA and ICE standard package • Compatible with IR reflow, vapor phase

BZG03C18

Abstract: BZG03C24
Contextual Info: BZG03C-Series www.vishay.com Vishay Semiconductors Zener Diodes FEATURES • High reliability • Voltage range 10 V to 270 V • Fits onto 5 mm SMD footpads • Wave and reflow solderable • AEC-Q101 qualified • Compliant to RoHS Directive 2002/95/EC and in

Contextual Info: Technical Data Sheet Reverse Package Chip LED 24-21/BHC-AP1Q2/2A Features ․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow solder process. ․Mono-color type.