RA0RA10 Search Results

Contextual Info: S IE M E N S HYB39S16160CT-6/-7 16MBit Synchronous DRAM 1M x 16 M Bit S yn ch ro n o u s DRAM fo r High S peed G raph ics A p p lication s • High Performance: full page optional around for sequencial wrap -6 -7 Units fCKm ax @ CL=3 166 143 MHz tCK3 6 7

Contextual Info: IBM13T2649JC 2M x 64 S D R A M SO DIMM Features • 144 Pin emerging JEDEC Standard, 8 Byte Small Outline Dual-In-Iine Memory Module • 2Mx64 Synchronous DRAM SO DIMM • Performance: 10 CAS Latency J Units j 3 jfcK I Clock Frequency j 100 j MHz ! jtcK

Contextual Info: IBM13T2649NC 2M x 64 SDRAM SO DIMM Features • 144 Pin emerging JEDEC Standard, 8 Byte Small Outline Dual-In-Iine Memory Module • 2Mx64 Synchronous DRAM SO DIMM • Performance: 10 CAS Latency § Units 3 jfcK I Clock Frequency I 100 j MHz jtcK j Clock Cycle

Contextual Info: IB M 1 3 T 1 6 4 9 N C Preliminary 1M x 64 1 Bank SDRAM SO DIMM Features • 144 Pin emerging JEDEC Standard, 8 Byte Small Outline Dual-In-line Memory Module • 2Mx64 Synchronous DRAM SO DIMM • Performance: I 10 CAS Latency 3 ! 12 j Units ! 3 jfcK I Clock Frequency

Contextual Info: IBM13N8739CC 8M x 72 2 Bank Unbuffered SDRAM Module Features • 168 Pin Unbuffered 8 Byte Dual In-line Memory Module • 8Mx72 Synchronous DRAM DIMM • Performance: j 10 j Units! CAS Latency 3 ! fcK I Clock Frequency jtcK j Clock Cycle iUc j Clock Access Time j

Contextual Info: 0316409C 4M x 412/10, 3.3V, SR. 0316169C 1M x 1612/8, 3.3V, SR. 0316809C 2M x 812/9, 3.3V, SR. 4Mx4, 2Mx8, 1Mx16 16Mbit Enhanced Synchronous DRAM Preliminary Features • High Performance: CAS latency = 2 fCK Clock Frequency tCK2 Clock Cycle tAC2 Clock Access Time

Contextual Info: 0316409C 4M x 412/10, 3.3V, SR. 0316169C 1M x 1612/8, 3.3V, SR. 0316809C 2M x 812/9, 3.3V, SR. 4Mx4, 2Mx8, 1Mx16 16Mbit Enhanced Synchronous DRAM Preliminary Data Sheet Overview Features • High Performance: CAS latency = 2 • Programmable Burst Length: 1,2,4,8,full-page

031-6169

Contextual Info: I = = = ¥ = IB M 0 3 1 6 4 y 9 z IB M 0 3 1 6 8 y 9 z IB M 0 3 1 6 1 6 9 z - y=0,B z=C,P,D,Q Preliminary

Contextual Info: IBM0316409C IBM0316809C IBM0316169C 16Mb S ynchronous DRAM Features • High Performance: • Multiple Burst Read with Single Write Option -10 : -12 : CL=3 ; CL=3 Units ; MHz : fcK Clock Frequency : io o I 83 tcK Clock Cycle ; 10 Uc Clock Access Tim e Ì • Automatic and Controlled Precharge Command

Contextual Info: IBM0316409C IBM0316809C IBM0316169C IBM03164B9C Prelim inary 16M b S y n c h r o n o u s D R A M -D ie Revision E Features • M ultiple Burst Read w ith Single W rite O ption • High Perform ance: CL=3 : CL=2 / 3 ; CL=3 i: c. 3 • Units ; • A utom atic and C ontrolled Precharge C om m and

11-CQ2

Contextual Info: IBM13N4649JC IBM13N4739JC PRELIMINARY 4M X 64/72 2 Bank Unbuffered SDRAM Module Features • 168 Pin emerging JEDEC Standard, Unbuffered Byte Dual In-line Memory Module • 4Mx64/72 Synchronous DRAM DIMM • Performance: CAS Latency fcK Clock Frequency tcK

TEA 1020 sp

Abstract: M02S75 QD07
Contextual Info: @ LG Semicon. Co. LTD._ Description Features The GMM7408100BS/SG is an 8M x 40 bits D y n a m ic R A M M O D U L E w h ic h is assembled 20 pieces of 4M x 4 bit DRAMs in 24 26 pin SOJ package on both side the p rin te d c irc u it board w ith d e co u p lin g

Contextual Info: @ LG Semicon. Co. LTD Description Features The GMM7374200BNS/SG is a 4M x 36 bits Dynamic RAM MODULE w hich is assembled 9 pieces of 4M x 4bit DRAMs in 24 26 pin SOJ package on the printed circuit board w ith decoupling capacitors. The GM M 7374200BNS/SG is optim ized for

4715-01

Contextual Info: IBM13N1649NC IBM13N1809NC Preliminary 1M X 64/80 1 Bank Unbuffered SDRAM Module Features • • 168 Pin emerging JEDEC Standard, Unbuffered 8 Byte Dual In-line Memory Module 1Mx64/80 Synchronous DRAM DIMM • Performance: CAS Latency fcK tcK Uc Clock Frequency

DQ45-A

Abstract: 033J1
Contextual Info: IBM13N1649NC IBM13N1809NC 1M x 64/80 1 Bank Unbuffered SDRAM Module Features • 168-Pin JEDEC Standard, Unbuffered 8-Byte Dual In-Line Memory Module • 1Mx64/80 Synchronous DRAM DIMM • Performance: i. CAS Latency : fcK I Clock Frequency itcK i Clock Cycle

Buffered SDRAM DIMM

Abstract: MT18LSDT472 ZM09 16Mb SDRAM MICRON DIMM 1998 obsolete micron SDRAM
Contextual Info: OBSOLETE PRELIMINARY 4 MEG x 72 REGISTERED SDRAM DIMM MT18LSDT472 SYNCHRONOUS DRAM MODULE For the latest data sheet revisions, please refer to the Micron Web site: www.micron.com/mti/msp/html/datasheet.html FEATURES PIN ASSIGNMENT Front View 168-Pin DIMM

Contextual Info: HYB39S16160CT-6/-7 16MBit Synchronous DRAM 1M x 16 MBit Synchronous DRAM for High Speed Graphics Applications • High Performance: • full page optional for sequencial wrap around • Multiple Burst Read with Single Write Operation • Automatic Command

e24526

Abstract: IBM0316169C IBM0316809C
Contextual Info: IBM0316409C 4M x 412/10, 3.3V, SR. IBM0316169C 1M x 1612/8, 3.3V, SR. IBM0316809C 2M x 812/9, 3.3V, SR. IBM13Q4739CC 4M x 72 Registered SDRAM Module Features • 200-Pin JEDEC Standard, Buffered 8- Byte Dual In-line Memory Module • 4M x 72 Synchronous DRAM DIMM

E24526

Abstract: IBM0316169C IBM0316809C
Contextual Info: IBM0316409C 4M x 412/10, 3.3V, SR. IBM0316169C 1M x 1612/8, 3.3V, SR. IBM0316809C 2M x 812/9, 3.3V, SR. IBM13Q8739CC 8M x 72 Registered SDRAM Module Features • 200-Pin JEDEC Standard, Buffered 8-Byte Dual In-Line Memory Module • 8M x 72 Synchronous DRAM DIMM

Contextual Info: Discontinued 4/1/00 last order; 7/31/00 - last ship . IBM13T8644MPE 8M x 64 PC100 SDRAM SO DIMM Preliminary Features • 144 Pin JEDEC Standard, 8 Byte Small Outline Dual-In-line Memory Module • 8Mx64 Synchronous DRAM SO DIMM • Performance: PC100 -360

Contextual Info: MOSEL VITELIC V 4 3642 R 02V T G 3 .3 VO LT 2 M x 6 4 H IG H P E R F O R M A N C E U N B U F F E R E D D IM M S D R A M M O D U L E P R E L IM IN A R Y Features Description • 168 Pin JEDEC Standard, Unbuffered 8 Byte Dual In-line SDRAM Module ■ 2 banks 2M x 64 bit organization

Contextual Info: V58C3643204SAT HIGH PERFORMANCE 3.3 VOLT 2M X 32 DDR SDRAM 4 X 512K X 32 MOSEL VITELIC System Frequency fCK 45 50 55 60 250MHz 200 MHz 183 MHz 166 MHz 5 ns 5.5 ns 6 ns Clock Cycle Time (tCK3) Clock Cycle Time (tCK4) PRELIMINARY 4.5 ns Features Description

Contextual Info: IBM13T8644HC 8M x 64 SDRAM SO DIMM Features • 144 Pin emerging JEDEC Standard, 8 Byte Small Outline Dual-In-Iine Memory Module • 8Mx64 Synchronous DRAM SO DIMM • Performance: -10 CAS Latency j Units j 100 I MHz j 10 j ns j 8 j ns j 3 jf c K j Clock

39S16802AT-10

Abstract: Q67100-Q1279 marking t8 smd CAY Q67100-Q1323 Q67100-Q1327 Q67100-Q1333 Q67100-Q1335 P-TSOPII-44 BX-4T
Contextual Info: HYB39S1640x/80x/16xAT-8/-10 16MBit Synchronous DRAM 16 MBit Synchronous DRAM second generation Advanced Information • High Performance: CAS latency = 3 -8 -10 Units fCK 125 100 MHz tCK3 8 10 ns tAC3 7 8 ns • Multiple Burst Read with Single Write Operation