QFP PACKAGE WEIGHT Search Results

100P6S-A

Abstract: LQFP100-P-1414-0 LQFP128-P-1420-0 QFP100-P-1420-0 128P6Q-A
Contextual Info: Renesas microcomputers M16C / 62P Group Package Dimensions SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Package Dimensions MMP 100P6S-A EIAJ Package Code QFP100-P-1420-0.65 Plastic 100pin 14✕20mm body QFP Weight g 1.58 Lead Material Alloy 42 MD e JEDEC Code –

100P6S-A

Abstract: QFP100-P-1420-0
Contextual Info: Under development This document is under development and its contents are subject to change. M16C/6N5 Group Package Dimension Package Dimension 100P6S-A MMP EIAJ Package Code QFP100-P-1420-0.65 Plastic 100pin 14✕20mm body QFP Weight g 1.58 Lead Material

100P6S-A

Abstract: QFP100-P-1420-0
Contextual Info: Under development This document is under development and its contents are subject to change. M16C/6N4 Group Package Dimension Package Dimension 100P6S-A MMP EIAJ Package Code QFP100-P-1420-0.65 Plastic 100pin 14✕20mm body QFP Weight g 1.58 Lead Material

QFP64-P-1414-0

Abstract: SDIP64-P-750-1
Contextual Info: APPENDIX 3.6 Package outline 3.6 Package outline 64P6N-A Plastic 64pin 14✕14mm body QFP EIAJ Package Code QFP64-P-1414-0.80 Weight g 1.11 Lead Material Alloy 42 MD e JEDEC Code – HD 49 b2 64 ME D 1 48 I2 HE E Recommended Mount Pad Symbol A A1 A2 b c D

QFP64-P-1414-0

Abstract: SDIP64-P-750-1 3804 f
Contextual Info: APPENDIX 3.6 Package outline 3.6 Package outline 64P6N-A Plastic 64pin 14✕14mm body QFP EIAJ Package Code QFP64-P-1414-0.80 Weight g 1.11 Lead Material Alloy 42 MD e JEDEC Code – HD 64 b2 ME D 49 1 I2 48 Recommended Mount Pad HE E Symbol 33 16 A 32 L1

MO-235 FOOTPRINT

Abstract: die bond MO-235 SC-100 JEDEC 784-pin QFP PACKAGE thermal resistance LFPAK footprint mo204 ED-7311-15 fcBGA PACKAGE thermal resistance jc
Contextual Info: Products LQFP Low Profile Quad Flat Package High reliability, Standard Lead type Packages with rich line-ups • High pin-count, ideal for high-functionality, high-I/Ocount LSIs • Small size, allowing high-density mounting • Thin QFP LQFP with package mounting height of

SLLA229

Contextual Info: PCI1510 GGU/GVF PGE/ZGU/ZVF www.ti.com SLLA229 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • A 144-terminal low-profile QFP PGE , 144-terminal MicroStar BGA ball-grid array (GGU/ZGU) package, or a 209-terminal PBGA (GVF/ZVF) package

144-TERMINAL

Abstract: 82365SL PCI1510 PCI1510GGU PCI1510PGE PCI1510PGEG4 PCI1510ZGU TPS2211A
Contextual Info: PCI1510 GGU/GVF PGE/ZGU/ZVF www.ti.com SLLA229 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • A 144-terminal low-profile QFP PGE , 144-terminal MicroStar BGA ball-grid array (GGU/ZGU) package, or a 209-terminal PBGA (GVF/ZVF) package

315HZ

Abstract: Teac head Dolby NR LCT-7001 CXA2559Q CXA2560Q CXA2561Q F120 MTT150 A-bex TCC-130
Contextual Info: CXA2559Q Playback Equalizer Amplifier with Music Sensor Description The CXA2559Q is an IC designed for use in car stereo cassette decks. Functions include playback equalizer amplifier and music sensor into a single chip. Features • Few external parts • Small package 40-pin QFP

ghk diode

Abstract: 82365SL PCI1520 PCI1520GHK PCI1520I PCI1520IGHK PCI1520IPDV PCI1520IZHK INTEL PB-FREE
Contextual Info: PCI1520 PCI1520I GHK/ZHK/PDV www.ti.com SLLA233 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • • A 208-terminal low-profile QFP PDV or 209-terminal MicroStar BGA ball-grid array (GHK/ZHK) package 2.5-V core logic and 3.3-V I/O with universal

On ghk diode

Abstract: ghk diode 82365SL PCI1520 PCI1520GHK PCI1520I PCI1520IGHK PCI1520IPDV PCI1520IZHK
Contextual Info: PCI1520 PCI1520I GHK/ZHK/PDV www.ti.com SLLA233 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • • A 208-terminal low-profile QFP PDV or 209-terminal MicroStar BGA ball-grid array (GHK/ZHK) package 2.5-V core logic and 3.3-V I/O with universal

430TX

Abstract: 82365SL PCI1420 PCI1420GHK PCI1420PDV PCI1420PDVG4
Contextual Info: PCI1420 GHK/PDV www.ti.com SLLA228 – MONTH 2003 PC Card Controllers FEATURES • • • • • • • • • Fully compatible with the Intel 430TX Mobile Triton II chipset A 208-pin Low-Profile QFP (PDV), 209-terminal MicroStar BGA™ package (GHK), or the 209-terminal lead-free (Pb,

car ignition circuit diagram immobiliser

Abstract: HC11EA9 MC68HC916P1 68hc912b32 pinout HC11K4 HC11KA2 HC11KA4 HC11KW1 HC11P2 HC11A8
Contextual Info: Cover Customer E.M.U. Rev. 6 Page 1 Table of Contents World-wide Capability 3 Motorola Technical training 4 MCU Quick Reference Tables 5–15 Family Selector Guides 68HC05Bx 68HC05BDx/BSx 68HC05Cx 68HC05Dx 68HC05Ex 68HC05Fx 68HC05Gx/Hx 68HC05Jx 68HC05JP/JJx

35 x 35 PBGA, 580 100 balls

Abstract: of BGA Staggered Pins package BGA Ball Crack without underfill BGA PACKAGE thermal resistance 60um of BGA Staggered pins
Contextual Info: NEW PRODUCTS 7 LATEST TECHNOLOGICAL TRENDS IN VLSI PACKAGES AND DEVELOPMENT OF NEW PACKAGES Hisao Kasuga/Miwa Momma Introduction Consumers expect constant progress in electronic systems and record-breaking size reduction each time a new product is released. To kindle consumers’ interest,

TQFP100 footprint

Abstract: TQFP80 footprint SMD CODE databook HDIP TQFP 44 PACKAGE footprint diode databook package outline SMD Packages TQFP80 package LQFP32 LQFP48
Contextual Info: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is

LQFP32

Abstract: LQFP48 LQFP64 LQFP80 QFP100 QFP160 QFP52 SSOP16 SSOP20 TQFP64
Contextual Info: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when though-hole and surface mounted components are mixed on one printed-circuit board. However, wave

MSM5238

Abstract: LCD OKI 19 oki lcd driver QFP44-P-910-0 MSM5238GS-2K MSM5238GS-K MSM5238GS-L2 32-bit shift register
Contextual Info: E2B0027-27-Y2 ¡ Semiconductor MSM5238 ¡ Semiconductor This version: Nov. 1997 MSM5238 Previous version: Mar. 1996 32-DOT LCD COMMON DRIVER GENERAL DESCRIPTION The MSM5238 is a dot matrix LCD common driver LSI which is fabricated using low power CMOS metal gate technology. The scanning signal in one matrix display frame can be divided

MSM5839B

Abstract: DO20 DO40 MSM5238
Contextual Info: E2B0022-27-Y2 ¡ Semiconductor MSM5839B ¡ Semiconductor This version: MSM5839B Nov. 1997 Previous version: Mar. 1996 40-DOT SEGMENT DRIVER GENERAL DESCRIPTION The MSM5839B is a dot matrix LCD segment driver LSI which is fabricated using low power CMOS metal gate technology. This LSI consists of two 20-bit shift registers, two 20-bit latches,

Contextual Info: E2B0027-27-Y2 O K I Semiconductor MSM5238 This version: Nov. 1997 Previous version: Mar. 1996 32-DOT LCD COMMON DRIVER GENERAL DESCRIPTION The MSM5238 is a dot matrix LCD common driver LSI which is fabricated using low power CMOS metal gate technology. The scanning signal in one m atrix display frame can be divided

LQFP64. footprint

Abstract: dual infrared transistor TQFP80 footprint QFP package weight diode databook package outline SMD Packages TQFP100 footprint LQFP32 LQFP48 LQFP64
Contextual Info: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is

3 input or gates TTL

Abstract: cmos XOR Gates Nand gate Crystal Oscillator 4-input nand gates ttl XOR GATES "resistor set oscillator" dip TTL XOR Gates 5D208 cmos XOR schmitt trigger toggle nand
Contextual Info: HT3A CMOS Low Cost Gate Array General Features • • • • • • • • 5µm LOVAG CMOS technology Operating voltage: 2.0V~4.8V Input/Output CMOS compatible High noise immunity Six array bases cover the range from 212~890 gates Enhanced reliability

100P6S-A

Abstract: LQFP100-P-1414-0 LQFP144-P-2020-0 QFP100-P-1420-0 PAD108
Contextual Info: Package Dimensions M32C/83 Group Package Dimensions Recommended EIAJ Package Code LQFP144-P-2020-0.50 Plastic 144pin 20✕20mm body LQFP Weight g 1.23 JEDEC Code – Lead Material Cu Alloy MD e 144P6Q-A b2 D ME HD 144 109 1 l2 Recommended Mount Pad 108 36

HYBRID-IC

Abstract: ADVANCED COMMUNICATION DEVICES fully automated ic assembly Functional Modules / Hybrid ICs PANASONIC HYBRID IC
Contextual Info: Hybrid IC Custom Hybrid IC The miniaturization, light weight, thin, adjust free and high performance of your equipments will be achieved by our most advanced circuit design and high density assembling Hybrid IC technologies. Features As for various requests of Hybrid ICs, leave it the in our

MSM4069

Abstract: MSM5259 MSM5259GS-2K MSM5259GS-K MSM5259GS-L2 MSM6222B-01 MSM6222-xx
Contextual Info: Dear customers, About the change in the name such as "Oki Electric Industry Co. Ltd." and "OKI" in documents to OKI Semiconductor Co., Ltd. The semiconductor business of Oki Electric Industry Co., Ltd. was succeeded to OKI Semiconductor Co., Ltd. on October 1, 2008.