QFP PACKAGE THERMAL RESISTANCE Search Results

QFP PACKAGE thermal resistance

Abstract: 208-PIN
Contextual Info: QUAD FLAT L-LEADED PACKAGE 208 PIN PLASTIC FPT-208P-M04 208-pin plastic QFP Lead pitch 0.50mm Package width x package length 28 × 28mm Lead shape Gullwing Sealing method Plastic mold Thermal resistance Low thermal resistance type available FPT-208P-M04

FPT-240P-M03

Abstract: 32 QFP PACKAGE thermal resistance
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 240 PIN PLASTIC FPT-240P-M03 240-pin plastic QFP Lead pitch 0.50 mm Package width x package length 32 × 32 mm Lead shape Gullwing Sealing method Plastic mold Thermal resistance Low thermal resistance type

FPT-256P-M09

Abstract: QFP PACKAGE thermal resistance
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC FPT-256P-M09 256-pin plastic QFP Lead pitch 0.40 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold Thermal resistance Low thermal resistance type

304 QFP

Abstract: a 304
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 304 PIN PLASTIC FPT-304P-M02 304-pin plastic QFP Lead pitch 0.50 mm Package width x package length 40 × 40 mm Lead shape Gullwing Sealing method Plastic mold Thermal resistance Low thermal resistance type

QFP PACKAGE thermal resistance

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 160 PIN PLASTIC FPT-160P-M11 160-pin plastic QFP Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold Thermal resistance Low thermal resistance type

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC FPT-208P-M04 208-pin plastic QFP Lead pitch 0.50 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold Thermal resistance Low thermal resistance type

exposed QFP 144

Abstract: exposed QFP 128 TQFP-EP AN 7823 EP 603 QFP-EP 100L 144L JESD51-2 JESD51-7
Contextual Info: QFP-ep Exposed Pad Quad Flat Pack • 7 x 7mm to 24 x 24mm body sizes • 32 to 216 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 24 x 24mm STATS ChipPAC’s Exposed Pad Quad Flat Pack QFP-ep is a thermally enhanced version of the QFP package. Thermal

N1LG

Contextual Info: 80C186EA/80C188EA, 80L186EA/80L188EA PACKAGE INFORMATION This section describes the pins, pinouts, and thermal characteristics for the 80C186EA in the Plastic Leaded Chip Carrier PLCC package, Shrink Quad Rat Pack (SQFP), and Quad Flat Pack (QFP) pack­

Theta JB

Abstract: JC15-1 G30-88 G38-87
Contextual Info: Freescale Semiconductor, Inc. Thermal Measurement Report Freescale Semiconductor, Inc. Package Description: DATE: 5/8/96 revised 11/18/96 Package: 240 32 x 32 mm QFP Die Down Flag: 10.6 mm Square Leadframe: SIDN 1234625 Die Attach: JMI 2500AN Mold Compound: Sumitomo 7304LC

Theta-JC QFP die down

Abstract: G30-88 Theta-J G38-87 Theta JB
Contextual Info: Freescale Semiconductor, Inc. Thermal Measurement Report Freescale Semiconductor, Inc. Package Description: DATE: 5/8/96 revised 11/18/96 Package: 240 32 x 32 mm QFP Die Down Flag: 10.6 mm Square Leadframe: SIDN 1234625 Die Attach: JMI 2500AN Mold Compound: Sumitomo 7304LC

G30-88

Abstract: Theta JB QFP PACKAGE thermal resistance die down JC15-1 G-38-87 G38-87 Theta-J 32 QFP PACKAGE thermal resistance 2500AN QFP PACKAGE thermal resistance
Contextual Info: Thermal Measurement Report Package Description: DATE: 5/8/96 revised 11/18/96 Package: 240 32 x 32 mm QFP Die Down Flag: 10.6 mm Square Leadframe: SIDN 1234625 Die Attach: JMI 2500AN Mold Compound: Sumitomo 7304LC Assembled: ANAM Die: PST6 - 10.16 mm Square

MF202

Abstract: leadframe materials QFP PACKAGE thermal resistance POWER QFP MITSUBISHI INTEGRATED CIRCUIT PACKAGES
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5.2 HEAT DISSIPATION CHARACTERISTICS OF IC PACKAGE Figure 4 shows measured thermal resistance values of 16-pin plastic DIPs employing various lead-frame materials including 42 Alloy IronNickel alloy , phosphor bronze, #MF202 copper alloy, and copper-tin alloy. Except for the lead-frame material, all other factors were identical

QFP PACKAGE thermal resistance

Abstract: ic and equivalent
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5. PACKAGE THERMAL RESISTANCE 5.1 EQUIVALENT THERMAL CIRCUIT The power dissipation of many ICs is, on a par with that of small-signal transistors, extremely small so that with the exception of power ICs

lQFP256

Abstract: TEQFP208 QFP PACKAGE thermal resistance SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY BGA and QFP Package LQFP-256
Contextual Info: Technical Analysis Low-Cost Packaging Technology Using QFP Low-Cost Packaging Technology Using QFP The combination of bus bar technology and TEQFP technology is currently receiving attention in the development of a semiconductor package that realizes function

BGA and QFP Package mounting

Abstract: MCP Technology Trend EE13 jwg2 EE13 JWG SC47D tfBGA PACKAGE thermal resistance EIA and EIAJ standards Combo (Spindle VCM) Driver BGA and QFP Package EE-13
Contextual Info: PACKAGE TRENDS 1-1 Packaging Trends Needs of electronic equipment Optimized System Integration Performance • Multiple functions • High speed • High output Outline • Small • Thin • Light Assembly • Automation • Systematization • High density

Infrared Touch Control cooker

Abstract: HMCS404 HD4074224 hmcs42 HD404449 Series
Contextual Info: R e liab ility Test D a ta of M icro co m p u te r 1. Introduction M icrocomputers are required to provide higher reliability and quality with increasing functions for an enlarged scale for wide applications. To meet this demand, Hitachi is improving the quality by

Contextual Info: Reliability Test Data of Microcomputer 1. Introduction Microcomputers are required to provide higher reliability and quality with increasing functions for an enlarged scale for wide applications. To meet this demand, Hitachi is improving the quality by evaluating its reliability, building up quality in

QFP PACKAGE thermal resistance

Contextual Info: General Information Contents J a n u a ry 1998 Configuration Elements Data Sheet 729 Introduction. EEPROM Configuration SRAM Configuration Element. 731

max232 16 pin diagram with pin function

Abstract: MAX232 MAX232 pin diagram 9434 8 pin integrated circuit max232 specification max232 diagram MXL902 NSO package MAX232 all pin diagram MAX202, MAX232
Contextual Info: February 1996 RR-2B Surface-Mount Devices Reliability Report This report presents reliability data for Maxim’s surfacemount devices, including the results of extensive reliability stress tests performed solely on epoxy surface-mount packages since 1991.

100 PIN "PGA" ALTERA DIMENSION

Contextual Info: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.

altera ep610

Abstract: EPM5130 240 PIN QFP ALTERA DIMENSION epm7064s cross reference 192PGA EPF10K100 EPF10K20 EPF10K30 EPF10K40 EPF10K50
Contextual Info: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.

IC51-0804-394

Abstract: yamaichi IC51-0562-1387 IC51-0804-808 QFP PACKAGE thermal resistance tqfp 64 socket 32PIN TQFP TEXAS IC51-0644-807 IC51-0644-807 Datasheet TQFP 80 socket Yamaichi TQFP
Contextual Info: FIFO Surface-Mount Package Information First-In, First-Out Technology Tom Jackson and Mary Helmick Advanced System Logic – Semiconductor Group SSPA001A 1 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor

68HC11L6

Abstract: 68hc11ka4 68HC11PH8 68HC11a1 527 MOSFET TRANSISTOR motorola D65C 68HC05N4 nippon denso 68HC05B6 128 QFP 14x20
Contextual Info: CMRQS/D REV 10 MOTOROLA MICROCONTROLLER TECHNOLOGIES GROUP RELIABILITY AND QUALITY MONITOR REPORT Quarter 1, 1997 Semiconductor Product Sector Test results contained herein are for information only. This report does not alter MotorolaÕs standard warranty or product speciÞcations.

STATS ChipPAC

Abstract: AN 7823 EP 603 LQFP Package LQFP Package tray QFP JEDEC tray 64 leads qfp 32 QFP PACKAGE thermal resistance Techpoint
Contextual Info: QFP-SD Stacked Die Quad Flat Pack • Stacking of die enables more functionality and integration in a conventional QFP package FEATURES DESCRIPTION • Combining devices into one package reduces PCB real estate and cost STATS ChipPAC’s Stacked Die QFP offering includes LQFPSD, LQFP-ep-SD and TQFP-ep-SD. LQFP-SD is a stacked die