Theta-JC QFP die down
Abstract: G30-88 Theta-J G38-87 Theta JB
Contextual Info: Freescale Semiconductor, Inc. Thermal Measurement Report Freescale Semiconductor, Inc. Package Description: DATE: 5/8/96 revised 11/18/96 Package: 240 32 x 32 mm QFP Die Down Flag: 10.6 mm Square Leadframe: SIDN 1234625 Die Attach: JMI 2500AN Mold Compound: Sumitomo 7304LC
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2500an7304lcg38-87115x102+4theta-jc qfp die downg30-88theta-jtheta jb
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G30-88
Abstract: Theta JB QFP PACKAGE thermal resistance die down JC15-1 G-38-87 G38-87 Theta-J 32 QFP PACKAGE thermal resistance 2500AN QFP PACKAGE thermal resistance
Contextual Info: Thermal Measurement Report Package Description: DATE: 5/8/96 revised 11/18/96 Package: 240 32 x 32 mm QFP Die Down Flag: 10.6 mm Square Leadframe: SIDN 1234625 Die Attach: JMI 2500AN Mold Compound: Sumitomo 7304LC Assembled: ANAM Die: PST6 - 10.16 mm Square
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2500an7304lcg38-87115x102+10rxmn60rbdt20g30-88theta jbqfp package thermal resistance die downjc15-1g-38-87theta-j32 qfp package thermal resistanceqfp package thermal resistance
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Theta JB
Abstract: JC15-1 G30-88 G38-87
Contextual Info: Freescale Semiconductor, Inc. Thermal Measurement Report Freescale Semiconductor, Inc. Package Description: DATE: 5/8/96 revised 11/18/96 Package: 240 32 x 32 mm QFP Die Down Flag: 10.6 mm Square Leadframe: SIDN 1234625 Die Attach: JMI 2500AN Mold Compound: Sumitomo 7304LC
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2500an7304lcg38-87115x102+5rxmn60rbdt20theta jbjc15-1g30-88
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Eftec ra 308
Abstract: Ablebond 84-1LMISR4 JM2500 wafer fab control plan MICRON 64T
Contextual Info: Reliability Update Table of Contents Overview . 1 Organization of the Update . 1
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eftec ra 308ablebond 84-1lmisr4jm2500wafer fab control plan+1micron 64t
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N20X DIODE
Abstract: A35355 TA8923 ta8872 ta8903 TA8782 ta7833 transistor 123 TA7811 ta8825
Contextual Info: Reliability Update Table of Contents Overview . 1 Organization of the Update . 1
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100lpqfp160lpqfp28lsoicn20x diode+9a35355ta8923ta8872ta8903ta8782ta7833transistor 123ta7811ta8825
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