PS512 Search Results

Contextual Info: a WHITE /MICROELECTRONICS W PS512K32-XPJX 512Kx32 SRAM MODULE FEATURES • A c c e s s T i m e s o f 1 5 , 1 7 , 2 0, 2 5 n s ■ T TL C o m p a t i b l e In p u ts a n d C M O S O u tp u t s ■ P a c k a g in g ■ 5 V o l t P o w e r S u p p ly • 68 Lead, P la s tic PLCC, 2 5 . 1 5 m m 0 .9 9 0 inch sq u a re

OF IC 7905

Abstract: PS51277-A MA 7905 90 watt power supply circuit diagram
Contextual Info: PS51277-A Powerex, Inc., 200 E. Hillis Street, Youngwood, Pennsylvania 15697-1800 724 925-7272 Intellimod Module Dual-In-Line Intelligent Power Module 15 Amperes/600 Volts A N 1 2 3 DETAIL "B" M J C 4 5 6 7 8 9 10 11 12 13 14 15 HEATSINK SIDE 16 17 18 19 20 21

Contextual Info: I I I I I I I I I I I I I I I I I I ACT-PS512K8 High Speed 4 Megabit Plastic Monolithic SRAM Plastic Path Features • Low Power Monolithic CMOS 512K x 8 SRAM ■ Operating Temperature Range • Full Military -55°C to +125°C • Industrial (-40°C to +85°C)

ic 7905

Abstract: PS51259-A EIAJ-ED-4701 AC100V200V
Contextual Info: 三菱半導体〈インテリジェントパワーモジュール〉 PS51259-A トランスファーモールド形 絶縁形 PS51259-A 主回路構成及び定格 ¡単相AC入力, DC出力 IGBT/FWDコンバータ ブリッジ ¡600V20Arms（入力電流）

A2631

Contextual Info: DENSE-PAC M ie R O S ì S 16 Megabit High Speed CM OS SRAM D PS512X32C V3 i li M S D E S C R IP T IO N : The DP5512X32CV3 "VERSA-STACK" module is a revolutionarynew high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip Carriers SLCQ

PS51259-A

Abstract: OF IC 7905
Contextual Info: PS51259-A Powerex, Inc., 200 E. Hillis Street, Youngwood, Pennsylvania 15697-1800 724 925-7272 Intellimod Module Dual-In-Line Intelligent Power Module 20 Amperes/600 Volts A N 1 2 3 DETAIL "B" M J C 4 5 6 7 8 9 10 11 12 13 14 15 HEATSINK SIDE 16 17 18 19 20 21

Contextual Info: MITSUBISHI MITSUBISHI SEMICONDUCTOR SEMICONDUCTOR <Intelligent <Intelligent Power Power Module> Module> PS51259-A PS51259-A TRANSFER-MOLD TRANSFER-MOLD TYPE TYPE INSULATED INSULATED TYPE TYPE PS51259-A INTEGRATED POWER FUNCTIONS • Single phase AC input, DC output IGBT/FWD converter bridge

Contextual Info: DENSE-PAC 16 Megabit High Speed CMOS SRAM DPS51 2X 3 2 M KV3 MICROSYSTEMS PRELIMINARY DESCRIPTION: The D PS512X32M KV 3 "V ER SA -S TA C K " module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip

DPS512S8

Contextual Info: 4 Megabit CMOS SRAM D E N S E - P A C D PS512S8N M Ï C R O S Y S T EMS D ESCRIPTION: The PS512S8N is a M ilitary 512K X 8 high-density, low-power static RAM module comprised of four ceramic 128K X 8 monolithic SRAM's, an advanced high-speed CMOS decoder and decoupling capacitors

Contextual Info: MITSUBISHI MITSUBISHI SEMICONDUCTOR SEMICONDUCTOR <Intelligent <Intelligent Power Power Module> Module> PS51277-A PS51277-A TRANSFER-MOLD TRANSFER-MOLD TYPE TYPE INSULATED INSULATED TYPE TYPE PS51277-A INTEGRATED POWER FUNCTIONS • DC input, three-phase AC output inverter

Contextual Info: M/HITE /M ICRO ELECTRONICS 512Kx32 SRAM MODULE W PS512K32-XXC A D V A N C ED * FEATURES • Access Times of 17,20, 25, 35ns ■ Commercial Temperature Range ■ Packaging ■ TTL Compatible Inputs and Outputs • Module is manufactured with four 512Kx8 SRAM memory

ersa ms 8000

Contextual Info: □PM PS512X32V3 Dense-Pac Microsystems, Inc. ^ CERAMIC 512K X 32 C M O S SRAM VERSA-STACK PRELIMINARY D ESC R IP T IO N : The D PS512X32V 3 "V ERSA -STA CK" module is a re v o lu tio n a ry n ew m e m o ry su b sy ste m u sing Dense-Pac Microsystems' ceramic Stackable Leadless

Contextual Info: DENSE-PAC 4 Megabit High Speed C M O S SRAM PS512S8AP MICROSYSTEMS D ES C R IPTIO N : The D PS512S8AP is a high speed 512K x 8 h ig h -d ensity, lo w -p o w e r static RAM m odule comprised of four high speed ceramic 128K x 8 monolithic SRAM's, an advanced high-speed CMOS

Contextual Info: DENSE-PAC MICROSYSTEMS 8 Megabit High Speed CMOS SRAM D PS512X 16C n 3/D P S512X 16B n 3 DESCRIPTIO N : The D P S 5 12 X 16Cn3/PS512 X 16Bn3 High Speed SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac M icrosystems' ceram ic Stackable Leadless Chip Carriers SLCC .

Contextual Info: □PM Dense-Pac Microsystems, Inc. PS512S8AN HIGH SPEED MILITARY 512K X 8 C M O S SRAM M ODULE O ADVANCED INFORM ATION DESCRIPTION: The D PS512S8AN is a high speed military 512K X 8 high-density, low-power static RAM module comprised of four high speed ceramic 128K X 8 monolithic

PS51259-A

Abstract: AC100 EG01Y inverter single phase Airconditioner
Contextual Info: MITSUBISHI MITSUBISHI SEMICONDUCTOR SEMICONDUCTOR <Intelligent <Intelligent Power Power Module> Module> PS51259-A PS51259-A TRANSFER-MOLD TRANSFER-MOLD TYPE TYPE INSULATED INSULATED TYPE TYPE PS51259-A INTEGRATED POWER FUNCTIONS • Single phase AC input, DC output IGBT/FWD converter bridge

Contextual Info: □PM PS512X16A3 Dense-Pac Microsystems, Inc. CERAMIC 512KX 16 CMOS SRAM MODULE O PRELIMINARY D ESC R IP TIO N : The D PS512X16A3 "D EN SE-STA CK" module is a re v o lu tio n a ry n e w m e m o ry su b sy ste m using Dense-Pac Microsystems' ceramic Stackable Leadless

Contextual Info: DENSE-PAC M Ï C R O S Y S T 4 Megabit High Speed CM OS SRAM D PS512S8BN E M S D E SC R IP T IO N : The PS512S8BN is a high speed military 512K X 8 high-density, static RAM module comprised of four high speed ceramic 128KX 8 monolithic SRAM's, an advanced high-speed CMOS decoder and decoupling

12 volts 6 Ampere power supply

Abstract: PS51277-A 25N26
Contextual Info: PS51277-A Powerex, Inc., 200 E. Hillis Street, Youngwood, Pennsylvania 15697-1800 724 925-7272 Intellimod Module Dual-In-Line Intelligent Power Module 15 Amperes/600 Volts A N 1 2 3 DETAIL "B" M J C 4 5 6 7 8 9 10 11 12 13 14 15 HEATSINK SIDE 16 17 18 19 20 21

PS51277-A

Abstract: mitsubishi inverter air conditioning AC100 EG01Y
Contextual Info: MITSUBISHI MITSUBISHI SEMICONDUCTOR SEMICONDUCTOR <Intelligent <Intelligent Power Power Module> Module> PS51277-A PS51277-A TRANSFER-MOLD TRANSFER-MOLD TYPE TYPE INSULATED INSULATED TYPE TYPE PS51277-A INTEGRATED POWER FUNCTIONS • DC input, three-phase AC output inverter

32A18

Contextual Info: DENSE-PAC 16 Megabit C M O S SRAM D PS512X32M L/D PS512X32M W M I C R O S Y S T E M S P R ELIM IN A R Y DESCRIPTION: PIN-OUT DIAGRAM The PS512X32ML/PS512X32MW is a 512K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance computers and digital signal processing

Contextual Info: «ffí 1 £ 1993 □PM D P S 5 1 2 X 1 6 n 3 Dense-Pac Microsystems, Inc. Ceramic, S12Kx16 SRAM Stack Modules O D E S C R IP T IO N : The D PS512X16n3 SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight

Contextual Info: PS51259-A Powerex, Inc., 200 E. Hillis Street, Youngwood, Pennsylvania 15697-1800 724 925-7272 Intellimod Module Dual-In-Line Intelligent Power Module 20 Amperes/600 Volts A N 1 2 3 DETAIL "B" M J C 4 5 6 7 8 9 10 11 12 13 14 15 HEATSINK SIDE 16 17 18 19 20 21

Contextual Info: DENSE-PAC 4 Megabit High Speed C M O S SRAM D PS512S8A P M I C R O S Y S T E M S D E S C R IP T IO N : The PS512S8AP is a high speed 512K x 8 high-density, low-power static RAM module comprised of four high speed ceramic 128K x 8 monolithic SRAM's, an advanced high-speed CMOS