PIN DIODE CHIP Search Results

PIN Diode Basics

Abstract: PIN DIODE DRIVER CIRCUITS 2n2222 transistor pin b c e 2N2894A 2N2222 application note 2n2222 transistor datasheet depletion mode current limiter LATTICE 3000 SERIES Microwave PIN diode Switching diode 0.5
Contextual Info: APPLICATION NOTE PIN Diode Basics Introduction Basic Theory—Variable Resistance A PIN diode is essentially a variable resistor. To determine the value of this resistance, consider a volume comparable to a typical PIN diode chip, say 20 mil diameter and 2 mils thick. This chip has a

PIN diode SPICE model

Abstract: MSWSS-020-40 MSWSHB-020-30 Diodes D250 MSWSH 040-40 MMSPN050-53 MEST2G-080-25 MEST2G-050-80 MSWSH-020-24 MSWSHC-040-40
Contextual Info: Spice Models for Aeroflex / Metelics PIN Diode Switch Elements CHIP Robert Caverly Non-Linear Diode SPICE N=1 PIN Diode SPST & SPDT Switch Elements S Par's Is mA Iknee mA Repi Ohm s CJmod el Rlim Ω t nSec W um CJ50 pF Rs Ω PKG Series PIN Y Y 2.50E-07

Contextual Info: MSWS5T-1004 PIN DIODE SWITCH ELEMENT PIN #10 PIN #13 PIN #8 PIN #16 PIN #5 Plastic Molded 16L 3x3 QFN Package paddle electrical & thermal ground PIN #2 Description Features A SP5T switch in a plastic 16L 3x3 QFN package. Each port is Electrical Series / Shunt Diode and Thermal

Contextual Info: MSWS4T-1004 PIN DIODE SWITCH ELEMENT PIN #13 PIN #8 PIN #16 PIN #5 PIN #2 Plastic Molded 16L 3x3 QFN Package paddle electrical & thermal ground Description Features A SP4T switch in a plastic 16L 3x3 QFN package. Each port is Electrical Series / Shunt Diode and Thermal

PIN Diode chip

Contextual Info: Attenuator PIN Diode Chip ML47406-S-132 ML47406-S-132 Preliminary Specifications High Reliability Semiconductor Attenuator PIN Diode Chip Features • • • • • Package Outline Glass Passivation Thermocompression bondable Thermosonically bondable Gold metallisation

integrated circuits equivalents list

Abstract: digital phase shifters HPND-0002 hydrofluoric acid HPND0002 HSMP3810 5965-9143E eutectic
Contextual Info: HPND-0002 Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Data Sheet Description Features These PIN/NIP diode chips are specifically designed for hybrid applications requiring thermosonic or thermocompression bonding techniques. The top metallization

GC4600

Abstract: high power pin diode High Power PIN Diodes IR STUD diodes
Contextual Info: GC4600 – GC4605 CONTROL DEVICES High Power PIN Diodes TM RoHS Compliant KEY FEATURES The high power PIN diode series is available in surface mount stud and insulated stud packages. These PIN diode chips utilize high resistivity material and an intrinsic float zone process technology thus

Contextual Info: MSWS3T-1004 PIN DIODE SWITCH ELEMENT PIN #10 PIN #13 PIN #8 PIN #2 Plastic Molded 16L 3x3 QFN Package paddle electrical & thermal ground Description Features A SP3T switch in a plastic 16L 3x3 QFN package. Each port is Electrical Series / Shunt Diode and Thermal

hydrofluoric acid

Abstract: thermocompression HPND0001 HPND-0001 HPND-0002
Contextual Info: Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features Description • Thermocompression/ Thermosonically Bondable These PIN/NIP diode chips are specifically designed for hybrid applications requiring thermosonic or thermocompression

hp 3080 diode

Contextual Info: Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features Description • Thermocompression/ Thermosonically Bondable These PIN/NIP diode chips are specifically designed for hybrid applications requiring thermosonic or thermocompression

MA4BPS101

Abstract: MA4BPS301 PIN diode MACOM SPICE model MA4BPS201 Three bond 09CP
Contextual Info: PIN Diode Chips With Offset Bond Pads MA4BPS101, MA4BPS201, MA4BPS301 MA4BPS101, MA4BPS201, MA4BPS301 PIN Diode Chips with Offset Bond Pads Features • • • • • Chip Layout Bond Pads Removed From Active Junction Large Bond Pads Support Multiple Bond Wires

MADP-007224-01072T

Abstract: MADP-007224-01072
Contextual Info: MADP-007224-01072T Non Magnetic MELF PIN Diode Features Rectangular MELF SMQ Hermetically Sealed Low Loss Low Distortion High Isolation Passivated PIN Diode Chips Full Face Bonds Ultra Low Non-Magnetic Packages Suitable for MRI Applications • High Power Handling Capability

UM9701

Contextual Info: UM9701 PIN DIODE Low Resistance, Low Distortion, RF Switching Diode Features Description • • • • • • The UM9701 PIN diode was designed for low resistance at low forward bias current and low reverse bias capacitance. This unique Microsemi design

Contextual Info: PIN DIODE UM9301 COMMERCIAL ATTENUATOR DIODE Features • • • • Specified low distortion Low rectification properties at low reverse bias Resistance specified at 3 current points High reliability fused-in-glass construction Description The UM9301 PIN Diode utilizes a special

839 DIODE

Abstract: PIN PHOTO DIODE OPD0606 068mm DIODE 839
Contextual Info: Silicon PIN Photo Diode OPD0606 High Speed Sensitivity Common cathode type PIN Photo Diode 1. Structure unit : ㎛ 1.1 Chip Size : 0.68 X 0.68mm 1.2 Chip Thickness : 280±20um 1.3 Metallization : Top - Al, Bottom - Au 1.4 Passivation : Silicon Nitride 1.5 Bonding Pad Size

UNITRODE DIODE CROSS

Abstract: 7512 pin diodes UNITRODE CROSS IUM9301 UM9301
Contextual Info: PIN DIODE UM9301 SERIES COMMERCIAL ATTENUATOR DIODE Features • Specified low distortion • Low rectification properties at low reverse bias • Resistance specified at 3 current points • High reliability fused-in-glass construction Description The UM9301 PIN Diode utilizes a special

Microsemi LX3055

Abstract: photo diode 10 Gbps LX3055 1550nm photodiode 1.6 Ghz VCSEL 1550 nm 1 Gbps 1550nm VCSEL InGaAs Photodiode 1550nm PHOTO diode
Contextual Info: LX3055 TM Coplanar InGaAs/InP PIN Photo Diode P RODUCTION D ATA S HEET Microsemi’s InGaAs/InP PIN Photo Diode chips are ideal for high bandwidth 1310nm and 1550nm optical networking applications. The device series offer high responsivity, low dark current, and

TESLA DIODES

Abstract: PIN DIODE UMX5101 magnetic diode
Contextual Info: UMX5101 ULTRA LOW MAGNETIC MOMENT PIN DIODE FOR MRI APPLICATIONS RoHS COMPLIANT KEY FEATURES The UMX5101 PIN diode series was designed to provide ultra low magnetic PIN diodes for in bore surface coil applications associated with higher field strength 3T and greater MR

CLA4609-086LF

Abstract: CLA4609 pin diode limiter S1632
Contextual Info: DATA SHEET • CLA4609-086LF DIODE DATA SHEET CLA4609-086LF: Surface Mount Limiter Diode Applications Anode Pin 3 Anode (Pin 1) • Low loss, high power limiters  Receiver protectors Features  Low-thermal resistance: 40 °C/W Cathode (Pin 2, Exposed Paddle)

digital phase shifters

Abstract: 5082 5082-0012 bond wire gold F 5082 hydrofluoric acid eutectic ausn
Contextual Info: 5082-0012 PIN Diode Chip for Hybrid MIC Switches/Attenuators Data Sheet Description Features This PIN diode chip is silicon dioxide or nitride passivated. The 5082-0012 has a planar construction. The fabrication processes are optimized for long term reliability and tightly controlled for uniformity in

melf diode, square

Abstract: UHF diode
Contextual Info: jyfezsm MA4P1250 Square Outline Surface Mount PIN Diode Features •j “ '“ 0.010*70.25 mm 0.025*70.64 m m ■ NON-ROLLABLE MELF DESIGN ■ HERMETICALLY SEALED ■ LOW LOSS, LOW DISTORTION ■ PASSIVATED PIN DIODE CHIP ■ FULL FACE CHIP BOND ■ NON-MAGNETIC PACKAGE

Contextual Info: NJL6163R-1 HIGH SPEED PIN PHOTO DIODE GENERAL DESCRIPTION OUTLINE typ. Unit : mm The NJL6163R-1 are the PIN photo diode, Active area: 1.0 mm square NJL6163R which attain high speed (fc : 200MHz) and 1.0 1.16 1.8 0.5 It shrinks the outline by COBP(Chip on Board

Contextual Info: CERLED SMD Chip Detector SMD - Receiver PFD 10 Photo Pin Diode -H* *RohS-conform Description Real surface mount component with a FR4 chip base. The silicon Photo PIN Diode provides the positive side on the front and the negative side on the FR4 contact base.

BAQ806

Abstract: diode 1407 diode 104
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D168 BAQ806 AM PIN diode Product specification File under Discrete Semiconductors, SC10 1998 Aug 03 Philips Semiconductors Product specification AM PIN diode BAQ806 FEATURES DESCRIPTION • Glass passivated