PHOENIX 17 33 67 7 Search Results

Contextual Info: m WS512K32-XCJX M/HITE M IC R O E L E C T R O N IC S 512Kx32 SRAM MODULE PRELIMINARY* FEATURES • Access Times of 15,17, 20, 25ns Two pinout options ■ Packaging • Standard commercial pinout M aster W E • 68 Lead, JLCC (Package 701) • G2 p in o u t fo r upgrade path to m ilita ry grad e d ev ices

Contextual Info: Module no:2771146 LabelId:2771146 Operator:Phoenix 17:43:38, Donnerstag, 28. Juni 2001 UKKB 5 Terminal width 6.2 IEC 2 [mm ] IEC 947-7-1 rigid solid flexible stranded AWG 0.2-4 0.2-4 24-12 H CAIgL Description U [A] [V] 32 500 BV/LR/RMRS/NK Type Order No.

smd a17 power

Abstract: 94611 smd a7 transistor smd transistor a4 smd transistor A6 3 WS512K32-XXX top mark smd A9
Contextual Info: WS512K32-XXX 512Kx32 SRAM MODULE PRELIMINARY* FEATURES • Access Times of 70, 85, 100, 120nS ■ Packaging ■ Commercial, Industrial and Military Temperature Ranges ■ TTL Compatible Inputs and Outputs • 66-pin, PGA Type, 1.385 inch square, Hermetic Ceramic HIP Package 402 , SMD Number 5962-94611

WS512K32-XXX

Abstract: smd A018
Contextual Info: WS512K32-XXX 512Kx32 SRAM MODULE, SMD 5962-94611 PRELIMINARY* FEATURES • Access Times of 70, 85, 100, 120ns ■ Commercial, Industrial and Military Temperature Ranges ■ Packaging ■ TTL Compatible Inputs and Outputs • 66-pin, PGA Type, 1.185 inch square, Hermetic

A016 SMD

Abstract: Mark A12 SMD smd a7 transistor smd transistor A1 smd transistor a4 top mark smd A9
Contextual Info: WS128K32-XXX 128Kx32 SRAM MODULE FEATURES • Access Times of 70, 85, 100, 120nS ■ MIL-STD-883 Compliant Devices Available ■ Commercial, Industrial and Military Temperature Ranges ■ 5 Volt Power Supply ■ Low Power CMOS ■ Packaging • 66-pin, PGA Type, 1.075 inch square, Hermetic

Contextual Info: f i - YZÀ WS512K32B-XXXE WHITE / M I C R O E L E C T R O N I C S 512Kx32 SRAM MODULE ADVANCED* FEATURES • A ccess Tim es o f 1 5 ,1 7 , 20, 25ns ■ Low P ow er BiCMOS ■ ■ BiCM O S: • R a d ia tio n T o le ra n t w ith E p ita x ia l Layer Die Packaging

Contextual Info: V Z À I/VHITE /MICROELECTRONICS WPD8M72-XMDC 8Mx72 DRAM D IM M FEATURES GENERAL DESCRIPTION • The WPD8M72-XMDC is a 8M x 72 bit Dynamic RAM high density memory module. The module consists of thirty-six 4M x 4 bit DRAMs in 24-pin TSOP packages. The DRAMs are

Contextual Info: 512Kx32 3.3V SRAM MODULE ADVANCED* FEATURES • Commercial Temperature Range ■ Access Times of 15, 17, 20ns ■ Low Voltage Operation: ■ TTL Compatible Inputs and Outputs • 3.3V ± 1 0% Po w er Supply ■ Fully Static Operation: ■ Packaging • 68-lead, JLCC/PLCC, Package 701

Contextual Info: Module no:2774017 LabelId:2774017 Operator:Phoenix 17:43:56, Donnerstag, 28. Juni 2001 UKK 5 Terminal width 6.2 IEC 2 [mm ] IEC 947-7-1 rigid solid flexible stranded AWG 0.2-4 0.2-4 24-12 I U [A] [V] 32 500 H CAgE IL F Description Type Order No. Pcs. Pkt.

ct 5066

Abstract: 617 610 372 A ST 9727 semelec denso toyota
Contextual Info: [sO OPTOELECTHOWICS AUTHORIZED REPRESENTATIVES AND DISTRIBUTORS North American Technical Representatives ALABAMA Com Rep Madison Tel: 256-772-9982 Fax: 256-772-8693 CANADA Cont. Canadian Source Corp Kanata, Ontario Tel: 613-599-5882 Fax: 613-599-5886 INDIANA (Cont.)

smd g2U

Abstract: WF512K32N-XH1X5 WF512K32-XG1UX5 WF512K32-XG2UX5 WF512K32-XG4TX5 WF512K32-XXX5
Contextual Info: WF512K32-XXX5 HI-RELIABILITY PRODUCT 512Kx32 5V FLASH MODULE, SMD 5962-94612 FEATURES • Access Times of 60, 70, 90, 120, 150ns ■ Organized as 512Kx32 ■ Packaging ■ Commercial, Industrial and Military Temperature Ranges • 66 pin, PGA Type, 1.075" square, Hermetic

Contextual Info: WF512K32-XXX5 HI-RELIABILITY PRODUCT 512Kx32 5V FLASH MODULE, SMD 5962-94612 FEATURES • Access Times of 60, 70, 90, 120, 150ns ■ Organized as 512Kx32 ■ Packaging ■ Commercial, Industrial and Military Temperature Ranges • 66 pin, PGA Type, 1.075" square, Hermetic

Contextual Info: WF128K32-XXX5 128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES • Access Times of 50*, 60, 70, 90, 120, 150ns ■ Commercial, Industrial and Military Temperature Ranges ■ Packaging: • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP Package 400

SMKDSP 1.5/ 8-5.08

Abstract: smkdsp 17-33 phoenix contact 17 11 08 33
Contextual Info: Module no:1733415 LabelId:1733415 Operator:Phoenix 16:19:22, Donnerstag, 28. Juni 2001 SMKDSP 1,5 Angled connection of 35° with test connection Pitch 5.0 or 5.08 IEC rigid I U stranded AWG [A] [V] Connection data 0.14-2.5 0.14-1.5 26-14 22 250 2 [mm ] solid

I01b-1

Abstract: 01b SMD
Contextual Info: WHITE /M IC R O E L E C T R O N IC S Ç 2 W S512K32-XXX 512Kx32 SRAM MODULE. SMD 5962-94611 PRELIMINARY* FEATURES • A ccess Tim es o f 70, 8 5 , 1 0 0 , 120ns ■ C om m ercial, In d u stria l and M ilita ry T e m pe ratu re Ranges ■ Packaging ■ TTL C om p atible Inputs and O utputs

Contextual Info: WPS128K32V-XPJC WHITE /VI IC ROE LECT RON IC S 128Kx32 SRAM MODULE ADVANCED* FEATURES • A ccess T im es o f 1 5 ,1 7 , 20, 25ns ■ Packaging ■ ■ Fully S ta tic O p e ra tio n : • 6 8 - le a d , P la stic PLCC, 2 5 .15 mm 0.990 inch square ■ Three S ta te O utputs

V5-001

Abstract: din 4007
Contextual Info: Module no:2791016 LabelId:2791016 Operator:Phoenix 17:49:33, Donnerstag, 28. Juni 2001 UKK 5-DIO with diode from top to bottom Terminal width 6.2 IEC rigid [mm ] solid 2 Connection data 0.2-4 flexible stranded AWG 0.2-4 24-12 I U [A] [V] 32 500 ) 1 Diode type fitted 1N 4007

4Mx8

Contextual Info: WF512K64-XG4WX5 Page 1 of 10 WF512K64-XG4WX5 HI-RELIABILITY PRODUCT 512Kx64 5V FLASH MODULEPRELIMINARY* FEATURES • Access Times of 70, 90, 120, 150ns ■ 5 Volt Programming. 5V ± 10% Supply. ■ Packaging ■ Low Power CMOS, 6.5mA Standby • 116 lead, 40mm square, Hermetic CQFP Package 504

MSTBA 2.5 -5.08

Abstract: phoenix 17 33 67 7 MSTBVA 2.5 3 g
Contextual Info: Module no:1755516 LabelId:1755516 Operator:Phoenix 11:34:29, Mittwoch, 1. März 2000 MSTBVA 2,5/…-G Header with side panels, plug-in direction vertical to the p.c.b. Pitch 5.0 or 5.08 I U [A] [V] 12 250 No. of positions Dim. a [mm] 2 Connection data H CAK

mvstbw

Abstract: Phoenix Contact 17 92 53 7 MVSTBW 2.5/3-ST MVSTBW 2.5/4-ST MVSTBW 2.5/16-ST-5.08
Contextual Info: Module no:1792524 LabelId:1792524 Operator:Phoenix 16:33:57, Donnerstag, 28. Juni 2001 MVSTBW 2,5/…-ST Plug-in direction vertical to the conductor axis, connection point facing the rippled wall W of the header Pitch 5.0 or 5.08 (IEC) 2 [mm ] Connection data

Contextual Info: I/I/HITE /MICROELECTRONICS WPD32M72-XMDC 32Mx72 DRAM DIMM GENERAL DESCRIPTION FEATURES • The WPD32M72-XMDC is an 32M x 72 bit Dynamic RAM high density memory module. The module consists of thirty-six 16M x 4 bit DRAMs in 32-pin TSOP packages. The DRAMs are

CS466

Contextual Info: WS512K32-XXX White Electronic Designs 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES • Access Times of 70, 85, 100, 120ns ■ 5 Volt Power Supply ■ Packaging ■ Low Power CMOS • 66 pin, PGA H Type, 1.185 inch square, Hermetic Ceramic HIP (Package 401).

CS466

Contextual Info: WS512K32-XXX White Electronic Designs 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES • Access Times of 70, 85, 100, 120ns ■ 5 Volt Power Supply ■ Packaging ■ Low Power CMOS • 66 pin, PGA H Type, 1.185 inch square, Hermetic Ceramic HIP (Package 401).

Contextual Info: a WS512K32BV-XXXE WHITE /M ICROELECTRONICS 512Kx32 3.3V SRAM MODULE PRELIMINARY* FEATURES • A c c e s s T i m e s o f 1 5f , 1 7, 2 0 n s ■ C o m m e r c i a l , In d u s tr ia l and M i l i t a r y T e m p e r a t u r e R a ng e s ■ M IL - S T D - 8 8 3 C o m p l i a n t D e v ic e s A v a i l a b l e