PCB BOARD DIMENSION Search Results
PCB BOARD DIMENSION Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| RPI96B3TJ12P1LF | Amphenol Communications Solutions | DIN PCB ACCESSORIES | |||
| 8609153004LF | Amphenol Communications Solutions | DIN PCB ACCESSORIES | |||
| 86092326324755V1LF | Amphenol Communications Solutions | DIN PCB STRAIGHT RECEPTACLE | |||
| 86093488613H55V1LF | Amphenol Communications Solutions | DIN PCB RightAngle Receptacle | |||
| 86092326314765V1LF | Amphenol Communications Solutions | DIN PCB STRAIGHT RECEPTACLE |
PCB BOARD DIMENSION Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
UA42
Abstract: VFBGA-48 bga rework aa56 yamaichi socket
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56gql56-pin65-mmscet004+5 | |
idc 50 pin data ribbon connector
Abstract: idc 14 pin data ribbon connector 14 pin data ribbon connector champ 50 pin champ
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ieee-488idc 50 pin data ribbon connectoridc 14 pin data ribbon connector14 pin data ribbon connector+2 | |
M705-GRN360-MZ
Abstract: M705-GRN360 M705-GRN360-M-Z NC257 senju solder bar WLCSP stencil design
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an11046dsn0603-2od962m705-grn360-mz+5 | |
C 4804
Abstract: PC322
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pc322e86876125vacc 4804 | |
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Contextual Info: Type BLC Polypropylene Board Mount DC Link Capacitors PCB Mount Power Film Capacitors Type BLC series uses the most advanced metallized film technology for long life and high reliability in DC Link applications. This series combines high capacitance and very high ripple |
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Contextual Info: P TYPE CHIP FUSE Type CQ06PF 1.55mmx 0.8mm 0603 Fast-Acting Fuse Series Patent Feature Material Construction Body Material: FR4 Board Termination Material: Copper(Cu),Tin(Sn) Fuse Element: Copper(Cu),Tin(Sn) a. Chip Fuse structure design with PCB body and copper & |
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cq06pf55mmx63vdc63vac | |
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Contextual Info: Ribbon Cable Interconnect Solutions Micro-MaTch Miniature Connector System — Specials SMC Connector Part Number 100411 This connector type enables a solderless application to the printed circuit board. Contact is made on the surface of the PCB, enabling the use of paperphenol and epoxy |
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x-215464-xx-338095-xx-215083-xx-215079-x+6 | |
LU4S042
Abstract: TD13
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lu4s042rj-451-60mhz60-100mhz+2 | |
ASTM-B16-85Contextual Info: Correct-A-Chip Circuit-Bridge™ Programmed Headers FEATURES: • Aries’ Correct-A-Chip™ Circuit-Bridge™ headers are programmed to your specifications via a miniature PCB, eliminating the need for an extra PC board layer. • Available with an unlimited number of pins on practically any |
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c36000astm-b16-85mil-p-81728fications | |
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Contextual Info: TECHNICAL DATA SHEET 1/7 R107.064.900 SMT BOARD TO BOARD ADAPTATOR H3 Series : IMP REEL OF 2500 All dimensions are in mm. . pn . ao COMPONENTS BODY CENTER CONTACT OUTER CONTACT INSULATOR GASKET OTHERS PARTS - PLATING µm MATERIALS BERYLLIUM COPPER BERYLLIUM COPPER |
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1367073-1
Abstract: sfp autonegotiation
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v23818-m15-b57rj-45ul-94d-13623+2 | |
SB11-04HPContextual Info: Ordering number:EN2788A SB11-04HP Schottky Barrier Diode 40V, 1.1A Rectifier Features Package Dimensions • Supports automatic mounting and permits SB1104HP-applied sets to be made smaller. · Low forward voltage VF max=0.55V . · Average rectified current (IO=1.1A). |
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en2788asb11-04hpsb1104hp-applied | |
terminal block
Abstract: PCB terminal blocks terminal block datasheet
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e60677terminal blockpcb terminal blocksterminal block datasheet | |
179031-3
Abstract: B-21 7120 1-179031-0 179031-4 179031-1
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179031-3b-21 71201-179031-0179031-4+1 | |
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ro4003 8mil
Abstract: tga2513
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tga2513-smro4003 8miltga2513 | |
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Contextual Info: 1/2 Multilayer Chip Band Pass Filters For Bluetooth & 2.4GHz W-LAN Conformity to RoHS Directive DEA Series DEA162450BT-2096A1-H SHAPES AND DIMENSIONS Top view Bottom view 1.6±0.15 0.2min. 0.8±0.15 2 3 1 0.6max. 0.5±0.1 Terminal functions 1 IN 2 GND 3 OUT |
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dea162450bt-2096a1-h2400mhz433db2500mhz+6 | |
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Contextual Info: PC Card Card-Side Socket Connector [Top Surface Mount SMT Single Row] Part Number • ICM-68FYC-0M ( )-TP Symbol of offset dimension No Symbol : 0.0mm 03 : 0.3mm 06 : 0.6mm T ape’n reel packaging Part number A (Offset*) ICM -68FYC ICM-68FYC-OM03 ICM-68FY C-QM06 |
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icm-68fyc-0m-68fycicm-68fyc-om03icm-68fy+4 | |
e9611
Abstract: marking code ACh
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ach32cach3218ach45182002/95/ec+4 | |
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Contextual Info: Customer Information Sheet DRAWING N o .: SHEET M22-6063005 2 OF 2 T T f IN D OUBT - ASK I c | NOT TO SCALE •58. 00- 6.00 ALL DIMENSIONS SPECIFICATIONS: MATERIAL: MOULDI NG PPS U L 9 4 V - 0 B L A C K CONTACTS PHOSPHOR BRONZ E FINISH: C O N T A C T S = 0 . 2 5 jj G O L D O V E R N I C K E L |
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m22-6063005 | |
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Contextual Info: TGA4031-SM 17 – 40 GHz MPA/Multiplier Key Features • • • • • • RF Output Frequency Range: 17 - 40 GHz 22 dB Nominal Gain 22 dBm Nominal Output Maximum Power 2x and 3x Multiplier Function Bias: Vd = 5V, Id = 140mA Package Dimensions: 3.0 x 3.0 x 1.17 mm |
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tga4031-sm140ma | |
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Contextual Info: Advance Product Information September 18, 2006 Ka-Band Packaged MPA TGA4902-SM Key Features • • • • • Typical Frequency Range: 25 - 35 GHz 25 dBm Nominal P1dB 18 dB Nominal Gain Bias 6 V, 220 mA Package Dimensions: 4.0 x 4.0 x 0.9 mm Primary Applications |
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tga4902-sm | |
20 uf 100V electrolytic capacitor
Abstract: C5750 capacitor 22 nF 1000v C3216 capacitor 2.2 uf 16v electrolytic 630V 50V 10uF X7R CERAMIC CAPACITOR MULTILAYER 2.2 UF X7R 1200 uF 63V capacitor 2 ceramic capacitor 2,2 nF 100v
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iso8802-3cdf-aec-q200c2012c5750+11 | |
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Contextual Info: RF5152 Preliminary 3V TO 3.6V, 2.4GHz TO 2.5GHz LINEAR POWER AMPLIFIER Typical Applications • IEEE802.11b/g/n WLAN Applications • Portable Battery-Powered Equipment • 2.5GHz ISM Band Applications • Spread-Spectrum and MMDS Systems • Commercial and Consumer Systems |
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rf5152ieee80211b/g/neia-481 | |
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Contextual Info: Advance Product Information June 2, 2005 Ka-Band Packaged MPA TGA4902-SM Key Features • • • • • Typical Frequency Range: 25 - 35 GHz 25 dBm Nominal P1dB 18 dB Nominal Gain Bias 6 V, 220 mA Package Dimensions: 4.0 x 4.0 x 0.9 mm Primary Applications |
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tga4902-sm | |