PBGA PACKAGE WEIGHT Search Results

transistor nec 8772

Abstract: nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry
Contextual Info: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s

NXR-1400

Abstract: nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC
Contextual Info: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s

Contextual Info: White Electronic Designs W3H32M64E-XSBX ADVANCED* 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Write latency = Read latency - 1* tCK Package: Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 20mm

designs

Abstract: 90-FBGA W3H32M64E-XSBX White Electronic Designs
Contextual Info: White Electronic Designs W3H32M64E-XSBX ADVANCED* 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Write latency = Read latency - 1* tCK Package: Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 20mm

CEE 32

Abstract: W3H32M64E-XSBX
Contextual Info: White Electronic Designs W3H32M64E-XSBX 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Data rate = 667, 533, 400 Mb/s  Package: • 208 Plastic Ball Grid Array PBGA , 16 x 20mm • 1.0mm pitch  Commercial, Industrial and Military Temperature

W3H128M72E-XSBX

Contextual Info: White Electronic Designs W3H128M72E-XSBX PRELIMINARY* 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Package: „ CK/CK# Termination options available • 0 ohm, 20 ohm • 208 Plastic Ball Grid Array PBGA , 16 x 22mm

W3H128M72

Abstract: W3H128M72E-XSBX W3H128M72E
Contextual Info: White Electronic Designs W3H128M72E-XSBX Advanced* 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Package: „ CK/CK# Termination options available • 0 ohm, 20 ohm • 208 Plastic Ball Grid Array PBGA , 16 x 22mm

8525a

Contextual Info: Version 1.3 2007 Features ƒ ƒ PEX 8525 General Features o 24-lane PCI Express switch - Integrated SerDes o Up to five configurable ports x1, x2, x4, x8, x16 o 23mm x 23mm, 484-ball PBGA package o 31mm x31mm, 644-ball PBGA package o Typical Power: 2.6 Watts

Contextual Info: White Electronic Designs W3H64M72E-XSBX ADVANCED* 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4 or 5 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 17 x 23mm

Contextual Info: . Version 1.3 2007 Features ƒ PEX 8533 General Features o 32-lane PCI Express switch - Integrated SerDes o Up to six configurable ports o 23mm x 23mm, 484-ball PBGA package o 35mm x 35mm, 680-ball PBGA package o Pin Compatible with PEX 8532 o Typical Power: 3.3 Watts

W3H32M72E

Abstract: fbga90
Contextual Info: White Electronic Designs W3H32M72E-XSBX ADVANCED* 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4 or 5 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 18 x 20mm

PEX8547

Contextual Info: . Version 1.5 2007 Features ƒ PEX 8547 General Features o 48-lane PCI Express switch o Three configurable ports x1, x2, x4, x8, x16 o Integrated SerDes o 27mm x 27mm, 676-ball PBGA package o 37.5mm x 37.5mm, 736 ball PBGA package o Typical Power: 4.9 Watts

Contextual Info: Version 1.6 2007 Features ƒ ƒ PEX 8548 General Features o 48-lane PCI Express switch - Integrated SerDes o Up to nine configurable ports x1, x2, x4, x8, x16 o 27mmx27mm, 686-ball PBGA package o 37.5mm x 37.5mm, 736-ball PBGA package o Typical Power: 4.9 Watts

Contextual Info: Version 1.4 2007 Features ƒ ƒ PEX 8525 General Features o 24-lane PCI Express switch - Integrated SerDes o Up to five configurable ports x1, x2, x4, x8, x16 o 23mm x 23mm, 484-ball PBGA package o 31mm x31mm, 644-ball PBGA package o Typical Power: 2.6 Watts

Contextual Info: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm

Contextual Info: W3H64M72E-XSBX W3H64M72E-XSBXF 512MB – 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400 Mb/s  30% Space saving vs. FBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 22mm

Contextual Info: White Electronic Designs W3H64M72E-XSBX 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Programmable CAS latency: 3, 4 or 5 „ Package: „ Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 16 x 22mm

TCKAB

Abstract: DNU-A13
Contextual Info: White Electronic Designs W3H64M16E-XBX 64M x 16 DDR2 SDRAM 79 PBGA FEATURES  Data rate = 400 Mb/s  Organized as 64M x 16  Package:  Weight: W3H64M16E-XBX - TBD • 79 Plastic Ball Grid Array PBGA , 11 x 14mm BENEFITS • 1.27mm pitch  Supply Voltage = 1.8V

W3H64M72E-XSBX

Contextual Info: White Electronic Designs W3H64M72E-XSBX ADVANCED* 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4 or 5 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 17 x 23mm

Contextual Info: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm

Contextual Info: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm

Contextual Info: White Electronic Designs W3H64M16E-XBX *PRELIMINARY 64M x 16 DDR2 SDRAM 79 PBGA FEATURES „ Data rate = 667, 533, 400 Mb/s „ Organized as 64M x 16 „ Package: „ Weight: W3H64M16E-XBX - TBD • 79 Plastic Ball Grid Array PBGA , 11 x 14mm BENEFITS • 1.27mm pitch

DNU-A13

Contextual Info: White Electronic Designs W3H64M16E-XBX 64M x 16 DDR2 SDRAM 79 PBGA FEATURES  Data rate = 667, 533, 400 Mb/s  Organized as 64M x 16  Package:  Weight: W3H64M16E-XBX - TBD • 79 Plastic Ball Grid Array PBGA , 11 x 14mm BENEFITS • 1.27mm pitch

Contextual Info: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm