PBGA PACKAGE WEIGHT Search Results

BGA-320P-M06

Contextual Info: PLASTIC BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 320 PIN PLASTIC BGA-320P-M06 320-pin plastic PBGA Lead pitch 1.27 mm Package width x package length 27.00 mm × 27.00 mm Lead shape Ball Sealing method Plastic mold Mounting height 2.46 mm Max

antimony trioxide epoxy molding

Abstract: material declaration semiconductor package Material declaration organic materials oxygen material declaration amd 104 c1k
Contextual Info: ‹ Chapter 4 Package Materials Material Declaration Data Sheets. AMD has created material data sheets for some of its more popular package designs. These data sheets are organized as follows: • Suface-Mount Array Packages Š PBGA, page 6-19 • Surface-Mount Leaded Packages

Contextual Info: iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72PBG 32Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm

Contextual Info: iPEM 2.4Gb SDRAM-DDR AS4DDR32M72PBG1 32Mx72 DDR SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR SDRAM Data Rate = 200, 250, 266, 333Mbps Package: • 208 Plastic Ball Grid Array PBGA , 16 x 23mm-1.0mm pitch 2.5V ±0.2V core power supply

Contextual Info: IBM041841QLAD IBM043641QLAD P relim inary 128K x 36 & 256K x 18 SR A M Features • 128K x 36 or 256K x 18 Organizations • Registered Outputs • CMOS Technology • Common I/O • Synchronous Pipeline Mode Of Operation with Self-Timed Late Write • Asynchronous Output Enable and Power Down

Contextual Info: WEDPN16M64V-XBX 16Mx64 Synchronous DRAM Preliminary* FEATURES GENERAL DESCRIPTION n High Frequency = 100, 125MHz The 128MByte 1Gb SDRAM is a high-speed CMOS, dynamic random-access, memory using 4 chips containing 268,435,456 bits. Each chip is internally configured as a

soc 1044

Abstract: 98EX110 Prestera Marvell multicast
Contextual Info: Switching Solutions Prestera -EX110/EX115 48 FE + 4 GbE Packet Processor 98EX110/98EX115 PRODUCT OVERVIEW The Marvell¨ Presteraª-EX family of packet processors delivers multi-layer enterprise switching with exceptional price/performance ratios and industry-leading features. The Prestera-EX110/EX115 integrates 48 Fast Ethernet

Contextual Info: WEDPN8M64V-XBX HI-RELIABILITY PRODUCT 8Mx64 Synchronous DRAM FEATURES GENERAL DESCRIPTION • High Frequency = 100, 125MHz The 64MByte 512Mb SDRAM is a high-speed CMOS, dynamic random-access memory using 4 chips containing 134,217,728 bits. Each chip is internally configured as a quad-bank DRAM with

Contextual Info: WEDPN16M64VR-XBX 16MX64 REGISTERED SYNCHRONOUS DRAM Preliminary* FEATURES GENERAL DESCRIPTION n Registered for enhanced performace of bus speeds The 128MByte 1Gb SDRAM is a high-speed CMOS, dynamic random-access, memory using 4 chips containing 268,435,456

Contextual Info: TLK4250 QUAD 1.0 to 2.5 Gbps TRANSCEIVER SWRS025 − APRIL 2004 D Hot Plug Protection D Quad 1.0 to 2.5 Gigabits Per Second Gbps Serializer/Deserializer D Independent Channel Operation D 2.5-V Power Supply for Low Power D D D D Operation Selectable Signal Preemphasis for Serial

TLK4120

Contextual Info: TLK4120 QUAD 0.5 to 1.3 Gbps TRANSCEIVER SLLS599D − DECEMBER 2003 − REVISED JULY 2007 D Hot Plug Protection D Quad 0.5 to 1.3 Gigabits Per Second Gbps Serializer/Deserializer D Independent Channel Operation D 2.5-V Power Supply for Low Power D D D D

IBM0418A8ACLAB

Abstract: IBM0436A4ACLAB IBM0436A8ACLAB IBM0418A4ACLAB
Contextual Info: . IBM0418A4ACLAB IBM0436A8ACLAB Preliminary IBM0418A8ACLAB IBM0436A4ACLAB 8Mb 256Kx36 & 512Kx18 and 4Mb (128Kx36 & 256Kx18) SRAM Features • 8Mb: 256K x 36 or 512K x 18 organizations 4Mb: 128K x 36 or 256K x 18 organizations • 0.25 Micron CMOS technology

IBM0418A4CBLBB

Abstract: IBM0418A8CBLBB IBM0436A4CBLBB IBM0436A8CBLBB 256k x 18
Contextual Info: . IBM0418A8CBLBB IBM0418A4CBLBB Preliminary IBM0436A8CBLBB IBM0436A4CBLBB 8Mb 256Kx36 & 512Kx18 and 4Mb (128Kx36 & 256Kx18) Features • 8Mb: 256K x 36 or 512K x 18 Organizations 4Mb: 128K x 36 or 256K x 18 Organizations • CMOS Technology • HSTL Input and Output levels

Lead Free reflow soldering profile BGA

Abstract: BGA-3591 Metcal BGA-3591 Metcal CSP 3502 CSP-3500 BGA-3590 BGA-3592 CSP-085-102 ceramic rework bga rework
Contextual Info: Worldwide and U.S. Headquarters 1530 O’Brien Drive Menlo Park, CA 94025 USA Phone: + 1-650-325-3291 1-800-776-1778 Fax: + 1-650-325-5932 Europe Headquarters Eagle Close, Chandler’s Ford Eastleigh Hampshire SO53 4NF U.K. Phone: + 44 23 8048 9100 Fax: + 44 23 8048 9109

F249

Contextual Info: TLK2201AJR 1.0 Gb to 1.6 Gb SMALL FORMĆFACTOR ETHERNET TRANSCEIVER SLLS614 − MARCH 2004 D 1.0-to 1.6-Gigabits Per Second Gbps D D D D D D D IEEE 802.3 (Gigabit Ethernet) Compliant D Advanced 0.25-µm CMOS Technology D Interfaces to Backplane, Copper Cables, or

Contextual Info: I =¥= = = = ’= P relim inary IBM041840QLAD IBM043640QLAD 128K x 36 & 256K x 18 SR A M Features • 128K x 36 or 256K x 18 Organizations Common I/O • CMOS Technology Asynchronous Output Enable and Power Down Inputs • Synchronous Flow-Thru Mode Of Operation

Contextual Info: TLK2201AJR 1.0 Gb to 1.6 Gb SMALL FORMĆFACTOR ETHERNET TRANSCEIVER SLLS614A − MARCH 2004 − REVISED MAY 2007 D 1.0-to 1.6-Gigabits Per Second Gbps D D D D D D D D Interfaces to Backplane, Copper Cables, or Serializer/Deserializer Low Power Consumption < 250 mW at

IBM0418A4CFLBB

Abstract: IBM0418A8CFLBB IBM0436A4CFLBB IBM0436A8CFLBB
Contextual Info: . IBM0418A8CFLBB IBM0418A4CFLBB Preliminary IBM0436A8CFLBB IBM0436A4CFLBB 8Mb 256Kx36 & 512Kx18 and 4Mb (128Kx36 & 256Kx18) SRAM Features • 8Mb: 256K x 36 or 512K x 18 organizations 4Mb: 128K x 36 or 256K x 18 organizations • CMOS Technology • HSTL Outputs

Contextual Info: IBM0418A81QLAA IBM0418A41QLAA P relim inary IBM0436A81QLAA IBM0436A41QLAA 8M b 256K x36 & 512x18 and 4M b (128K x36 & 256K x18) SR A M Features • 256K x 36 or 512K x 18 organizations • Registered Outputs • 128K x 36 or 256K x 18 organizations • Common I/O

SLES209E

Contextual Info: TVP5150AM1 SLES209E – NOVEMBER 2007 – REVISED OCTOBER 2011 www.ti.com Ultralow-Power NTSC/PAL/SECAM Video Decoder Check for Samples: TVP5150AM1 1 Introduction 1.1 Features 1 • Accepts NTSC J, M, 4.43 , PAL (B, D, G, H, I, M, N, Nc), and SECAM (B, D, G, K, K1, L) Video

SLES209E

Abstract: CGMS-A
Contextual Info: TVP5150AM1 SLES209E – NOVEMBER 2007 – REVISED OCTOBER 2011 www.ti.com Ultralow-Power NTSC/PAL/SECAM Video Decoder Check for Samples: TVP5150AM1 1 Introduction 1.1 Features 1 • Accepts NTSC J, M, 4.43 , PAL (B, D, G, H, I, M, N, Nc), and SECAM (B, D, G, K, K1, L) Video

Contextual Info: SM320C6701ĆEP, SM320C6701MECHĆEP FLOATINGĆPOINT DIGITAL SIGNAL PROCESSOR SGUS042A − MAY 1998 − REVISED APRIL 2004 D Controlled Baseline D D D D D D D D 1M-Bit On-Chip SRAM − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance up to

Contextual Info: SM320C6701ĆEP, SM320C6701MECHĆEP FLOATINGĆPOINT DIGITAL SIGNAL PROCESSOR SGUS042A − MAY 1998 − REVISED APRIL 2004 D Controlled Baseline D D D D D D D D 1M-Bit On-Chip SRAM − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance up to

Contextual Info: SM320C6701ĆEP, SM320C6701MECHĆEP FLOATINGĆPOINT DIGITAL SIGNAL PROCESSOR SGUS042A − MAY 1998 − REVISED APRIL 2004 D Controlled Baseline D D D D D D D D 1M-Bit On-Chip SRAM − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance up to