PBGA 23X23 Search Results

8525a

Contextual Info: Version 1.3 2007 Features ƒ ƒ PEX 8525 General Features o 24-lane PCI Express switch - Integrated SerDes o Up to five configurable ports x1, x2, x4, x8, x16 o 23mm x 23mm, 484-ball PBGA package o 31mm x31mm, 644-ball PBGA package o Typical Power: 2.6 Watts

Contextual Info: . Version 1.3 2007 Features ƒ PEX 8533 General Features o 32-lane PCI Express switch - Integrated SerDes o Up to six configurable ports o 23mm x 23mm, 484-ball PBGA package o 35mm x 35mm, 680-ball PBGA package o Pin Compatible with PEX 8532 o Typical Power: 3.3 Watts

Contextual Info: Version 1.4 2007 Features ƒ ƒ PEX 8525 General Features o 24-lane PCI Express switch - Integrated SerDes o Up to five configurable ports x1, x2, x4, x8, x16 o 23mm x 23mm, 484-ball PBGA package o 31mm x31mm, 644-ball PBGA package o Typical Power: 2.6 Watts

Contextual Info: . Version 1.4 2007 Features ƒ PEX 8533 General Features o 32-lane PCI Express switch - Integrated SerDes o Up to six configurable ports o 23mm x 23mm, 484-ball PBGA package o 35mm x 35mm, 680-ball PBGA package o Pin Compatible with PEX 8532 o Typical Power: 3.3 Watts

208z

Abstract: SSZA002 Texas Instruments Philippines PBGA 23X23 0.8 pitch tray 23X23 376ZDW high current pogo pin shape 23x23 tray 27X27
Contextual Info: Application Report SSZA002 – August 2009 Plastic Ball Grid Array PBGA . SSZA002 – August 2009 Submit Documentation Feedback

8512E

Abstract: 8512 embedded controller PBGA 376 PEX8512-AC25BI Board-422
Contextual Info: Version 1.3 2009 Features ƒ PEX 8512 General Features o 12-lane PCI Express switch - Integrated SerDes o Up to five ports o 23mm x 23mm, 376-ball PBGA package o Typical Power: 2.0 Watts ƒ PEX 8512 Key Features o Standards Compliant - PCI Express Base Specification, r1.1

pcb warpage in ipc standard

Abstract: IPC-9701A SAC405 IPC-9702 BGA PACKAGE thermal resistance Freescale ipc 9702 945 motherboard circuit semiconductor cross reference "IPC 1752" gold SAC387
Contextual Info: Q2, 2010 Flip Chip Plastic Ball Grid Array FC-PBGA Application Note Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm Off. All other product or service names are the property of their respective owners. 2010 Freescale Semiconductor, Inc.

PEX8518-AB25BI

Abstract: PBGA 376 PEX8518 pci non-transparent bridge
Contextual Info: Version 1.5 2007 Features ƒ PEX 8518 General Features o 16-lane PCI Express switch - Integrated SerDes o Up to five configurable ports o 23mm x 23mm, 376-ball PBGA package o Typical Power: 2.6 Watts ƒ PEX 8518 Key Features o Standards Compliant - PCI Express Base Specification, r1.1

PEX8518-AC25BIG

Abstract: 8518RDK PBGA 376 PEX8518-AC25BI
Contextual Info: Version 1.6 2007 Features ƒ PEX 8518 General Features o 16-lane PCI Express switch - Integrated SerDes o Up to five configurable ports o 23mm x 23mm, 376-ball PBGA package o Typical Power: 2.6 Watts ƒ PEX 8518 Key Features o Standards Compliant - PCI Express Base Specification, r1.1

IT 8518

Abstract: PEX8518-SIL-PB-P1-1 A/ITE 8518
Contextual Info: Version 1.2 2006 PEX 8518 Features ƒ PEX 8518 General Features o 16-lane PCI Express switch - Integrated SerDes o Up to five configurable ports o 23mmx23mm, 376-ball PBGA package o Maximum Power: 3.53 Watts ƒ PEX 8518 Key Features o Standards Compliant - PCI Express Base Specification, r1.1

8512

Abstract: PBGA 376 MSI MOTHERBOARD SERVICE MANUAL PEX8512-AC25BI pcie X1 edge connector
Contextual Info: Version 1.2 2007 Features ƒ PEX 8512 General Features o 12-lane PCI Express switch - Integrated SerDes o Up to five ports o 23mm x 23mm, 376-ball PBGA package o Typical Power: 2.0 Watts ƒ PEX 8512 Key Features o Standards Compliant - PCI Express Base Specification, r1.1

SAC405

Abstract: IPC-9702 IPC-9701A PBGA 23X23 0.8 pitch ipc 610D ipc 9702 JEDEC JESD51-8 BGA bga thermal cycling reliability fine BGA thermal profile Service Manual smd rework station
Contextual Info: Introduction to the Plastic Ball Grid Array PBGA Q1, Burnette 2008 Terry Dec. 15, 2005 TM Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc in the US and other countries. All other product or service names are the property of their respective owners. Freescale Semiconductor, Inc. 2008. The information provided is typical to the industry and is not intended to represent

BGA 23X23

Abstract: 324PBGA 324 PBGA 23x23 22X22 23X23 PBGA 23X23 Solder Balls
Contextual Info: 324 PBGA / TEPBGA Wire Bond Daisy Chain Test Board and Package Traces: Looking Through Package and at Test Board Perimeter Balls 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 A B C D E Common F G H J K L M N P Thermal Balls R T U V W Y AA AB Slide 1

NET2272REV1A-LF

Abstract: pex8311 edge connector 8114BA 8524BB Rapid Development Kit PEX8311-AA66BC PEX8114BA PEX8114-AA13BI 8114s
Contextual Info: Issue No. 29 PEX 8114 Key Features Application: ♦ Transparent and NonTransparent Modes ♦ Forward and Reverse Modes ♦ Low Power Consumption 2W ♦ Small Footprint 17 x 17 mm BGA Package ♦ Lead Free Available ♦ Supports PCI and PCI-X 33MHz thru 133MHz

QFN-88

Abstract: 88 qfn CX6212 CHIPX DDR PHY ASIC 1602 LCD data sheet CX6214 cx6220 pbga 288 0.13um standard cell library
Contextual Info: Data Sheet CX6200 Structured ASIC with USB 2.0 HS OTG PHY Product Description The CX6200 product family combines a built-in, silicon-proven, industry standard PHY for USB 2.0 High Speed HS On-the-Go (OTG) with the well-proven X-Cell architecture, to provide industry leading performance using the UMC standard eight-metal 0.13-µm deep

QT2225

Abstract: qt2025 s4886 S10124 G.975.1 QT2225-1 S4882 S4884 QT2025-1 S19262
Contextual Info: Transport Products Product Selector Guide Table of Contents Physical Layer Devices Framer/Mappers Datacom PHY S19225

21111-BRF-001-D

Abstract: crosspoint M21121 M21111 PBGA 23X23 17X17 Equalizer chart express card DVB MINDSPEED pcb layout mindspeed
Contextual Info: > Product Overview M21111 3.2 Gbps 17x17 and M21121 3.2 Gbps 34x34 Crosspoint Switch The M21111/21, designed for today’s demanding video, telecom and datacom switching applications are low-power, high-speed crosspoint switches with input equalization and integrated pattern generator/checker. With all channels

M21121

Abstract: M21111 phase sequence checker for 3 phase supply MINDSPEED m21111
Contextual Info: > Product Overview M21111 3.2 Gbps 17x17 and M21121 3.2 Gbps 34x34 Crosspoint Switch The M21111/21, designed for today’s demanding video, telecom and datacom switching applications are low-power, high-speed crosspoint switches with input equalization and integrated pattern generator/checker. With all channels

STV0289

Abstract: sti5189 analog satellite tuner stv0289 ST40-300 STV0289 date code PBGA 23X23 0.8 pitch jtag st dvb-s transmitter design MPX audio ENCODER TUNER transport stream
Contextual Info: STi5189 Low-cost QPSK demodulator and MPEG2 decoder for set-top box applications Data Brief Features • Extensive connectivity USB 2.0 host/ULPI, Ethernet MAC MII/RMII, MPX, DVB-CI ■ External memory interface supporting NOR, NAND and serial Flash ■

BGA PROFILING

Abstract: MPC852T 62Sn-36Pb-2Ag 4/5/32R2024/25/62Sn-36Pb-2Ag
Contextual Info: Motorola PowerQUICC MPC852T Pb-Free Packaging Information Motorola Semiconductor Motorola SPS, NCSD - Q1 2003 – Rev. 1 - Page 1 Motorola General Business Information MOTOROLA and the Stylized M Logo are registered in the US Patent & Trademark Office. All other

fcBGA PACKAGE thermal resistance

Abstract: 409-ball CERAMIC PIN GRID ARRAY wire lead frame lead frame pin grid array 30-PIN TSOP 48 stacked flash bonding TSOP 48 thermal resistance Sharp Packages SSOP MM1248 ebga 304
Contextual Info: IC PACKAGE FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact: North and South America

1f1-1717-a19

Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
Contextual Info: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O

XPC823ZT50

Abstract: MPC823 user manual MPC823 PB28 PC14 127mm
Contextual Info: SECTION 23 MECHANICAL DATA AND ORDERING INFORMATION 23.1 ORDERING INFORMATION PACKAGE TYPE FREQUENCY MHz TEMPERATURE ORDER NUMBER 256-Lead Plastic Ball Grid Array with 1.27mm Ball Pitch 25 50 25 0°C to 70°C 0°C to 70°C -45°C to -85°C XPC823ZT25 XPC823ZT50

ms-029

Abstract: FBGA1152
Contextual Info: v6.0 Package Characteristics and Mechanical Drawings P a ck ag e Th e r m al C h ar ac te ri st i cs Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)