PBGA Search Results

Contextual Info: iPEM 2.4Gb SDRAM-DDR AS4DDR32M72PBG1 32Mx72 DDR SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR SDRAM Data Rate = 200, 250, 266, 333Mbps Package: • 208 Plastic Ball Grid Array PBGA , 16 x 23mm-1.0mm pitch 2.5V ±0.2V core power supply

Contextual Info: iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72PBG 32Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm

cisco 2911

Abstract: MR4A MR7N "LINK STATE"
Contextual Info: Advance Data Sheet May 1999 LU3X38FTR 256-Pin PBGA OCTAL-FET Fast Ethernet Transceiver for 10Base-T/100Base-TX/FX Overview The LU3X38FTR 256-Pin PBGA is an eight-channel, single-chip complete transceiver designed specifically for dual-speed 10Base-T, 100Base-TX, and

Contextual Info: Freescale Semiconductor Data Sheet: Document Number: MSC8144E Rev. 10, 8/2008 MSC8144E FC-PBGA–783 29 mm x 29 mm Quad Core Digital Signal Processor • Four StarCore SC3400 DSP subsystems, each with an SC3400 DSP core, 16 Kbyte L1 instruction cache, 32 Kbyte L1 data cache,

Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)

plx 9054

Abstract: plxtechnology tp 9054 333CJ PLX PCI9054 eeprom d4x MPC8S PC19054 pci 9054 RELAY lad1
Contextual Info: PCI 9054 PCI I/O Accelerator November 1998 Version 1.0 l20 Compatible, CompactPCI Hot Swap Friendly PCI Bus Master Interface Chip _ for Adapters and Embedded Systems FEA TU R E S • 3.3V, 5V tolerant PCI and Local signaling supports Universal PCI Adapter designs, 3.3V core, lowpower CMOS in 176-pin PQFP and 225-pin PBGA

SMII specification

Contextual Info: Advance Data Sheet October 1999 LU3X38FTR 256-Pin PBGA OCTAL-FET Fast Ethernet Transceiver for 10Base-T/100Base-TX/FX Overview The LU3X38FTR 256-Pin PBGA is an eight-channel, single-chip complete transceiver designed specifically for dual-speed 10Base-T, 100Base-TX, and

Contextual Info: PCI1512 www.ti.com SLLA231 – JUNE 2006 CardBus Controller FEATURES • • • • • • • • A 216-Terminal MicroStar BGA PBGA GVF/ZVF Package 2.5-V Core Logic and 3.3-V I/O with Universal PCI Interfaces Compatible with 3.3-V and 5-V PCI Signaling Environments

Contextual Info: MECHANICAL DATA MPBG005A – JANUARY 1997 GFQ S-PBGA-N520 PLASTIC BALL GRID ARRAY PACKAGE 43,00 SQ 40,64 SQ 1,27 A 1 Solder Balls 3,35 0,60 Seating Plane 0,15 4073205-2/B 11/96 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice.

Contextual Info: MECHANICAL DATA MPBG056 – JANUARY 1998 GHK S-PBGA-N257 PLASTIC BALL GRID ARRAY 16,10 SQ 15,90 14,40 TYP 0,80 W V U T R P N M L K J H G F E D C B A 0,80 3 1 2 0,95 0,85 5 4 7 6 9 8 11 10 13 12 15 14 17 16 19 18 1,40 MAX Seating Plane 0,12 0,08 0,55 0,45

Contextual Info: MECHANICAL DATA MPBG029 – JANUARY 1997 GGY S-PBGA-N256 PLASTIC BALL GRID ARRAY PACKAGE 16,10 SQ 15,90 18 14 16 17 15 12 13 10 8 6 4 2 11 9 5 7 1 3 0,80 A B C D E F G H J K L M N P R T U V 0,40 0,40 0,95 0,85 0,12 0,08 0,80 1,40 MAX 0,55 0,45 0,08 M 0,45

Contextual Info: MECHANICAL DATA MPBG058 – JANUARY 1998 GHH S-PBGA-N179 PLASTIC BALL GRID ARRAY 12,10 SQ 11,90 10,40 TYP 0,80 0,40 P N M L K J H G F E D C B A 0,40 0,80 1 2 3 4 5 6 7 8 9 10 11 12 13 14 0,95 0,85 1,40 MAX Seating Plane 0,12 0,08 0,55 0,45 0,08 M 0,45 0,35

Contextual Info: MECHANICAL DATA MPBG007 – NOVEMBER 1995 GFP S-PBGA-N256 PLASTIC BALL GRID ARRAY PACKAGE 30,00 SQ 27,94 SQ 1,27 TYP A 1 2,520 Solder Balls 0,600 4073206/A 11/95 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice.

Contextual Info: MECHANICAL DATA MPBG027 – JANUARY 1997 GGT S-PBGA-N100 PLASTIC BALL GRID ARRAY PACKAGE 11,10 SQ 10,90 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L 0,80 0,80 0,95 0,85 0,12 0,08 1,40 MAX 0,55 0,45 0,08 M 0,45 0,35 0,10 4073222/A 11/96 NOTES: A. All linear dimensions are in millimeters.

Contextual Info: MECHANICAL DATA MPBG001 – NOVEMBER 1995 GFU S-PBGA-N560 PLASTIC BALL GRID ARRAY PACKAGE 42,50 SQ 39,37 SQ 1,27 A 1 1,17 32 Solder Balls 2,33 Seating Plane 0,60 0,15 4073203 / A 11/95 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice.

pin vga CRT pinout

Abstract: samsung* lpddr2 LPDDR2-800 i.MX53 PCIMX535DVV1C emmc DDR pcb layout Samsung eMMC 4.41 LPDDR2 PoP JESD209-2 flexcan2
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 3, 7/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case PBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA PoP 12 x 12 mm

Contextual Info: MECHANICAL DATA MPBG004 – NOVEMBER 1995 GGC S-PBGA-N388 PLASTIC BALL GRID ARRAY PACKAGE 0,79 Dia Solder Balls 0,73 35,00 SQ 20,30 SQ 1,63 TYP 1,27 TYP A 1 0,80 1,83 0,38 0,65 4073212/A 11/95 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice.

Contextual Info: MECHANICAL DATA MPBG002 – NOVEMBER 1995 GFV S-PBGA-N352 PLASTIC BALL GRID ARRAY PACKAGE 35,00 SQ 31,75 SQ 1,27 A 26 1 0,78 Solder Balls 1,38 Seating Plane 0,60 0,15 4073202 / A 11/95 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice.

S-PBGA-N209

Contextual Info: MECHANICAL DATA MPBG051 – JANUARY 1998 GHG S-PBGA-N209 PLASTIC BALL GRID ARRAY 13,10 SQ 12,90 10.40 TYP 0,65 U T R P N M L K J H G F E D C B A 0,65 1 0,95 0,85 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 1,35 MAX Seating Plane 0,12 0,08 0,45 0,35 0,08 M 0,36

Contextual Info: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. PBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm

W3J512M32G

Abstract: M41K256M32
Contextual Info: W3J512M32G-XBX W3J512M32G T -XB2X W3J512M36/40G(T)-XB3X *PRELIMINARY 2GB – 512M x 32/36/40 DDR3 SDRAM 1.5V – 136/204 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333 Mb/s  74% Space savings vs. FBGA  Packages:

Hyperstone f9

Contextual Info: W7NxVHxxBI Embedded SLC NAND PATA SSD PBGA FEATURES   DESCRIPTION Storage Capacities: 8GB and 16GB Environment conditions: The W7NxVHxxBI is a small reliable PATA IDE solid state storage solution in a single integrated BGA package. Typical NAND related

Contextual Info: W3J512M64K-XPBX W3J512M64K-XLBX *ADVANCED 4GB – 512M x 64 DDR3 SDRAM 1.35V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1,066, 1333, 1600* Mb/s  Differential clock terminations included

Contextual Info: W3H264M16E-XBX ADVANCED* 256MB – 2 x 64M x 16 DDR2 SDRAM 79 PBGA FEATURES BENEFITS  Data rate = 400 Mb/s, 533 Mb/s, 667 Mb/s*  Larger ball pitch for higher reliability  Package:  Footprint compatible with W3H64M16E • 79 Plastic Ball Grid Array PBGA , 11 x 14mm