PACKAGING Search Results
PACKAGING Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| TPH1R306PL |
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N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) | Datasheet | ||
| TPH9R00CQH |
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MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) | Datasheet | ||
| TPH9R00CQ5 |
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N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) | Datasheet | ||
| TPHR8504PL |
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N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) | Datasheet | ||
| XPH2R106NC |
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N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) | Datasheet |
PACKAGING Datasheets (35)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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| Packaging | Altera | AN 114: Designing with FineLine BGA Packages | Original | 180.81KB | 13 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Packaging | Altera | AN 80: Selecting Sockets for Altera Devices | Original | 108.61KB | 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Packaging | Altera | AN 90: SameFrame Pin-Out Design for FineLine BGA Packages | Original | 240.72KB | 14 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Packaging | Altera | Altera Device Package Information Data Sheet | Original | 2.17MB | 69 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Packaging | Altera | AN 113: Plastic Package Reliability & Testing | Original | 152.43KB | 9 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Packaging | Altera | AN 71: Guidelines for Handling J-Lead & QFP Devices | Original | 231.2KB | 16 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Packaging | Altera | AN 81: Reflow Soldering Guidelines for Surface-Mount Devices | Original | 100.43KB | 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Packaging | Atmel | ATMEL Packaging | Original | 345.41KB | 43 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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PB1094 -- Lattice Expands BGA Offering | Original | 154.21KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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LatticeNEWS, October 2003 | Original | 396.61KB | 12 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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LatticeNEWS, July 2003 | Original | 1.26MB | 13 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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LatticeNEWS, December 2003 | Original | 552.8KB | 10 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PACKAGING ADH |
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Tapes, Adhesives, Materials - Glue, Adhesives, Applicators - HOT MELT PACKAGING ADHESIVE AE L | Original | 2.66MB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Packaging Diagrams |
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Packaging - Outlines and Parameters | Original | 2.01MB | 66 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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| PACKAGING INFORMATION |
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330-mil Plastic SOP Package Code: U (28-pin) | Original | 15.23KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Mini Ball Grid Array Package Code: M (36-pin) | Original | 21.37KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PACKAGING INFORMATION |
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150-mil Plastic SOP Package Code: G, GR | Original | 19.78KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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TQFP (Thin Quad Flat Pack Package) Package Code: TQ | Original | 9.79KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PACKAGING INFORMATION |
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300-mil Plastic DIP Package Code: N,P | Original | 17.72KB | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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LQFP (Low Profile Quad Flat Pack) Package Code: LQ (44-pin) | Original | 12.51KB | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
PACKAGING Price and Stock
3M Interconnect PACKAGING-ADHHOT MELT PKG ADHESIVE 1=1STICK |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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PACKAGING-ADH | Box | 59 | 1 |
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Buy Now | |||||
Super Micro Computer Inc 4U90 PACKAGINGPACKAGING FOR MCP-430-94704-0N - Bulk (Alt: 4U90 PACKAGING) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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4U90 PACKAGING | Bulk | 200 |
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Get Quote | ||||||
Super Micro Computer Inc CSE-213LTQ-R720UB-PACKAGING- Bulk (Alt: CSE-213LTQ-R720UB-PACKAGING) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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CSE-213LTQ-R720UB-PACKAGING | Bulk | 1 |
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Get Quote | ||||||
Super Micro Computer Inc 1U12 PACKAGINGPACKAGING FOR MCP-430-80201-0N - Bulk (Alt: 1U12 PACKAGING) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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1U12 PACKAGING | Bulk | 200 |
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Get Quote | ||||||
FCL Components Limited CUSTOM PACKAGING-NRENRE CHARGE FOR NEW FULL CUSTOM INNER CARTON PROTECTIVE SHIPPING PACKAGING - Virtual or Non-Physical Inventory (Software & Literature) (Alt: CUSTOM PACKAGING-NRE) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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CUSTOM PACKAGING-NRE | No Container | 1 |
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Get Quote | ||||||
PACKAGING Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
BENT LEAD transistor TO-92 Outline Dimensions
Abstract: 2SC2712 equivalent 4TE12 diode ssc J Fet marking 2 AW 2SC2873 equivalent 90105 toshiba ultrasonic atomizing SMD TRANSISTOR MARKING 5c
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OCR Scan |
SC-59) SC-61) TE85L TE85R TE85N SC-70) BENT LEAD transistor TO-92 Outline Dimensions 2SC2712 equivalent 4TE12 diode ssc J Fet marking 2 AW 2SC2873 equivalent 90105 toshiba ultrasonic atomizing SMD TRANSISTOR MARKING 5c | |
101ONContextual Info: TOSHIBA _ [ 7 ] 7. Handling Devices Handling Devices 7.1 Transport Handle devices and packaging materials with care. To avoid damage to the devices, do not toss or drop packages. During transport, ensure that devices are not subjected to |
OCR Scan |
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Contextual Info: CUS08F30 Schottky Barrier Diode Silicon Epitaxial CUS08F30 1. Applications • High-Speed Switching 2. Features 1 Low forward voltage: VF(3) = 0.40 V (typ.) (2) General-purpose USC package, equivalent to SOD-323 and SC-76 packages. 3. Packaging and Internal Circuit |
Original |
CUS08F30 OD-323 SC-76 | |
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Contextual Info: CUS521 Schottky Barrier Diode Silicon Epitaxial CUS521 1. Applications • High-Speed Switching 2. Features 1 Low forward voltage: VF(3) = 0.5 V (max) (2) General-purpose USC package, equivalent to SOD-323 and SC-76 packages. 3. Packaging and Internal Circuit |
Original |
CUS521 OD-323 SC-76 | |
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Contextual Info: CUS10F30 Schottky Barrier Diode Silicon Epitaxial CUS10F30 1. Applications • High-Speed Switching 2. Features 1 Low forward voltage: VF(3) = 0.43 V (typ.) (2) General-purpose USC package, equivalent to SOD-323 and SC-76 packages. 3. Packaging and Internal Circuit |
Original |
CUS10F30 OD-323 SC-76 | |
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Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 23-Jun-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) 5962-9451301MPA ACTIVE CDIP JG |
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23-Jun-2013 5962-9451301MPA 9451301MPA UCC1801 5962-9451302MPA 9451302MPA UCC1802 5962-9451303MPA 9451303MPA UCC1803 | |
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Contextual Info: Product Number: 0672-2-15-01-30-27-10-0 Description: 0672 - Receptacle With No Tail Accepts .015-.025 diameter leads. Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 0672-2-15-01-30-27-10-0 200 - 300 " Tin/Lead over Nickel |
Original |
C17200) | |
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Contextual Info: Product Number: 5301-0-05-15-00-00-01-0 Description: 5301 - Double Tail Header Pin Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 5301-0-05-15-00-00-01-0 10 " Gold over Nickel 00 RoHS Compliant SHELL MATERIAL: BRASS ALLOY UNS C36000 per ASTM B 16 |
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C36000) C/885 2002/95Annex | |
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Contextual Info: Product Number: 0664-3-15-80-06-80-10-0 Description: 0664 - Receptacle With A Turret Accepts .022-.032 diameter leads. Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 0664-3-15-80-06-80-10-0 200 - 300 " Tin matte finish over |
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C17200) | |
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Contextual Info: Product Number: 2325-2-00-80-00-00-07-0 Description: 2325 - Turret Terminal Pin Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 2325-2-00-80-00-00-07-0 200 - 300 " Tin matte finish over Nickel 00 RoHS Compliant SHELL MATERIAL: |
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C36000) C/885 2002/95Annex | |
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Contextual Info: Spec Sheet CERAMIC CAPACITORS High Value Multilayer Ceramic Capacitors High dielectric type LMK107B7225KA-T Features Item Summary 10V, X7R, 2.2 F, ±10%, 0603 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping paper 4000pcs Products characteristics table |
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LMK107B7225KA-T 4000pcs X7R/-55 | |
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Contextual Info: Spec Sheet CERAMIC CAPACITORS High Value Multilayer Ceramic Capacitors High dielectric type EMK316F106ZL-T Features Item Summary 16V, Y5V, 10 F, -20% to 80%, 1206 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping Embossed 2000pcs |
Original |
EMK316F106ZL-T 2000pcs | |
7010.7150Contextual Info: 172322 Non resettable fuses www.schurter.com/pg01_2 Subminiature Fuse, 2.3 x 8 mm, Quick-Acting F, IEC, 125 VAC, 125 VDC IEC 60127-3 • 125 VAC · 125 VDC · Quick-Acting F Description References Standards Weblinks - High breaking capacity Packaging Details |
Original |
com/pg01 125VAC 125VDC E42088 125VAC, 125VDC 13Plastic 37Taped 47Taped 7010.7150 | |
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Contextual Info: Spec Sheet INDUCTORS Wire-wound Chip Power Inductors BR series BRC1608T1R0M Features Item Summary 1.0 H(±20%), 850mA, 520mA, 0603 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping 3000pcs Products characteristics table External Dimensions |
Original |
BRC1608T1R0M 850mA, 520mA, 3000pcs 96MHz 850mA 520mA 140MHz | |
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Contextual Info: Product Number: 3158-0-00-15-00-00-03-0 Description: 3158 - Solderless Pressfit PCB Pin Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 3158-0-00-15-00-00-03-0 10 " Gold over Nickel 00 RoHS Compliant SHELL MATERIAL: |
Original |
C36000) C/885 2002/95Annex | |
NR10050Contextual Info: Spec Sheet INDUCTORS SMD Power Inductors NR10050T3R8N Features Item Summary 3.8 H ±30% , 7300mA, 6800mA Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping 500pcs Products characteristics table External Dimensions -/10050 L 10mm ±0.3 |
Original |
NR10050T3R8N 7300mA, 6800mA 500pcs 100kHz 7300mA 26MHz NR10050 | |
CB2012T100KContextual Info: Spec Sheet INDUCTORS Wire-wound Chip Power Inductors CB series CB2012T100KR Features Item Summary 10 H(±10%), 200mA, 520mA, 0805 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping 3000pcs Products characteristics table External Dimensions |
Original |
CB2012T100KR 200mA, 520mA, 3000pcs 52MHz 200mA 520mA 32MHz CB2012T100K | |
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Contextual Info: Spec Sheet INDUCTORS Multilayer Chip Inductors CK series / CK series S type CK2125R10M-T Features Item Summary 0.1 H(±20%), 500mA, 0805 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping 4000pcs Products characteristics table |
Original |
CK2125R10M-T 500mA, 4000pcs 25MHz 500mA 235MHz | |
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Contextual Info: Product Number: 6218-0-00-15-00-00-03-0 Description: 6218 - Double Tail Header Pin Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 6218-0-00-15-00-00-03-0 10 " Gold over Nickel 00 RoHS Compliant SHELL MATERIAL: BRASS ALLOY UNS C36000 per ASTM B 16 |
Original |
C36000) C/885 2002/95Annex | |
LMK105BJ224KV-FContextual Info: Spec Sheet CERAMIC CAPACITORS High Value Multilayer Ceramic Capacitors High dielectric type LMK105BJ224KV-F Features Item Summary 10V, X5R, 0.22 F, ±10%, 0402 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping paper 10000pcs Products characteristics table |
Original |
LMK105BJ224KV-F 10000pcs LMK105BJ224KV-F | |
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Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 24-Jan-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) 5962-9557401QCA ACTIVE CDIP J |
Original |
24-Jan-2013 5962-9557401QCA 5962-9557401QC SNJ5432J 5962-9557401QDA 5962-9557401QD SNJ5432W JM38510/30501B2A JM38510/ 30501B2A | |
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Contextual Info: Spec Sheet INDUCTORS Wire-wound Chip Inductors LB series LB2016T100M Features Item Summary 10 H(±20%), 155mA, 0806 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping 2000pcs Products characteristics table External Dimensions 0806/2016 |
Original |
LB2016T100M 155mA, 2000pcs 52MHz 155mA 32MHz | |
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Contextual Info: Product Number: 855-22-006-30-001101 Description: Interconnect Header Spring-Loaded Header Vertical Mount Double Row Surface Mount Plating Code: 22 Shell Plating: 20 " Gold over 100 μ" Nickel Packaging: Packaged in Tubes # Of Pins Mill-Max Part Number |
Original |
C36000) C/885 2002/95Annex | |
MILL-MAXContextual Info: Product Number: 3158-0-00-01-00-00-03-0 Description: 3158 - Solderless Pressfit PCB Pin Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 3158-0-00-01-00-00-03-0 200 - 300 " Tin/Lead over Nickel 00 RoHS Compliant SHELL MATERIAL: |
Original |
C36000) C/885 2002/95Annex MILL-MAX | |