PACKAGE 48 BCC Search Results

Contextual Info: BUMP CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC LCC-48P-M02 48-pin plastic BCC Lead pitch 0.50 mm Package width x package length 7.00 mm × 7.00 mm Sealing method Plastic mold Mounting height 0.80 mm MAX LCC-48P-M02 48-pin plastic BCC

9806

Abstract: Package 48 LCC
Contextual Info: BUMP CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 48 PAD PLASTIC LCC-48P-M02 Lead pitch Vertical: 0.5 mm Horizontal: 0.5 mm Package width x package length 7.0 × 7.0 mm Sealing method Plastic mold 48-pads plastic BCC LCC-48P-M02 48-pads plastic BCC (LCC-48P-M02)

LQFP 48

Abstract: HV220 HV2201 HV2221 HV230 HV2301 HV2321 HV2601 HV2631 HV2701
Contextual Info: Selector Guide High Voltage Analog Multiplexer/Switch ICs Device Interface Configuration Supply Voltage Analog Signal Voltage Switch Current V (V) (A) VPP-VNN Switch Resistance typ5 Output Bleed Resistors Package Options Notes 48-Lead LQFP (FG) - 48-Ball fpBGA (GA)

MO-137-AB

Abstract: pericom sot23-6 MO-153-AB PD-1301 MO-150AH PD2001 MO-150AB bcc sot23-5 78 mo 5 PD-1803
Contextual Info: Pericom Standard Packages and Dimensions PERICOM CODE A B C FA FB H J K L NA NB NC P Q R S T U V W PACKAGE TYPE DRAWING NUMBER JE D E C P U B 95 TSSOP-48 TSSOP-56 BQSOP-40 BQSOP-48 BQSOP-80 SC70-5 TQFP-32 LQFP-32 LQFP-52 SSOP-14 SSOP-16 SSOP-20 SSOP-24 SSOP-28

BY128 diode

Abstract: BY128 REMOTE CONTROL IC FP18 HC05 noise cancel MC68HC705L26 Nippon capacitors f10b2
Contextual Info: Freescale Semiconductor, Inc. Ayame MC68HC705L26 MCU Rev 0.3 Tuesday, February 24, 2004 Gordon T. Sasamori CSIC MCU Design Section Tokyo Design Operations Nippon Motorola Ltd. Tokyo 106 Japan The MC68HC705L26 is an MCU device in a 48-pin QFP package with the HC05

Contextual Info: New Products MB39A123 6-Channel DC/DC Converter IC with Synchronous Rectification MB39A123 MB39A123 is a 6-channel DC/DC converter IC with a synchronous rectification function based on the pulse-width modulation PWM type . Each of the six channels built into a BCC-48+ or LQFP-48P package can be controlled and soft-started

1f1-1717-a19

Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
Contextual Info: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O

S028

Abstract: TDA1305T
Contextual Info: Philips Semiconductors Preliminary specification Stereo 1fs data input up-sampling filter with bitstream continuous dual DAC BCC-DAC2 FEATURES TDA1305T mill Easy application 16fs Finite-duration Impulse-Response (FIR) filter incorporated Selectable system clock (fsys) 256fs or 384fs

TDA1305T

Contextual Info: INTEGRATED CIRCUITS DATA SHEET TDA1305T Stereo 1fs data input up-sampling filter with bitstream continuous dual DAC BCC-DAC2 Preliminary specification Supersedes data of September 1994 File under Integrated Circuits, IC01 1995 Dec 08 Philips Semiconductors

TDA1305T

Contextual Info: INTEGRATED CIRCUITS DATA SHEET TDA1305T Stereo 1fs data input up-sampling filter with bitstream continuous dual DAC BCC-DAC2 Preliminary specification Supersedes data of September 1994 File under Integrated Circuits, IC01 1995 Dec 08 Philips Semiconductors

TDA1305T

Abstract: Sine Wave Generation Techniques
Contextual Info: INTEGRATED CIRCUITS DATA SHEET TDA1305T Stereo 1fs data input up-sampling filter with bitstream continuous dual DAC BCC-DAC2 Preliminary specification Supersedes data of September 1994 File under Integrated Circuits, IC01 1995 Dec 08 Philips Semiconductors

TDA1305T

Contextual Info: INTEGRATED CIRCUITS DATA SHEET TDA1305T Stereo 1fs data input up-sampling filter with bitstream continuous dual DAC BCC-DAC2 Preliminary specification Supersedes data of September 1994 File under Integrated Circuits, IC01 1995 Dec 08 Philips Semiconductors

BP317

Abstract: TDA1305T
Contextual Info: Philips Semiconductors Objective specification Stereo 1fs data input up-sampling filter with bitstream continuous calibration dual DAC BCC-DAC2 TDA1305T FEATURES • Easy application • 16fs Finite-duration Impulse-Response (FIR) filter incorporated • Selectable system clock (fsys) 256fs or 384fs

A3232

Abstract: bga 7x7 CSP2 BGA thermal resistance 6x8 bga 6x8 Package BGA 48 PACKAGE thermal resistance
Contextual Info: FBGA Chip Scale BGA Encapsulant Au Wire Die Mold Resin Die Au Wire Polyimide Tape Substrate Solder Laminate Substrate Solder Ball Die Attach Super CSP Si Al SON BCC™ Leadless Redistribution Line Cu Leadframe Metal post (Cu/Barrier) Polyimide Layer SiN

TDA1305T

Abstract: TDA1305 S028
Contextual Info: Philips Semiconductors Objective specification Stereo 1fs data input up-sampling filter with bitstream continuous calibration dual DAC BCC-DAC2 TDA1305T FEATURES • Easy application • 16fs Finite-duration Im pulse-Response (FIR) filter incorporated • Selectable system clock (fsys) 256fs or 384fs

Philips MKP 378

Abstract: capacitor MKP 630V capacitor MKP 1000V MKP power capacitor 74124 MKP BC MKP capacitor Philips film capacitors MKP 1000V 74183
Contextual Info: BCcomponents MISD ROESELARE METALLIZED POLYPROPYLENE FILM AC AND PULSE CAPACITOR MKP 378 MKP/MKP 378 MKP AND MKP/MKP RADIAL POTTED TYPE Modification: Supersedes: HQN-384-17/102 010 Pages: 48 03-02-18 01-12-11 See amendment record MKP 378 MKP/MKP 378 AC and Pulse metallized

AN 7823

Abstract: Techpoint
Contextual Info: BCC Bump Chip Carrier BCC+ exposed paddle without ground ring • Saw singulated format • Package height 0.8mm max. • Square body size (rectangular body designable) • Staggered dual row or single row bump design BCC+ (exposed paddle with ground ring)

TDA1549T

Abstract: 23473
Contextual Info: INTEGRATED CIRCUITS DATA SHEET TDA1549T Stereo 4fs data input up-sampling filter with bitstream continuous calibration DAC BCC-DAC1 Objective specification File under Integrated Circuits, IC01 Philips Semiconductors August 1994 Philips Semiconductors Objective specification

Contextual Info: INTEGRATED CIRCUITS DATA SHEET TDA1549T Stereo 4fs data input up-sampling filter with bitstream continuous calibration DAC BCC-DAC1 Objective specification File under Integrated Circuits, IC01 Philips Semiconductors August 1994 Philips Semiconductors Objective specification

LED audio spectrum analyser circuit diagram

Abstract: automatic speaker recognition microcontroller bass schematic BASS TREBLE CIRCUIT tone control digital TDA1305T TDA1546T MARKING EA1 DC controlled dual volume, balance, tone Bass and schematic diagram in bass treble 75th-order
Contextual Info: INTEGRATED CIRCUITS DATA SHEET TDA1546T Bitstream Continuous Calibration DAC with digital sound processing BCC-DAC Preliminary specification File under Integrated Circuits, IC01 Philips Semiconductors January 1995 Philips Semiconductors Preliminary specification

LED audio spectrum analyser circuit diagram

Abstract: digital BASS BOOST TREBLE tone control digital 10 band LED sound level indicator automatic speaker recognition microcontroller bass audio spectrum analyzer led display 6 pin remote bass boost pin out AUDIO amplifier digital volume control headphone automatic volume control extra bass circuit diagram
Contextual Info: INTEGRATED CIRCUITS DATA SHEET TDA1546T Bitstream Continuous Calibration DAC with digital sound processing BCC-DAC Preliminary specification File under Integrated Circuits, IC01 Philips Semiconductors January 1995 Philips Semiconductors Preliminary specification

BCC418

Abstract: MA4ST350 TQFP44 TQFP48 Manchester code
Contextual Info: BCC 418 SINGLE CHIP TRANSCEIVER DIRECT CONVERSION The BCC418 is a single chip integrated circuit for radio-based spread spectrum communication FHSS . This is an Ultra Low Power and a zero-IF device. The circuit is easily applied and RF knowledge is minimal. It has been developed for the

BCC918

Abstract: MA4ST350 TQFP44 TQFP48 Manchester code 1n 918
Contextual Info: BCC 918 SINGLE CHIP TRANSCEIVER DIRECT CONVERSION The BCC918 is a single chip integrated circuit for radio-based spread spectrum communication FHSS . This is an Ultra Low Power and a zero-IF device. The circuit is easily applied and RF knowledge is minimal. It has been developed for the

MB39A121

Abstract: LQFP-48P
Contextual Info: New Products MB39A121 5-Channel DC/DC Converter IC with Synchronous Rectification MB39A121 MB39A121 is a 5-channel DC/DC converter IC with a synchronous rectification function based on the pulse width modulation type PWM type . Each of five channels built into a BCC-40P or LQFP-48P package can be controlled and soft-started