TECHPOINT Search Results

IRAC1166-100W

Abstract: KNB1560 cp5 94v-0 tdk ferrite PQ3535 CP5 94V0 hughes TERMINAL 200-203 PQ3535 PC44 smd diode f4 4d t3.15A/250V IRF22N60K
Contextual Info: 10 Ang Mo Kio Street 65, #03-18 TechPoint, Singapore 569059 Reference Design # 0618 IRAC1166-100W +16V Low-side Smart Rectification 100W Flyback Demo Board User’s Guide by ISRAEL SERRANO 18 August 2006 Rev.1A 18 August 2006 RD#0618 WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245 Tel: 310 252-7105

JESD51-2

Abstract: exposed QFP 144 100L JESD51-7 Techpoint
Contextual Info: MQFP-ed Exposed Drop-in Heat Slug Metric Quad Flat Pack • 14 x 20mm to 32 x 32mm • 100 to 240 lead count • Lead pitch range from 0.80mm to 0.50mm FEATURES DESCRIPTION • Body Sizes: 14 x 20mm to 32 x 32mm STATS ChipPAC’s Exposed Drop-In Heat Slug Metric Quad

中国

Abstract: S1998
Contextual Info: 高性能肖特基二极管 超小型 0201 表面安装技术封装 Skyworks Solutions Skyworks Solutions, Inc.（思佳讯）是一家先进的模拟器件及混合信号器件的半导体公司。运用其核 心技术开发出的各种标准件与定制的线性产品，被广泛应用于汽车宽带、蜂窝式基础架构、能源管

Contextual Info: Applications • Receiver protection Features • High power, midrange and clean-up designs • Low insertion loss 0.1 dB at 10 GHz • Power handling to 70 dBm • Tight control of basewidth Limiter Diodes Skyworks’ broad product portfolio includes limiter diodes as packaged and bondable

SKY85302-11

Abstract: se2576 SE2565T
Contextual Info: WiFi Connectivity Solutions Table of Contents WiFi Connectivity Solutions Skyworks’ WiFi Connectivity products support four major applications: WiFi Connectivity Product Overview . . . . . . . . . . 3 • Smartphones / Tablets ■ Computing Computing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Wireless Heartbeat Monitoring and Alert system

Abstract: advantages of microcontroller -based relay nanotron Nanotron Technologies .Wireless Heartbeat Monitoring and Alert system Mahr 16 ER 2 way lighting circuit 2.4 ghz adjustable frequency RSSI MICROCONTROLLER WIFI wifi 2.4 ghz
Contextual Info: designfeature By Nicholas Cravotta, Contributing Editor T he range of applications for embedded networks is growing as costs drop, considering that manual device management can be extremely labor-intensive. Industrial EXTENDING THE NETWORK TO DEEPLY EMBEDDED DEVICES BECOMES

techpoint

Abstract: AN 7823 Unbiased HAST 130, 85 RH, 100 Hrs
Contextual Info: FLGA-SD Fine Pitch Land Grid Array - Stacked Die • Stacking of die allows for more functionality in an array molded, cost effective, space saving package solution • Available in 1.2mm TFLGA , 1.0mm (VFLGA), and 0.8mm (WFLGA) maximum thickness • Thinner than FBGA

SKY77733

Abstract: sky77814 3G HSDPA repeater SKY77778-61 SKY77621 diode Marking code L4W SE2435
Contextual Info: Product Selection Guide November 2014 Skyworks Solutions Skyworks Solutions, Inc. is an innovator of high performance analog semiconductors. Leveraging core technologies, Skyworks supports automotive, broadband, wireless infrastructure, energy management, GPS, industrial, medical, military, wireless networking, smartphone, and tablet

Techpoint

Abstract: 100L JESD51-2 JESD51-7 lqfp 7x7 tray QFP 128 bonding
Contextual Info: LQFP Low Profile Quad Flat Pack • 7 x 7mm to 28 x 28mm body sizes • 32 to 208 lead counts • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 28 x 28mm STATS ChipPAC’s LQFP is a low profile 1.4mm version of the QFP. The LQFP is a leadframe based, plastic encapsulated

DUAL ROW QFN leadframe

Abstract: QFN tray qfn 4x4 JEDEC qfn tray tray qfn 8x8 tray qfn 6x6 QFN tray 8x8 tray qfn 9x9 QFN 64 8x8 PACKAGE TRAY AN 7823 JEDEC qfn tray 5x5
Contextual Info: QFN Quad Flat No-Lead Package • Punch or Saw singulated formats • Body sizes from 2 x 2mm to 12 x 12mm • Pin counts from 4L to 156L • Square or rectangular body sizes • Leads on four sides of the body QFN • Leads on two opposing sides of the

SKY85302-11

Contextual Info: Smart Energy Solutions Table of Contents Smart Energy Solutions Applications Smart Energy Product Overview . . . . . . . . . . . . . . . . . 3 Block Diagrams Short Range Radio . . . . . . . . . . . . . . . . . . . . . . . . . 3 Smart Meter Communication Module Simplified . . . . . . . . . . . . . . . . . . . . . . . . 4

sky77814

Abstract: SKY85309 SKY77627-11 SKY77621-31
Contextual Info: New Products Winter 2014 Table of Contents New Products Featured New Products by Market Smartphones, Handsets, and Tablets . . . . . . . 3 Consumer Networking . . . . . . . . . . . . . . . . . . 4 Wearables . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

100L

Abstract: JESD51-2 JESD51-7 32 QFP PACKAGE thermal resistance tqfp 7x7 1.4 tray tqfp 7x7 tray tqfp 64 thermal resistance Techpoint
Contextual Info: TQFP Thin Profile Quad Flat Pack • 7 x 7mm to 14 x 14mm • 32 to 128 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 14 x 14mm The Thin Profile Quad Flat Pack TQFP belongs to STATS ChipPAC’s QFP family. At 1.0mm body thickness, the TQFP

AN 7823

Abstract: Techpoint
Contextual Info: BCC Bump Chip Carrier BCC+ exposed paddle without ground ring • Saw singulated format • Package height 0.8mm max. • Square body size (rectangular body designable) • Staggered dual row or single row bump design BCC+ (exposed paddle with ground ring)

Contextual Info: Skyworks Solutions, Inc. Mexicali Operations The Skyworks Promise Skyworks’ state-of-the-art facility in Mexicali, Mexico delivers world-class assembly, test and finishing services for a broad portfolio of semiconductor solutions. We play an integral role in the production and delivery of analog, mixed-signal and RF semiconductors

SKY85703

Abstract: SKY77758
Contextual Info: New Products Spring 2014 Table of Contents New Products Featured New Products by Market Smartphones, Handsets and Tablets . . . . . . . 3 Consumer Networking . . . . . . . . . . . . . . . . . . 5 Smart Energy Solutions . . . . . . . . . . . . . . . . . . 7

SKY77733

Abstract: QUALCOMM FLIP CHIP ASSEMBLY SKY77765 aat2430 aat3604 aat140
Contextual Info: Product Selection Guide June 2013 Skyworks Solutions Skyworks Solutions, Inc. is an innovator of high performance analog semiconductors. Leveraging core technologies, Skyworks supports automotive, broadband, wireless infrastructure, energy management, GPS, industrial, medical, military, wireless networking, smartphone, and tablet

Contextual Info: Applications • Tx/Rx and diversity – WLAN/Bluetooth – Energy management – RFID –UHF/VHF: public safety bands • WCDMA handsets and data cards • 3G/4G wireless networks • LNB/DBS matrix • Microwave applications up to 8 GHz • Multi-antenna

Cj 41 48

Abstract: DIODE AA116
Contextual Info: Wireless Infrastructure Solutions Table of Contents Wireless Infrastructure Solutions Discrete to Highly Integrated Solutions . . . . . . . . 3 Skyworks Solutions offers a broad portfolio of RF/ microwave products for wireless communications infrastructure systems, including cellular telephone

Contextual Info: Applications • White LED drivers • Smartphones • Tablets • Digital still cameras • Digital video cameras • LED flash lights Features • VIN range: 2.5 to 5.5 V • High efficiency • High accuracy • Common cathode and common anode solutions

ABB Group

Abstract: diagnostics SC300E Techpoint rh10
Contextual Info: - Triguard SC300E New Product Data Sheet -TriBuild 1.41 – Diagnostics TriBuild 1.41 includes the new Graphical Diagnostics with the existing Triguard for Windows ladder based configuration tools Graphical Diagnostic displays in the TriBuild work bench enable direct access to primary and consequential system

metcal apr 5000

Abstract: NZA-555-555-CGA APR-5000 APR-5000-XLS APR-5000-XL reflow temperature bga laptop NZA-270-270 PBGA 256 reflow profile NZA-350-350-CGA LGA rework
Contextual Info: Advance Package Rework Systems OK O K I N T E R N A T I O N A LT M T o o l s OK International has been a leading manufacturer of tools for the electronics assembly work bench for almost 60 years. And, as the industry has evolved, our rework and repair tools have

STATS ChipPAC

Abstract: AN 7823 EP 603 LQFP Package LQFP Package tray QFP JEDEC tray 64 leads qfp 32 QFP PACKAGE thermal resistance Techpoint
Contextual Info: QFP-SD Stacked Die Quad Flat Pack • Stacking of die enables more functionality and integration in a conventional QFP package FEATURES DESCRIPTION • Combining devices into one package reduces PCB real estate and cost STATS ChipPAC’s Stacked Die QFP offering includes LQFPSD, LQFP-ep-SD and TQFP-ep-SD. LQFP-SD is a stacked die

VFBGA 120

Abstract: VFBGA package tray tray 23X23 10x14 239.2 AN 7823 chippac tray 8X14 vFBGA* 96 bALL
Contextual Info: FBGA-SD Fine Pitch Ball Grid Array - Stacked Die • FBGA-SD: Laminate substrate based enabling 2 & 4 layers of routing flexibility • FBGA-T-SD: Single metal layer tape based substrate with dense routing & good electrical performance • Available in 1.4mm LFBGA-SD , 1.2mm (TFBGASD/TFBGA-T-SD), 1.0mm (VFBGA-SD/VFBGA-TSD) & 0.80mm (WFBGA-SD) maximum package