OUTLINE PACKAGES Search Results

34-pin

Contextual Info: Package Diagram Shrunk Small Outline Packages 20-Pin Shrunk Small Outline Packag O20 1 Package Diagram 28-Lead Shrunk Small Outline Package O28 34-Pin Shrunk Small Outline Package O34 2 Package Diagram 48-Lead Shrunk Small Outline Package O48 56-Lead Shrunk Small Outline Package O56

TSOP 48 Package

Abstract: TSOP 56 Package Application of Z44 Small-outline The Diode Data Book with Package Outlines transistor outline package 3 TSOP 44 Package TSOP-II 44 Z-56
Contextual Info: Package Diagram Thin Small Outline Packages 16-Lead Thin Shrunk Small Outline Package 4.40 MM Body Z16 1 Package Diagram 28-Lead Thin Small Outline Package Z28 Thin Small Outline Packages 2 Package Diagram 32-Lead Thin Small Outline Package Z32 3 Package Diagram

Application of Z44

Contextual Info: Package Diagram Thin Small Outline Packages 8-Lead Thin Shrunk Small Outline Package 4.40 MM Body Z8 51-85093 1 Package Diagram 16-Lead Thin Shrunk Small Outline Package (4.40 MM Body) Z16 51-85091 2 Package Diagram 28-Lead Thin Small Outline Package Z28

CERAMIC LEADLESS CHIP CARRIER

Abstract: leadless chip carrier 28-pin 20 PIN LEADLESS CHIP CARRIER MIL-STD-1835 Q1 Package SFE10.7MS2G-A
Contextual Info: Package Diagram Quarter Size Outline Packages 16-Lead Quarter Size Outline Q1 20-Lead Quarter Size Outline Q5 1 Package Diagram 24-Lead Quarter Size Outline Q13 Ceramic Windowed Leadless Chip Carriers 32-Pin Windowed Rectangular Leadless Chip Carrier Q55 MIL–STD–1835 C–12

51-85062-C

Abstract: package
Contextual Info: Package Diagram Shrunk Small Outline Packages 20-Lead 5.3 mm Shrunk Small Outline Package O20 51-85077-*C 1 Package Diagram 24-Lead (5.3 mm) Shrunk Small Outline Package O24 51-85078-* 2 Package Diagram 28-Lead (5.3 mm) Shrunk Small Outline Package O28

O28 Package

Abstract: small outline
Contextual Info: Package Diagram Shrunk Small Outline Packages 20-Pin Shrunk Small Outline Package O20 51-85077-B 1 Package Diagram 28-Lead 210-Mil Shrunk Small Outline Package O28 51-85079-B 28-Lead (150-Mil) Shrunk Small Outline Package O29 51-85072-B 2 Package Diagram

ZA32

Contextual Info: Package Diagram Small Thin Small Outline Packages 32-Lead Small Thin Small Outline Package ZA32 1

54-LEAD

Abstract: 173e
Contextual Info: Package Diagram Thin Small Outline Packages 8-Lead Thin Shrunk Small Outline Package 4.40 MM Body Z8 51-85093 1 Package Diagram 14-Lead Thin Shrunk Small Outline Package (4.40-mm Body) Z14 51-85117 2 Package Diagram 16-Lead Thin Shrunk Small Outline Package (4.40 MM Body) Z16

Contextual Info: Package Diagram Thin Small Outline Packages 8-Lead Thin Shrunk Small Outline Package 4.40 MM Body Z8 51-85093 1 Package Diagram 14-Lead Thin Shrunk Small Outline Package (4.40-mm Body) Z14 51-85117 2 Package Diagram 16-Lead Thin Shrunk Small Outline Package (4.40 MM Body) Z16

CERAMIC LEADLESS CHIP CARRIER

Abstract: leadless chip carrier 28-pin
Contextual Info: Package Diagram Quarter Size Outline Packages 16-Lead Quarter Size Outline Q1 51-85053-B 20-Lead Quarter Size Outline Q5 51-85054-B 1 Package Diagram 24-Lead Quarter Size Outline Q13 51-85055-B Ceramic Windowed Leadless Chip Carriers 32-Pin Windowed Rectangular Leadless Chip Carrier Q55

leadless chip carrier

Abstract: Q61 Package
Contextual Info: Package Diagrams Quarter Size Outline Packages 16-Lead Quarter Size Outline Q1 51-85053-B 20-Lead Quarter Size Outline Q5 51-85054-B 1 Package Diagrams 24-Lead Quarter Size Outline Q13 51-85055-B 2 Package Diagrams Ceramic Windowed Leadless Chip Carriers 32-Pin Windowed Rectangular Leadless Chip Carrier Q55

MIL-STD-1835

Abstract: leadless chip carrier Q61 Package
Contextual Info: Package Diagrams Quarter Size Outline Packages 16-Lead Quarter Size Outline Q1 51-85053-B 20-Lead Quarter Size Outline Q5 51-85054-B 1 Package Diagrams 24-Lead Quarter Size Outline Q13 51-85055-B 2 Package Diagrams Ceramic Windowed Leadless Chip Carriers 32-Pin Windowed Rectangular Leadless Chip Carrier Q55

SN74HC02

Contextual Info: SN54HC02, SN74HC02 QUADRUPLE 2-INPUT POSITIVE-NOR GATES SCLS076A - DECEMBER 1982 - REVISED JANUARY 1996 Package Options Include Plastic Small-Outline D , Shrink Small-Outline (DB), Thin Shrink Small-Outline (PW), and Ceramic Flat (W) Packages, Ceramic Chip

Contextual Info: SN54HC4020, SN74HC4020 14-BIT ASYNCHRONOUS BINARY COUNTERS SCLS158C – DECEMBER 1982 – REVISED FEBRUARY 2000 Package Options Include Plastic Small-Outline D , Shrink Small-Outline (DB), Thin Shrink Small-Outline (PW), and Ceramic Flat (W) Packages, Ceramic Chip

Contextual Info: SN54HC4040, SN74HC4040 12-BIT ASYNCHRONOUS BINARY COUNTERS SCLS160B – DECEMBER 1982 – REVISED MAY 1997 Package Options Include Plastic Small-Outline D , Shrink Small-Outline (DB), Thin Shrink Small-Outline (PW), and Ceramic Flat (W) Packages, Ceramic Chip

Contextual Info: SN54HC4020, SN74HC4020 14-BIT ASYNCHRONOUS BINARY COUNTERS SCLS158C – DECEMBER 1982 – REVISED FEBRUARY 2000 Package Options Include Plastic Small-Outline D , Shrink Small-Outline (DB), Thin Shrink Small-Outline (PW), and Ceramic Flat (W) Packages, Ceramic Chip

Contextual Info: SN54HC4020, SN74HC4020 14-BIT ASYNCHRONOUS BINARY COUNTERS SCLS158C – DECEMBER 1982 – REVISED FEBRUARY 2000 Package Options Include Plastic Small-Outline D , Shrink Small-Outline (DB), Thin Shrink Small-Outline (PW), and Ceramic Flat (W) Packages, Ceramic Chip

RCTR12

Abstract: HC4040 SN54HC4040 SN74HC4040
Contextual Info: SN54HC4040, SN74HC4040 12-BIT ASYNCHRONOUS BINARY COUNTERS SCLS160B – DECEMBER 1982 – REVISED MAY 1997 Package Options Include Plastic Small-Outline D , Shrink Small-Outline (DB), Thin Shrink Small-Outline (PW), and Ceramic Flat (W) Packages, Ceramic Chip

sn74hc32

Abstract: SN54HC32
Contextual Info: SN54HC32, SN74HC32 QUADRUPLE 2-INPUT POSITIVE-OR GATES SC LS 200A - DECEMBER 1982 - REVISED JANUARY 1996 Package Options Include Plastic Small-Outline D , Shrink Small-Outline (DB), Thin Shrink Small-Outline (PW), and Ceramic Flat (W) Packages, Ceramic Chip

Mitsubishi

Abstract: outline packages
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGING MATERIAL, TREATMENT AND OUTLINE DRAWINGS 4. PACKAGING MATERIAL, TREATMENT AND OUTLINE DRAWINGS Each type of individual pack, inner and outer cartons are specified here, together with an outline drawing. The content indication labels also

RCTR12

Abstract: HC4040 MPDI002A MS-001 SN54HC4040 SN74HC4040
Contextual Info: SN54HC4040, SN74HC4040 12-BIT ASYNCHRONOUS BINARY COUNTERS SCLS160A – DECEMBER 1982 – REVISED JANUARY 1996 Package Options Include Plastic Small-Outline D , Shrink Small-Outline (DB), Thin Shrink Small-Outline (PW), and Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and

SN54HC4040

Abstract: HC4040 SN74HC4040 RCTR12
Contextual Info: SN54HC4040, SN74HC4040 12-BIT ASYNCHRONOUS BINARY COUNTERS SCLS160A – DECEMBER 1982 – REVISED JANUARY 1996 Package Options Include Plastic Small-Outline D , Shrink Small-Outline (DB), Thin Shrink Small-Outline (PW), and Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and

nec 44 pin LQFP

Abstract: BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages
Contextual Info: CHAPTER 3 SURFACE MOUNT PACKAGES 3.1 LINEUP OF SURFACE MOUNT IC PACKAGES 3.2 LIST OF SURFACE MOUNT IC PACKAGES 1 Plastic SOP (Small Outline Package) (2) Ceramic WSOP (Small Outline Package with Window) (3) Plastic shrink SOP (Shrink Small Outline Package)

SN74HC04

Abstract: SN54HC04
Contextual Info: SN54HC04, SN74HC04 HEX INVERTERS SCLS078B – DECEMBER 1982 – REVISED MAY 1997 D Package Options Include Plastic Small-Outline D , Shrink Small-Outline (DB), Thin Shrink Small-Outline (PW), and Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and