OUTLINE Search Results

Contextual Info: GaAs IRED S PHOTO-TRANSISTOR TLP126 T IP I2 6 P R O G R A M M A B L E C O N TR O LLERS A C /D C -IN P U T M O D U L E T E L E C O M M U N IC A T IO N The TOSHIBA MINI FLAT COUPLER TLP126 is a small outline coupler, suitable for surface mount assembly.

SN74HC74

Contextual Info: SN54HC74, SN74HC74 DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH CLEAR AND PRESET _ SCLS094A - DECEMBER 1982 - REVISED JANUARY 1996 Package Options Include Plastic Small-Outline D , Shrink Small-Outline (DB), Thin Shrink Small-Outline (PW), and

Contextual Info: SN5409, SN54LS09, SN54S09, SN7409, SN74LS09, SN74S09 QUADRUPLE 2-INPUT POSITIVE-AND GATES WITH OPEN-COLLECTOR OUTPUTS DECEMBER 1 9 8 3 -R E V IS E D M A R C H 1 9 8 8 Package Options Include Plastic "Sm all Outline" P ackages, Ceram ic Chip Carriers and Flat P ackages, and Plastic and Ceram ic

IC-524

Abstract: 74as
Contextual Info: SN 54AS881A, S N 74AS 8 8 1A ARITH M ETIC LOGIC UNITS/FUNCTION G ENERATORS D 2 6 6 1 , DECEMBER 1 9 8 2 - • Package Options Include Plastic "Small Outline" Packages, Both Plastic and Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-mil DIPs •

sn 74 ls 11 020 n

Abstract: LS1020A LS102
Contextual Info: SN 54A LS1020A , S N 74 A LS 1 020 A DUAL 4-INPUT POSITIVE-NAND BUFFERS D2661, APRIL 1982-REVISED MAY 1986 • Buffer Version of 'A LS20B • Package Options Include Plastic "Sm all Outline" Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-m il

IC SN74HC

Abstract: SN74HCTOO SN74HC
Contextual Info: SN54HCT00, SN74HCT00 QUADRUPLE 2-INPUT POSITIVE NANO GATES D 3 2 4 3 , NOVEMBER 1968 Inputs are TTL-Voftage Compatible S N 54H C T00 S N 74H C T00 Package Options Include Plastic "Small Outline" Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-mil

Contextual Info: SN74LVC540 OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS JA N U A R Y 1993 • Space-Saving Package Option: Shrink Small-Outline Package DB Features EIAJ 0.65-mm Lead Pitch DB, DW, OR PW PACKAGE (TOP VIEW) • EPIC (Enhanced-Performance implanted CMOS) Submicron Process

optocoupler P 521

Abstract: 521 optocoupler 731 OPTOCOUPLER 64 LEAD DIP OUTLINE toshiba tlp
Contextual Info: 5 -2 Standard Lead Forming 5-2-1) SURFACE MOUNT LEAD BEND OPTIONS LF1) (LF4) (LF5) “ LF5 H f» Outline 8 pin 4 pin 4 • J t I A_a_a_a n a y uuy 3 1 4 16pin 6 pin • 5 4 Pi f l FI ¿ .a fi n n n n a U S“ B i u u u u u u u u > 3 i e oT he photocoupler line-up with lead ben­

Contextual Info: REFERENCE DATA KV1 8 4 5K S P E C I F I C A T I ON •TABLE OF CONTENTS 1. PURPOSE 2. T O K O PART NUMBER 3. APPLICATIONS 4. STRUCTURE 5. PA CKAGE OUTLINE 6. PIN LAYOUT 7. PACKAGE OUTLINE D I M E N S I O N S / S IG N A T U R E Drawn By MARKING 8. ABSOLUTE MAXIMUM RATINGS

logic diagram of 7432

Abstract: Texas Instruments TTL 7432
Contextual Info: SN5432, SN 54LS32, SN54S32. SN7432, SN74LS32, SN74S32 QUADRUPLE 2-INPUT POSITIVE-OR GATES DECEMBER 1983-REVISED MARCH 1988 Package Options Include Plastic "Small Outline" Packages, Ceramic Chip Carriers and Flat Packages, and Plastic and Ceramic DIPs • SN 5432. SN 54LS32, SN 54S 32 . . . J OR W PACKAGE

BENT LEAD transistor TO-92 Outline Dimensions

Abstract: 2SC2712 equivalent 4TE12 diode ssc J Fet marking 2 AW 2SC2873 equivalent 90105 toshiba ultrasonic atomizing SMD TRANSISTOR MARKING 5c
Contextual Info: 5. PA C K A G E FO R M S 5.1 PACKAGE FORM SELECTION TABLE 5.1.1 SUPER-MINI DEVICES S-MINI (SC-59 , SMQ (SC-61), SMV, SM6) PACKAGING FORM PACKAGE SPECIFI­ CATION OUTLINE Pack PACKAGE UNIT - e TE85L Taping EXTERIOR Unit: mm » » » 3000 pcs/ Reel TE85R TE85N

Contextual Info: SN54LS15, SN54S15, SN74LS15, SN74S15 TRIPLE 3 INPUT POSITIVE AND GATES WITH OPEN-COLLECTOR OUTPUTS A P R IL 1 9 8 5 — R E V IS E D M A R C H Package Options Include Plastic "Sm all Outline" Packages, Ceramic Chip Carriers and Flat Packages, and Plastic and Ceramic

Contextual Info: SN54F20, SN74F20 DUAL 4-INPUT POSITIVE-NAND GATES D2932, MARCH 1987-REVISED JANUARY 1989 • Package Options Include Plastic "Small Outline" Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-mil DIPs S N 5 4 F 2 0 . . . J PACKAGE S N 7 4 F 2 0 . . . 0 OR N PACKAGE

Contextual Info: SN54ALS11A, SN54AS11, SN74ALS11A, SN74AS11 TRIPLE 3-INPUT POSITIVE-AND GATES SDAS009C - MARCH 1984 - REVISED DECEMBER 1994 • Package Options Include Plastic Small-Outline D Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs

Contextual Info: S IM 54ALS1 0 1 0A , SIM 74ALS1 □ 1 0 A TRIPLE 3 INPUT POSITIVE N A N D B U FFE R S D 2 6 6 1 , A P R IL 1 9 8 2 • Buffer Version of 'A LS 10A • Package Outline” Addition Ceramic S N 74A LS 1010A . . . D O R N • -R E V IS E D M A Y 1 9 8 6 S N 5 4 A L S 1 0 1 0 A . . . J PACKAGE

74as32

Contextual Info: SN54ALS32, SN54AS32, SN74ALS32, SN74AS32 QUADRUPLE 2-INPUT POSITIVE-OR GATES D 2 6 6 1 , A P R IL 1 9 8 2 - R E V I S E D M A Y 1 9 8 6 • Package Options Include Plastic "Sm all Outline" Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-m il

Contextual Info: GaAs IRED a PHOTO-TRANSISTOR TLP130 TLP130 U nit in mm P R O G R A M M A B L E CO NTRO LLER S A C /D C - IN P U T M O D U L E T E L E C O M M U N I C A T IO N The TOSHIBA MINI FLAT COUPLER TLP130 is a small outline coupler, suitable for surface m ount assembly.

Contextual Info: SN74F2244 25Q OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS _ SDFS095 - NOVEMBER 1993 • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers * Package Options Include Plastic Small-Outline Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic

Contextual Info: SN74LVC841 10-BIT BUS-INTERFACE D-TYPE LATCH WITH 3-STATE OUTPUTS M ARCH 1993 OB, DW, OR PW PACKAGE TOP VIEW • Space-Saving Package Option: Shrink Small-Outline Package (DB) Features EIAJ 0.65-mm Lead Pitch • EPIC (Enhanced-Performance Implanted

IC 7422

Abstract: 7422 74LS22D as 5422 T3228
Contextual Info: SN5422, SN 54LS22, SN54S22, S N 7422 , S N 74 LS 2 2 , SN 74S22 D U A L 4-INPUT POSITIVE N A N D G A TES W ITH O P EN C O LLEC TO R O U TPU TS DECEMBER 1983 - REVISED MARCH 19B8 Package Options Include Plastic "Small Outline” Packages, Ceramic Chip Carriers

TLCS-90

Contextual Info: TO SH IBA TMP90C846 CMOS 8-BIT MICROCONTROLLER TMP90C846F 1. OUTLINE AND CHARACTERISTICS The TMP90C846 is an advanced 8-bit microcontroller developed for application in the control of HDD/FDD high-speed mechanisms. The built-in functions include a high­ speed A/D converter minimum sampling rate: 400ns @ 10MHz with an external start

S3036

Contextual Info: 6. Contact Sensor Module 6-1 Outline The contact sensor m odule is an im age reader unit which integrates an im age sensor, lens, light source and control circuit. T he contact sensor m odule has the follow ing fea­ tures. 1 O ptical design is not necessary

Contextual Info: SN54F30, SN74F30 8-INPUT POSITIVE-NANO GATES D2932, MARCH 1987-R E V ISE D JANUARY 1989 SN 54F30 . . . J PACKAG E SN 74F30 D OR N P A C K A G E Package Options Includa Plastic "Sm all Outline" Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-mII

74ALS233

Contextual Info: S N 5 4 A LS 2 3 3 A , S N 7 4 A LS 2 3 3 A 1 6 x 5 ASYNCHRONOUS FIRST-IN FIRST-OUT MEMORIES D 2 8 7 6 . JA N U A R Y 1 9 8 6 - Package Options Include Plastic "Small Outline" Packages. Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-mil DIPs S N 54A LS 233A . . . J PACKAGE