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TC75S102F
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Toshiba Electronic Devices & Storage Corporation
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Operational Amplifier, 1.5V to 5.5V, I/O Rail to Rail, IDD=0.27μA, SOT-25 |
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77709-727LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single row, Double Body, Polarization, 9 Positions, 2.54mm (0.100in) Pitch |
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51939-727LF
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Amphenol Communications Solutions
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PwrBlade®, Power Connectors, 3ACP 4DCP 12S Right Angle Header, Solder To Board |
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67997-270HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 70 Positions, 2.54 mm (0.100in) Pitch |
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67997-272HLF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100in) Pitch |
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68697-272HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Double Row, 72 Positions, 2.54mm (0.100in)Pitch. |
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