OCT23 Search Results

36 pin amphenol

Abstract: 31010 AMPHENOL MDB-A26PE-860 S7001R STYCAST catalyst 11 MDB-A26 stycast 2651 S7001
Contextual Info: 7 8 6 5 3 4 1 2 REV - DESCRIPT - DATE - APPRVD A - UPDATED NOTES - 2006/06/16 - YK. B - CHG SOLDER TAILS - 2006/07/18 - YK. C - UPDATED MATERIALS - 2006/08/18 - YK. D-STAKING ADDED: NOT APPROVED BY CUSTOMER-JUNE28,07-A.G. METAL DIE CAST OUTER SHELL F F E - O RING SIZE CHNAGED - SEPT28,07 - A.G.

stycast 2651

Abstract: MDB-A26 S7001 32MM 33-30-13 MDB-A26PE-860 2651 stycast P-MDB-A26PE-860
Contextual Info: 7 8 6 5 3 4 1 2 REV - DESCRIPT - DATE - APPRVD A - UPDATED NOTES - 2006/06/16 - YK. B - CHG SOLDER TAILS - 2006/07/18 - YK. C - UPDATED MATERIALS - 2006/08/18 - YK. D-STAKING ADDED: NOT APPROVED BY CUSTOMER-JUNE28,07-A.G. METAL DIE CAST OUTER SHELL F F E - O RING SIZE CHNAGED - SEPT28,07 - A.G.

AN2623

Abstract: MC68HC908QY4 LM56 LM66 MAX6610 MAX6611 MC33399 LEDdisplay Temperature sensor in automobile HVAC system mc68hc908QY4 programmer circuit
Contextual Info: Freescale Semiconductor, Inc. Application Note AN2623/D 12/2003 Freescale Semiconductor, Inc. LIN Temperature Sensor Using the MC68HC908QT/QY MCU By Jiri Kuhn Motorola Czech System Laboratories Roznov p.R., Czech Republic Introduction Many applications in the automobile industry and other areas require

Contextual Info: BSM 10 GD 60 DL IGBT Power Module Preliminary data • 600V NPT Technology • Solderable Power module • 3-phase full-bridge • Including fast free-wheel diodes • Package with insulated metal base plate Type VCE IC BSM 10 GD 60 DL 600V 11.5A ECONOPACK 1

vqe 24 d

Abstract: vqe 24 e 100gd60
Contextual Info: euoec F B S M 1 0 0 G D 6 0 DL IGBT Power Module Preliminary data Él • 600V NPT Technology • Solderable Power module »,05876 • 3-phase full-bridge • Including fast free-wheel diodes • Package with insulated metal base plate Type BSM 100 GD 60 DL

Contextual Info: MCC TM Micro Commercial Components Micro Commercial Components Corp. Products End of Life Notification Issue date: Oct-23th-2008 Last Buy Date :Dec-31th-200 8 Note: All LTB orders need to be shipped before LTB date. Description and Purpose: MCC has undergone a review of its core business and products , and

stycast 2651

Abstract: S7001 2651 stycast S7001R
Contextual Info: 7 8 6 5 3 4 1 2 REV - DESCRIPT - DATE - APPRVD A - UPDATED NOTES - 2006/06/16 - YK. B - CHG SOLDER TAIL - 2006/07/19 - YK. C - UPDATED MATERIALS - 2006/08/18 - YK. METAL DIE CAST OUTER SHELL D - STAKING ADDED: NOT APPROVED BY CUSTOMER - MAY 23,07 F F E - O RING SIZE CHANGED - SEPT28,07 - A.G.

MJ423

Contextual Info: MCC TM Micro Commercial Components Micro Commercial Components Corp. Products End of Life Notification Issue date: Oct-23th-2008 Last Buy Date :Dec-31th-2008 Description and Purpose: MCC has undergone a review of its core business and products , and determined to discontinue below products:

AUB0812L-9X41

Abstract: DELTA fan
Contextual Info: SPECIFICATION FOR APPROVAL Customer. Description. Part No. Delta Model No. Sample Issue No. Sample Issue Date. DPC Superflo FAN AUB0812L-9X41 REV. REV. OCT-23-2009 PLEASE SEND ONE COPY OF THIS SPECIFICATION BACK AFTER YOU SIGNED APPROVAL FOR PRODUCTION PRE-ARRANGEMENT.

S7001R

Abstract: P-MDB-E09PE-860 stycast 2651 amphenol 31-10 2651 stycast
Contextual Info: 7 8 6 5 3 4 1 2 REV - DESCRIPT - DATE - APPRVD A - UPDATED NOTES - 2006/06/16 - YK. B - CHG SOLDER TAILS - 2006/07/19 - YK. METAL DIE CAST OUTER SHELL TWO STAGE POTTING C - UPDATED MATERIALS - 2006/08/18 - YK. D - STAKING ADDED: NOT APPROVED BY CUSTOMER - JUNE 16,07

LIN source code

Abstract: AN2623 Temperature sensor in automobile HVAC system HVAC lin bus ic 7805 5 volt regulator LIN BUS MC68HC908QT/QY temp sensor project LM56 LM66
Contextual Info: Freescale Semiconductor, Inc. Application Note AN2623/D 12/2003 Freescale Semiconductor, Inc. LIN Temperature Sensor Using the MC68HC908QT/QY MCU By Jiri Kuhn Motorola Czech System Laboratories Roznov p.R., Czech Republic Introduction Many applications in the automobile industry and other areas require

vqe 24 d

Abstract: JS7J
Contextual Info: euoec B S M 1 0 G D 6 0 DL F IGBT Power Module Preliminary data • 600V NPT Technology • Solderable Power module • 3-phase full-bridge • Including fast free-wheel diodes • Package with insulated metal base plate Type BSM 10 GD 60 DL VbE 600V h 11.5A

vqe 24 d

Contextual Info: euoec F BSM 50 GD 60 DL IGBT Power Module Prelim inary data • 600V NPT Technology • Solderable Power module • 3-phase full-bridge • Including fast free-wheel diodes • Package with insulated metal base plate Type VbE h Package O rdering Code BSM 50 GD 60 DL

Contextual Info: BSM 100 GD 60 DL IGBT Power Module Preliminary data • 600V NPT Technology • Solderable Power module • 3-phase full-bridge • Including fast free-wheel diodes • Package with insulated metal base plate Type VCE IC Package Ordering Code BSM 100 GD 60 DL

BF998

Abstract: G1 TRANSISTOR Marking G2 mosfet tetrode TRANSISTOR mosfet BF998 BF998 marking code BF marking code BF transistor datasheet transistor marking G1 electrostatic discharge
Contextual Info: BF 998R Silicon N-Channel MOSFET Tetrode • Short-channel transistor with high S/C quality factor • For low noise, gain-controlled input stages up to 1 GHz Reverse pinout version of BF998 ESD: Electrostatic discharge sensitive device, observe handling precaution!

Contextual Info: BSM 20 GD 60DLE3224 Circuit Diagram Package Outlines Dimensions in mm Weight: 180 g 1 Oct-23-1997

igbt module bsm 100 gb 60 dl

Contextual Info: BSM 50 GB 60 DL IGBT Power Module Preliminary data • 600V NPT Technology • Half-bridge • Including fast free-wheeling diodes • Package with insulated metal base plate Type VCE IC Package Ordering Code BSM 50 GB 60 DL 600V 65A HALF-BRIDGE 1 Q67050-A1000-A70

Contextual Info: BSM 30 GD 60DLE3224 Circuit Diagram Package Outlines Dimensions in mm Weight: 180 g 1 Oct-23-1997

vqe 24 d

Contextual Info: euoec F B S M 1 5 G D 6 0 DL IGBT Power Module Preliminary data • 600V NPT Technology • Solderable Power module • 3-phase full-bridge • Including fast free-wheel diodes • Package with insulated metal base plate Type VbE h Package Ordering Code BSM 1 5 G D 6 0 DL

vqe 24 e

Abstract: vqe 24 d
Contextual Info: euoec BSM 50 GB 60 DL F IGBT Power Module Prelim inary data • 600V NPT Technology • Half-bridge • Including fast free-wheeling diodes • Package with insulated metal base plate Type VbE BSM 50 GB 60 DL 600V 65A Package O rdering Code HALF-BRIDGE 1 Q67050-A1000-A70

Contextual Info: BSM 200 GD 60 DN2 IGBT Power Module Target data sheet • Solderable Power module • 3-phase full-bridge • Including fast free-wheel diodes • Package with insulated metal base plate Type VCE IC Package Ordering Code BSM 200 GD 60 DN2 600V 235A ECONOPACK 3

Contextual Info: BCR 42PN NPN/PNP Silicon Digital Transistor Array 4
Switching circuit, inverter, interface circuit, 5 6 driver circuit
Two galvanic internal isolated NPN/PNP Transistors in one package
Built in bias resistor (R1=22k, R2 =47k) 2 3 1 VPS05604 C1 B2

vqe 24 e

Abstract: vqe 24 d
Contextual Info: euoec F BSM 20 GD 60 DL IGBT Power Module Prelim inary data • 600V NPT Technology • Solderable Power module • 3-phase full-bridge • Including fast free-wheel diodes • Package with insulated metal base plate Type VbE h Package O rdering Code BSM 20 GD 60 DL

Contextual Info: BSM 75 GD 60 DL IGBT Power Module Target data sheet • 600V NPT Technology • Solderable Power module • 3-phase full-bridge • Including fast free-wheel diodes • Package with insulated metal base plate Type VCE IC Package Ordering Code BSM 75 GD 60 DL