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NIC Components Corp


NIC Components Corp NEXC224Z3.5V10.5X5.5TRF - Tape and Reel (Alt: NEXC224Z3.5V10.5X5.5TRF)
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Avnet Americas	NEXC224Z3.5V10.5X5.5TRF	Tape & Reel		20 Weeks	1,000	1 - 10 - 100 - 1000 $1.86 10000 $1.67	Buy Now
Avnet Abacus	NEXC224Z3.5V10.5X5.5TRF	Tape & Reel		21 Weeks	1,000	1 - 10 - 100 - 1000 - 10000 -	Get Quote

NEXC224Z3 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXC Series RoHS Compliant includes all homogeneous materials *See Part Number System for Details	Original		PDF
Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXC Series RoHS Compliant includes all homogeneous materials "F" in Part Number Denotes ROHS Complaint	Original		PDF
Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXC Series New High Temperature Reflow +260°C See Datasheet for Available Values CHARACTERISTICS	Original	measured28	PDF
Nexc105z5.5v21x10 Abstract: NEXC474Z5 0.047F NEXC NEXC473Z5.5V10.5X5.5TRF NEXC104Z3 NEXC104Z5 NEXC224Z3 NEXC224Z5 NEXC473Z5 Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXC Series RoHS Compliant includes all homogeneous materials *See Part Number System for Details	Original	nexc105z5.5v21x10 nexc474z5 0.047f nexc +6nexc473z5.5v10.5x5.5trf nexc104z3 nexc104z5 nexc224z3 nexc224z5 nexc473z5	PDF
Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXC Series New High Temperature Reflow +260°C See Datasheet for Available Values CHARACTERISTICS	Original		PDF
Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXC Series RoHS Compliant includes all homogeneous materials *See Part Number System for Details	Original		PDF
Capacitors Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXC Series *For high temperature +85°C, high temperature reflow parts see the NEXCW series	Original	capacitors	PDF
Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXC Series RoHS Compliant includes all homogeneous materials "F" in Part Number Denotes ROHS Complaint	Original		PDF
v-chip Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXC Series New High Temperature Reflow +260°C See Datasheet for Available Values CHARACTERISTICS	Original	v-chip	PDF
Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXC Series *For high temperature +85°C, high temperature reflow parts see the NEXCW series	Original		PDF
NEXC474 Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXC Series *For high temperature +85°C, high temperature reflow parts see the NEXCW series	Original	nexc474	PDF
NEXC473Z5.5V10.5X5.5TRF Abstract: NEXC474Z5.5V16X9.5TRF NEXC104Z3 NEXC104Z5 NEXC224Z3 NEXC224Z5 NEXC473Z5 NEXC474Z3 NEXC474Z5 Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXC Series New High Temperature Reflow +260°C See Datasheet for Available Values CHARACTERISTICS	Original	nexc473z5.5v10.5x5.5trf nexc474z5.5v16x9.5trf nexc104z3 nexc104z5 +5nexc224z3 nexc224z5 nexc473z5 nexc474z3 nexc474z5	PDF
Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXC Series RoHS Compliant includes all homogeneous materials *See Part Number System for Details	Original		PDF
Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXC Series RoHS Compliant includes all homogeneous materials *See Part Number System for Details	Original		PDF

Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXC Series New High Temperature Reflow +260°C See Datasheet for Available Values CHARACTERISTICS	Original		PDF