NEXC Search Results

Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXC Series RoHS Compliant includes all homogeneous materials *See Part Number System for Details

Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXC Series RoHS Compliant includes all homogeneous materials "F" in Part Number Denotes ROHS Complaint

Contextual Info: REV. DATE ECR NO. DESCRIPTION NC 0 9 /1 8 /0 0 xxxxxx INITIAL RELEASE A 1 0 /0 6 /1 1 xxxxxx MODIFY THE BODY PLATING TO NEXCOTE 5/8-24UNEF-2B [.4 5 0 ± .0 0 1 ] STAMP IF ANY 6 .3 5 [.2 5 0 ] -1 7 .8 0 [.7 0 1 ] REF. -7 .8 7 RECOMMENDED MOUNTING HOLE I—

Contextual Info: REV. • 3.70 4 .0 0 DATE NC 0 6 /0 8 /9 8 A 0 6 /2 5 /0 6 B 1 2 /1 9 /0 6 DESCRIPTION IN IT IA L UPDATE D R A W IN G FO RM AT, RELEASE R E V IS E R E V IS E NOTE P L A T IN G TO NEXCO TE 2. [. 1 4 6 ] - 8 .3 0 [.1 5 8 ]- [ .3 2 7 ] mm RECOMMENDED CABLE S T R IP P IN G

Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXC Series *New* High Temperature Reflow +260°C See Datasheet for Available Values CHARACTERISTICS

NEXCW224

Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXCW Series RoHS Compliant High Temperature Reflow +260°C CHARACTERISTICS Rated Voltage Range

32HEX

Contextual Info: REV. DATE A 1 2 /2 9 /0 0 ECR NO. - B 0 7 /3 0 /0 6 - REVISE PLATING TO NEXCOTE, UPDATE DRAWING FORMAT C 0 7 /2 7 /0 8 - REVISE MATING FACE TO 32 HEX NUT, FERRULE I.D. DESCRIPTION REVISE PLATING TO SILVER 21.10 [.8 3 1 ] fo in ' in 20.00 [.7 8 8 ] CM CM O

Contextual Info: REV. 2 1 .10 [.8 3 1 ] c7 <N < r— 20 .00 [.7 8 8 ] DATE ECR NO. DESCRIPTION A 1 2 /2 9 /0 0 - REVISE PLATING TO SILVER 8 0 7 /3 0 /0 6 - REVISE PLATING TO NEXC07E. UPDATE DRAWING FORMAT C 0 7 /2 7 /0 8 - REVISE MATING FACE TO 32 HEX NUT, FERRULE i.D. i— -i

Contextual Info: REV. DATE NC 08/28/00 A 11/30/06 DESCRIPTION INITIAL RELEASE REVISE PLATING TO NEXCOTE / UPDATE DRAWING FORMAT 5 / 8 —24UNEF—2B 5 / 8 —24UNEF—2A UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS. DIMENSIONS IN [ ] ARE IN INCHES AND FOR CUSTOMER REFERANCE ONLY.

Contextual Info: REV. NC DATE ECR NO. 0 1 /0 6 /1 2 DESCRIPTION XXXXXX INITIAL RELEASE 1. 2. 3. 4. 5. 6. SHELL BRASS GASKET SILICONE RED RETAINER RING SUS 304 NATURAL CONTACT PIN INSULATOR BODY OUTER CONTACT BRASS PTFE NEXCOTE NEXCOTE BRASS MATERIAL DRAWN M.ZHANG 0 1 /0 6 /1 2

Contextual Info: REV. NC DATE ECR NO. 07/15/10 xxxxxx DESCRIPTION INITIAL RELEASE 1. CRIMPED FERRULE HEX CRIMP SIZE .6" 2. CONTACT PIN TO SOLDER GASKET SIUCONE CONTACT PIN BRASS GOLD BOOT BRASS NEXCOTE INSULATOR PTFE SUS 304 NATURAL RETAINING RING GASKET CONTACT BODY RED BRASS

Nexc105z5.5v21x10

Abstract: NEXC474Z5 0.047F NEXC NEXC473Z5.5V10.5X5.5TRF NEXC104Z3 NEXC104Z5 NEXC224Z3 NEXC224Z5 NEXC473Z5
Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXC Series RoHS Compliant includes all homogeneous materials *See Part Number System for Details

Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXC Series *New* High Temperature Reflow +260°C See Datasheet for Available Values CHARACTERISTICS

Contextual Info: REV. NC DATE D ESC R IP T IO N 07/26/99 INITIAL RELEA SE - 4.0 [ . 157 ] RECOM M ENDED CABLE STRIPPING DIM'S DESCRIPTION MATERIAL FINISH SH E LL BRASS NICKEL BODY B R A SS NEXCOTE INSULATOR TEFLON NATURAL CONTACT PIN BRASS GOLD UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLMETERS

Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXC Series RoHS Compliant includes all homogeneous materials *See Part Number System for Details

Contextual Info: REV. NC DATE D E SC R IP T IO N 02/08/00 IN IT IA L R E L E A S E A 11/02/06 UPDATE B 01/31/08 R E V IS E D R A W IN G BODY FO RM AT P L A T IN G T O NEXCOTE 5 / 8 —24U NEF—2B UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS. DIMENSIONS IN [ ] ARE IN

csi 06 43

Contextual Info: REV. DATE DESC RIP TIO N D 04/11/97 ADD 015.75 BODY DIMENSION E 01/19/98 F 03/19/05 UPDATE DRAWING FORMAT/ CHANGE STRIPPING DIMS G 02/08/06 UPDATE ITEM H 03/20/07 REVISE PLATING TO NEXCOTE CHANGE TO 015.57 BODY DIMENSION TO FLAT WASHER. 4.60 [.181] RECOMMENDED

95on

Contextual Info: REV. STAMP DATE NC 1 0 /2 3 /0 0 A 0 6 /2 5 /0 6 DESCRIPTION INITIAL RELEASE UPDATE DRAWING FORMAT, REVISE PLATING TO NEXCOTE CONNEX •sh 00 C \| ro r- co 9 .5 ON FLATS O -1 6 .5 0 [.6 5 0 ] O O co lo -1 .0 0 - 3 .5 0 00 CM o <- [.0 3 9 ] [ .1 3 8 ] RECOMMENDED CABLE

LMR240

Contextual Info: REV. DATE ECR NO. DESCRIPTION A 1 2 /0 5 /9 9 - UPDATE DRAWING B 0 1 /2 1 /0 7 - UPDATE DRAWING FORMAT C 0 4 /0 7 /0 8 xxxxxx REVISE BODY, FERRULE PLATING TO NEXCOTE 3 .7 0 [.1 4 6 ] 4 .0 0 •8.31 [.1 5 8 ]- [.3 2 7 ] RECOMMENDED CABLE STRIPPING DIMS. 5 / 8 — 24UNEF— 2A

LMR400

Contextual Info: REV. DATE ECR NO. DESCRIPTION A 1 2 /2 9 /0 0 - REVISE PLATING TO SILVER B 0 6 /0 1 /0 4 - UPDATE DRAWING FORMAT C 0 4 /1 9 /0 6 - REVISE BODY PLATING TO NEXCOTE D 1 2 /1 7 /0 6 - REVISE BODY STYLE TO 3 2 E 1 2 /2 8 /0 8 100070 REVISE BODY FORMAT HEX cn CN

17-223

Contextual Info: REV. A DATE DESCRPTION 10/15/0+ MODIFY HOUSING FINISH TO NEXCOTE • 4 .0 0 [.1 5 8 ] RECOMMENDED CABLE STRIPPING DIM’ S ■2.40 [.0 9 5 ] = = n = I UNLESS OTHHTVEC 3TH3PC0 DM EN3KMS ARE N MLUMETtlO. HMW3DN3 M [ ] ÆC N INCHES A t » n r GU STIUQT RETTRANDE DAY.

Capacitors

Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXC Series *For high temperature +85°C, high temperature reflow parts see the NEXCW series

M29X

Abstract: 5A6H
Contextual Info: REV. |-— -f- 3.30 [.130] 3.50 [.138]- I— 8 .3 0 [.3 2 7 ] DATE DESCRIPTION A 12/29/00 MODIFY PLATING TO SILVER B 12/27/05 MODIFY PLATING TO NEXCOTE / UPDATE DRAWING FORMAT RECOMMENDED CABLE STRIPPING DIM’S M 29XP1.5— 6H CM1 CM ccT to n1ro CO o o —

Contextual Info: 32.00 ON HEX[1 .2 6 0 ] REV. DATE A 1 2 /2 9 /0 0 B 1 2 /2 7 /0 5 C 0 7 /1 4 /1 0 ECR NO DESCRIPTION MODIFY PLATING TO SILVER — MODIFY PLATING TO NEXCOTE / — UPDATE DRAWING FORMAT UPDATED DESIGN 2 07 3 -023.9O [O.941] Z~ CM CM 14 .9 0 [0 .5 5 1 ] ö ro