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NIC Components Corp


NIC Components Corp NEXC474Z3.5V10.5X8.5TRF Cap Supercap 0.47F 3.5V -20% to 80% (10.5 X 8.5mm) SMD Cylindrical 420uA 25 Ohm 1000h 70°C T/R
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Verical	NEXC474Z3.5V10.5X8.5TRF		1,000		500	1 - 10 - 100 - 1000 $3.28 10000 $3.28	Buy Now
Avnet Americas	NEXC474Z3.5V10.5X8.5TRF	Tape & Reel		20 Weeks	500	1 - 10 - 100 - 1000 $2.58 10000 $2.39	Buy Now
Avnet Abacus	NEXC474Z3.5V10.5X8.5TRF	Tape & Reel		21 Weeks	500	1 - 10 - 100 - 1000 - 10000 -	Get Quote

NEXC474Z3 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
NEXC474 Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXC Series *For high temperature +85°C, high temperature reflow parts see the NEXCW series	Original	nexc474	PDF
NEXC473Z5.5V10.5X5.5TRF Abstract: NEXC474Z5.5V16X9.5TRF NEXC104Z3 NEXC104Z5 NEXC224Z3 NEXC224Z5 NEXC473Z5 NEXC474Z3 NEXC474Z5 Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXC Series New High Temperature Reflow +260°C See Datasheet for Available Values CHARACTERISTICS	Original	nexc473z5.5v10.5x5.5trf nexc474z5.5v16x9.5trf nexc104z3 nexc104z5 +5nexc224z3 nexc224z5 nexc473z5 nexc474z3 nexc474z5	PDF
Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXC Series RoHS Compliant includes all homogeneous materials *See Part Number System for Details	Original		PDF
Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXC Series RoHS Compliant includes all homogeneous materials *See Part Number System for Details	Original		PDF
Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXC Series New High Temperature Reflow +260°C See Datasheet for Available Values CHARACTERISTICS	Original		PDF
Contextual Info: V-Chip Memory Back-Up Capacitors FEATURES • DOUBLE LAYER CONSTRUCTION • POWER BACK-UP FOR CMOS DEVICES • SURFACE MOUNTABLE V-CHIP STYLE • LEAD-FREE FINISH NEXC Series New High Temperature Reflow +260°C See Datasheet for Available Values CHARACTERISTICS	Original		PDF