MOVINAND SPEC Search Results

KLM8G2FEJA-A001

Abstract: KLMAG4FEJA-A001 KLM8G2FEJA KLMBG8FEJA-A001 KLMAG4FEJA-B001 klm8g samsung eMMC 4.5 Samsung eMMC 4.41 KLMXGXFEJA-X001 KLMCGAFEJA-B001
Contextual Info: Hello All, 8/16/32GB 27nm eMMC parts are now available to sample CS type ! Please input sample requests for all customers using old generations of moviNAND now. We'll expedite for ASAP delivery. SEC will ramp 27nm production quickly so it is imperative that all customers get qualified ASAP.

SAMSUNG moviNAND

Abstract: MOVINAND 8GB movinand EXT_CSD KMCEN0000M KMCEN0000 K9G8G08U0M KMCEN0000M-S998000 K9G8g08 Samsung 8Gb MLC Nand flash
Contextual Info: KMCEN0000M-S998000 4GB moviNAND_8Gb MLC Based SAMSUNG moviNANDTM KMCEN0000M (4GB MLC) Product Data Sheet Version 1.0 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

K9F2G08U0B-PCB0

Abstract: samsung K9 flash Toggle DDR NAND flash K9F2G08U0B-PIB0 K9F2G08U0B samsung 128G nand flash movinand DECODER Samsung EOL K9F2G08U0B-PIB00 samsung toggle mode NAND
Contextual Info: SAMSUNG's Digital World go contents Flash ● ● ● ● ● NAND Flash ❍ Products ❍ EOL Products Toggle DDR NAND Flash ❍ Products Flash SSD NOR Flash ❍ Products ❍ EOL Products Flash Cards ❍ Products ❍ EOL Products Product Search ● ● ●

toshiba onenand

Abstract: toshiba emmc 4.4 Toshiba 512 NAND MLC FLASH BGA movinand emmc MICRON oneNAND micron emmc Toshiba emmc movinand micron emmc 4.3 fuse n20
Contextual Info: Freescale Semiconductor Application Note Document Number: AN3684 Rev. 0, 06/2009 i.MX25 Boot Options by Multimedia and Applications Division Freescale Semiconductor, Inc. Austin, TX This document describes the boot options for the i.MX25 device. For more in-depth details about how the boot

K9F2G08U0B

Abstract: K9HCG08U1M-PCB0 K9NCG08U5M-PCB0 K9F1G08U0C K9F4G08U0B-PCB0 K9F2G08U0B-PCB0 K9F4G08U0B K9WBG08U1M K9F1G08U0C-PCB0 K9G4G08U0B
Contextual Info: Samsung Semiconductor, Inc. Product Selection Guide Memory and Storage January 2009 Samsung Semiconductor, Inc. Samsung offers the industry’s broadest memory portfolio and has maintained its leadership in memory technology for 16 straight years. Its DRAM, flash and SRAM

eMMC

Abstract: emmc spec samsung eMMC 4.5 emmc 4.5 spec emmc operation emmc Initialization KMCME0000M emmc 5.0 emmc 4.5 emmc spec samsung
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

SAMSUNG moviNAND

Abstract: marking date code samsung semiconductor NAND FLASH QDP movinand DECODER SLC nand hamming code 512 bytes 48 TSOP1 1220F samsung 128G nand flash NAND Flash Code Information date code marking samsung Nand K9F2808U0C-PCB0
Contextual Info: FLASH MEMORY K9F2808U0C Document Title 16M x 8 Bit NAND Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial issue. Apr. 15th 2002 Advance 1.0 TBGA PKG Dimension Change 48-Ball, 6.0mm x 8.5mm -> 63-Ball, 9.0mm x 11.0mm Sep. 5th 2002

i.MX233

Abstract: OSC24M iMX25 AN3885 china usb player for tv circuit diagram source code in c for interfacing of DDr2 SDRAM with iMX 25 NAND Flash Controller Interface NFC MLC nand flashes efuse ROM movinand datasheet
Contextual Info: Freescale Semiconductor Application Note Document Number: AN3885 Rev. 2, 09/2009 Key Architectural Differences Between the i.MX233 and i.MX25 by Multimedia Applications Division Freescale Semiconductor, Inc. Austin, TX This application note provides a comparison of the key

micron emmc

Abstract: toshiba emmc 4.4 emmc toshiba toshiba emmc samsung emmc boot movinand emmc BOOT_LOCK movinand efuse micron emmc 4.3
Contextual Info: Freescale Semiconductor Application Note Document Number: AN3682 Rev. 0, 06/2009 i.MX25 IC Identification Module IIM Fusebox by Multimedia and Applications Division Freescale Semiconductor, Inc. Austin, TX The IC identification module (IIM) provides the primary

toshiba emmc 4.4

Abstract: micron emmc micron emmc 4.4 toshiba emmc micron emmc 4.3 TCD1304DG micron eMMC 100 ball BGA eMMC intel eMMC eMMC 4.4
Contextual Info: Freescale Semiconductor Application Note Document Number: AN4198 Rev. 0, 09/2010 Architectural Differences between the i.MX23, i.MX25, and i.MX28 by Multimedia Applications Division Freescale Semiconductor, Inc. Austin, TX 1 Introduction This application note describes the key architectural

lpc3143

Abstract: ARMv5TE instruction set movinand emmc LPC3141 lpc3143fet180 movinand Pinning movinand cd 6283 cs LCD Module intel 8080 movi nand
Contextual Info: D D D D D R R R R R FT FT FT FT FT D R R A A FT FT FT FT A A R R D D D D D D R R A FT FT FT A A R R D Low-cost, low-power ARM926EJ microcontrollers with USB High-speed OTG, SD/MMC, and NAND flash controller R R R D D D F FT FT A A Preliminary data sheet A

LPC3141

Abstract: LPC3143 LPC314x LPC3141FET180 LPC3143FET180 movinand emmc 4.5 128 by 64 lcd ARMv5TE instruction set movinand inand emmc
Contextual Info: D D R R R R R D D D FT FT FT FT FT D R R A A FT FT FT FT A A R R D D D D R R A FT FT FT A A R R D D D Low-cost, low-power ARM926EJ microcontrollers with USB High-speed OTG, SD/MMC, and NAND flash controller R R R D D D F FT FT A A Preliminary data sheet A

LPc3154

Abstract: movinand 3122 adj LPC3154FET208 movinand emmc TFBGA208 aes 3595 eMMC intel emmc spec 2FTD
Contextual Info: R R R R R A A A A A FT FT FT FT FT D R R A A FT FT FT FT A A R R D D D D D D R R A FT FT FT A A R R D ARM926EJ microcontrollers with USB High-speed OTG, SD/MMC, NAND flash controller, and audio codec R R R D D D F FT FT A A Preliminary data sheet A Rev. 0.11 — 26 August 2009

movinand emmc 4.5

Abstract: LPC3154 EBI-D11 ARM926EJ ARM926EJ-S LPC3152 LPC3152FET208 LPC3154FET208 MOVinand spec cd 6283 cs single output circuit diagram
Contextual Info: R R R R R A A A A A FT FT FT FT FT D R R A A FT FT FT FT A A R R D D D D R R A FT FT FT A A R R D D D ARM926EJ microcontrollers with USB High-speed OTG, SD/MMC, NAND flash controller, and audio codec R R R D D D F FT FT A A Preliminary data sheet A Rev. 0.12 — 27 May 2010

intel date code marking NAND Flash

Abstract: ARMv5TE instruction set MLC nand 2012 153 ball eMMC memory flash controller usb state machine for ahb to apb bridge iNAND eMMC 4 41 emmc spi bridge emmc bga 162 LPC3130FET180
Contextual Info: LPC3130/3131 Low-cost, low-power ARM926EJ-S MCUs with high-speed USB 2.0 OTG, SD/MMC, and NAND flash controller Rev. 2 — 29 May 2012 Product data sheet 1. General description The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB 2.0 On-The-Go OTG , up to 192 KB SRAM, NAND flash controller, flexible external bus

LCD Module intel 8080

Abstract: movinand nand flash SPI LPC3131 PC 3131 VIA ARM926EJ-S ARM926EJ-S emmc spi bridge ARM926EJ DATA SHEET OF ARM9
Contextual Info: D D R R R R A A A A A FT FT FT FT FT D R R A A FT FT FT FT A A R R D D D D R R A FT FT FT A A R R D D D Low-cost, low-power ARM926EJ-S MCUs with high-speed USB 2.0 OTG, SD/MMC, and NAND flash controller R R R D D D F FT FT A A Preliminary data sheet A Rev. 1.01 — 21 May 2009

ARMv5TE instruction set

Abstract: ahb arbiter ARM926EJ ARMv5TE ARM926EJ eMMC 4.4 iNAND eMMC 4 41 LPC3130 movinand NAND FLASH BGA PC 3131
Contextual Info: D D D D D A A A A A FT FT FT FT FT D R R A A FT FT FT FT A A R R D D D D D D R R A FT FT FT A A R R D Low-cost, low-power ARM926EJ-S MCUs with high-speed USB 2.0 OTG, SD/MMC, and NAND flash controller R R R D D D F FT FT A A Preliminary data sheet A Rev. 1.02 — 26 August 2009

ARMv5TE instruction set

Abstract: emmc jedec ARM926EJ-S LPC3130 LPC3131 TFBGA180 movinand 3131R emmc 4.4 standard jedec LPC31XX
Contextual Info: D D R R R R A A A A A FT FT FT FT FT D R R A A FT FT FT FT A A R R D D D D R R A FT FT FT A A R R D D D Low-cost, low-power ARM926EJ-S MCUs with high-speed USB 2.0 OTG, SD/MMC, and NAND flash controller R R R D D D F FT FT A A Preliminary data sheet A Rev. 1.04 — 27 May 2010

marvell armada 310

Abstract: Toshiba emmc
Contextual Info: Cover Marvell ARMADA 16x Applications Processor Family Version 3.2.x Boot ROM Reference Manual Doc. No. MV-S301208-00, Rev. November 2010 PUBLIC RELEASE Marvell. Moving Forward Faster Marvell® ARMADA 16x Applications Processor Family Version 3.2.x Boot ROM Reference Manual

PCIMX255CVM4

Contextual Info: Freescale Semiconductor Data Sheet: Advance Information MCIMX25 i.MX25 Multimedia Applications Processor for Consumer and Industrial Products Package Information Plastic package Case 5284 17 x 17 mm, 0.8 mm Pitch Ordering Information See Table 1 on page 3 for ordering information.

Contextual Info: Freescale Semiconductor Data Sheet: Advance Information MCIMX25 i.MX25 Applications Processor for Automotive Products Package Information Plastic package Case 5284 17 x 17 mm, 0.8 mm Pitch Silicon Version 1.1 Ordering Information See Table 1 on page 3 for ordering information.

MCIMX255AJM4

Abstract: MX25 AEC-Q100 ARM926 ARM926EJ-S MCIMX251AJM4 bluetooth 3620 freescale arm processor I.MX25 CMOS Camera Module CSI
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information MCIMX25 i.MX25 Applications Processor for Automotive Products Package Information Plastic package Case 5284 17 x 17 mm, 0.8 mm Pitch Silicon Version 1.1 Ordering Information See Table 1 on page 3 for ordering information.

Contextual Info: Freescale Semiconductor Data Sheet: Advance Information MCIMX25 i.MX25 Multimedia Applications Processor for Automotive Products Package Information Plastic package Case 5284 17 x 17 mm, 0.8 mm Pitch Silicon Version 1.1 Ordering Information See Table 1 on page 3 for ordering information.

Contextual Info: UM10314 LPC3130/31 User manual Rev. 2 — 23 May 2012 Document information Info Content Keywords LPC3130, LPC3131, ARM9, USB Abstract LPC3130/31 User manual User manual UM10314 NXP Semiconductors LPC3130/31 User manual Revision history Rev Date Description