MOTOROLA PLASTIC PACKAGE OUTLINES Search Results

751E

Abstract: 940C 948F BR1339 ansi y14.5m motorola plastic package outlines
Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Ordering Information Device Nomenclature MC 74 XXXX YYYYYY ZZ Motorola Circuit Identifier Package Type •D • DW •M • SD • DT Temperature Range • 74 = –40 to +85°C = = = = = Plastic Narrow JECDEC SOIC Plastic Wide JEDEC SOIC

NXR-1400

Abstract: nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC
Contextual Info: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s

transistor nec 8772

Abstract: nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry
Contextual Info: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s

62Sn36Pb2Ag

Abstract: 90Pb10Sn CBGA 255 motorola 480 PBGA pad recommendations Solder Balls 63Sn37Pb cte table epoxy substrate motorola pbga 302
Contextual Info: Freescale Semiconductor, Inc. Order Number: AN1850/D Rev. 0, 5/2000 Freescale Semiconductor, Inc. Freescale Semiconductor Application Note Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability Motorola introduced the ßip-chip plastic ball grid array FC PBGA packages as an alternative to, and in

CBGA 255 motorola

Abstract: 90Pb10Sn cte table epoxy BGA cte pbga package weight cte table epoxy substrate AN-1850 360-Pin
Contextual Info: Freescale Semiconductor, Inc. Order Number: AN1850/D Rev. 0, 5/2000 Freescale Semiconductor, Inc. Semiconductor Products Sector Application Note Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability Motorola introduced the ßip-chip plastic ball grid array FC PBGA packages as an alternative to, and in

HF 1932

Contextual Info: Case Outlines L SUFFIX - s CERAMIC PACKAGE CASE 620-10 ISSUE V i - NOTES. 1 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982 2. CONTROLLING DIMENSION: INCH. 3. OlMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 0 030

1J27

Contextual Info: Case Outlines 1 4 -P in P ackag es D SUFFIX PLASTIC SOIC PACKAGE CASE 751A-03 ISSUE F - S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MHUMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 0.0061

Contextual Info: Case Outlines 1 4 -Pin P ackag es D SUFFIX PLASTIC SOIC PACKAGE CASE 751A-03 ISSUE F P7 PL | 0 1 0.25 0.0101 t n x — JG I— o I B 1 i c D 14 PL_ [ $ I 0.25(0.0101 © K I t r 1 IT 1 B ® _ J F L- / R X 45J E 3 " SEATING PLANE NOTES'

motorola plastic package outlines

Contextual Info: Case Outlines C a se O utlines 4-P in P ackage DT SUFFIX PLASTIC PACKAGE CASE 369A-13 DPAK ISSUE W _ f _ 1 SEATING — — 1 PLANE NOTES: 1. 2 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. INCHES ' 1 MIN MAX MIN MAX A 0.235

AN1984

Abstract: SOIC16 1320A-02
Contextual Info: Freescale Semiconductor, Inc. MOTOROLA Order number: AN1984 Rev 1, 03/2004 SEMICONDUCTOR TECHNICAL DATA AN1984 Handling Motorola Pressure Sensors By William McDonald Freescale Semiconductor, Inc. INTRODUCTION Smaller package outlines and higher board densities require the need for automated placement of components. These

Contextual Info: Case Outlines L SUFFIX NOTES 1 DIMENSIONING AND TOLERANCING PER a n d v i i cjj i ono 2 3 CONTROLLING DIMENSION: INCH. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL DIMENSION F MAY NARROW TO 0.76 0 030 WHERE THE LEAD ENTERS THE CERAMIC BOOY 4 DIM A

Motorola 206

Contextual Info: C a s e Outlines 14-P in Packages D SUFFIX PLASTIC SO IC PACKAGE C A SE 751A-03 ISSU E F | ^ l 0.25 0.010 I NOTES: 1. DIMENSIONING AND TOl£RANClNG PER ANSI Y14.5M, 1962. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.

AN1260

Abstract: A112 A113
Contextual Info: MOTOROLA Order this document by AN1260/D SEMICONDUCTOR TECHNICAL DATA AN1260 Storage and Handling of Drypacked Surface Mounted Devices SMD Prepared by: R. Kampa, D. Hagen, W. Lindsay, and K.C. Brown INTRODUCTION This information provides Motorola customers with the

motorola varactor

Abstract: PACKAGE DIMENSIONS CASE 751-03 mc12148
Contextual Info: MOTOROLA SC LOGIC • J> m bGE b3b?25S □ Ô1T ■ M0T4 T - 5 ~ ô - / 7 MOTOROLA SEMICONDUCTOR TECHNICAL DATA M C 12148 Advance Information Low-Power V oltage Controlled O scillator LOW-POWER VOLTAGE CONTROLLED OSCILLATOR The MC12148 requires an external parallel tank circuit consisting of

C12207

Contextual Info: MOTOROLA SC LOGIC • bOE D • b3b?25E DOTGTDfl TH3 « H O m MOTOROLA SEMICONDUCTOR TECHNICAL DATA Product Preview M C12207 Serial Input PLL Frequency Synthesizer The MC12207 is a Bipolar single chip serial input PLL synthesizer with pulse-swallow function. Motorola’s advanced Bipolar MOSAIC

2088AB

Abstract: eb107 TO-210AA Package AAVID THERMALLOY COMPOUND 250 814a TO-210AB TRANSISTOR SUBSTITUTION DATA BOOK 1993 AN1040 DO-203AA DO-203AB
Contextual Info: Freescale Semiconductor, Inc. SEMICONDUCTOR APPLICATION NOTE . Archived 2005 MOTOROLA Order this document by AN1040/D AN1040 NOTE: The theory in this application note is still applicable, but some of the products referenced may be discontinued. Mounting Considerations for Power

2088AB

Abstract: TO-210AA Package motorola mhw 252 mhw 592 to220 torque for SELF TAPPING SCREW socket SELF TAPPING SCREW 4-40 Kapton Washer eb107 SIL-PAD density TO-210AB
Contextual Info: MOTOROLA Freescale Semiconductor, Inc. Order this document by AN1040/D SEMICONDUCTOR APPLICATION NOTE AN1040 NOTE: The theory in this application note is still applicable, but some of the products referenced may be discontinued. Mounting Considerations for Power

Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Advance Information MC74LCX16500 Low-Voltage CMOS 18-Bit Universal Bus Transceiver With 5V-Tolerant Inputs and Outputs 3-State, Non-Inverting The MC74LCX16500 is a high performance, non–inverting 18–bit universal bus transceiver operating from a 2.7 to 3.6V supply. This part is

b1236

Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Advance Information MC74LCX16646 Low-Voltage CMOS 16-Bit Transceiver/Registered Transceiver With 5V-Tolerant Inputs and Outputs 3-State, Non-Inverting The MC74LCX16646 is a high performance, non–inverting 16–bit

Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Hex Schmitt Inverter MC74LVX14 With 5V-Tolerant Inputs LVX The MC74LVX14 is an advanced high speed CMOS Schmitt inverter. The inputs tolerate voltages up to 7V, allowing the interface of 5V systems to 3V systems. The MC74LVX14 is pin and functionally compatible to the

Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Low-Voltage CMOS 16-Bit Transparent Latch MC74LCX16373 With 5V-Tolerant Inputs and Outputs 3-State, Non-Inverting The MC74LCX16373 is a high performance, non–inverting 16–bit transparent latch operating from a 2.7 to 3.6V supply. The device is byte

Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Low-Voltage CMOS 16-Bit D-Type Flip-Flop MC74LCX16374 With 5V-Tolerant Inputs and Outputs 3-State, Non-Inverting The MC74LCX16374 is a high performance, non–inverting 16–bit D–type flip–flop operating from a 2.7 to 3.6V supply. The device is byte

Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Advance Information MC74LVXC3245 Configurable Dual Supply Octal Transceiver LVX with 3-State Outputs for 3V Systems The 74LVXC3245 is a 24–pin dual–supply, octal configurable voltage interface transceiver especially well suited for PCMCIA and other real

Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Advance Information MC74LVXC3245 Configurable Dual Supply Octal Transceiver with 3-State Outputs for 3V Systems The 74LVXC3245 is a 24–pin dual–supply, octal configurable voltage interface transceiver especially well suited for PCMCIA and other real