MOBILE LPDDR3 Search Results

i5-4302Y

Contextual Info: Mobile 4th Generation Intel Core Processor Family, Mobile Intel® Pentium® Processor Family, and Mobile Intel® Celeron® Processor Family Datasheet – Volume 1 of 2 Supporting 4th Generation Intel® Core™ processor based on Mobile U-Processor and Y-Processor Lines

lpddr3

Contextual Info: 178-Ball Mobile LPDDR3 SDRAM Features Mobile LPDDR3 SDRAM EDF8132A1MC, EDFA232A1MA Features Options • VDD1/VDD2/VDDCA/VDDQ: 1.8V/1.2V/1.2V/1.2V • Array configuration – 256 Meg x 32 DDP – 512 Meg x 32 (QDP) • Packaging – 12.0mm x 11.5mm, 178-ball FBGA package

Contextual Info: 512Mbit MOBILE DDR SDRAM based on 4M x 4Bank x32 I/ Document Title 512MBit 4Bank x 4M x 32bits MOBILE DDR SDRAM Revision History Revision No. History Draft Date Remark 0.1 - Initial Draft Sep.2006 Preliminary 0.2 - Added SRR function and timing diagram Jan.2007

Contextual Info: 512Mbit MOBILE DDR SDRAM based on 4M x 4Bank x32 I/O Document Title 512MBit 4Bank x 4M x 32bits MOBILE DDR SDRAM Revision History Revision No. History Draft Date Remark 0.1 - Initial Draft Sep.2006 Preliminary 0.2 - Added SRR function and timing diagram

K4X2G323PD8GD8

Abstract: K9HFGY8S5A-HCK0 K4H511638JLCCC samsung eMMC 5.0 KLMBG4GE2A-A001 K9K8G08U0D-SIB0 K4X51163PK-FGD8 KLMAG2GE4A k4h561638n-lccc K4G10325FG-HC03
Contextual Info: PRODUCT SELECTION GUIDE Displays, Memory and Storage 2H 2012 Samsung Semiconductor, Inc. Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, mobile, and graphics memory are found in computers—from

Contextual Info: COVER DATA SHEET 16Gb DDR3 Mobile RAMTM PoP 14.0mm x 14.0mm, 220-ball FBGA EDFA164A1PF Specifications Features • Density: 16Gb • Organization — 4 pieces of 4Gb (16M words × 32 bits × 8 banks) in one package — Independent 2-channel bus • Package

Contextual Info: COVER DATA SHEET 16Gb DDR3 Mobile RAMTM PoP 15.0mm  15.0mm, 216-ball FBGA EDFA164A1PB Specifications Features • Density: 16Gb • Organization — 4 pieces of 4Gb (16M words  32 bits  8 banks) in one package — Independent 2-channel bus • Package

Contextual Info: COVER DATA SHEET 16Gb DDR3 Mobile RAMTM PoP 15.0mm  15.0mm, 216-ball FBGA EDFA164A1PK Specifications Features • Density: 16Gb • Organization — 4 pieces of 4Gb (16M words  32 bits  8 banks) in one package — Independent 2-channel bus • Package

Contextual Info: DragonBoard Development Kit Based on the Snapdragon™ 800 Series 8074 Processor The Next Generation of High Performance Mobile Processing Intrinsyc’s DragonBoard Development Kit is a full featured Android™ development platform that provides an ideal starting point for creating highperformance embedded and handheld devices.

Contextual Info: COVER DATA SHEET 8Gb DDR3 Mobile RAMTM, DDP EDF8164A1MA Specifications Features • Density: 8Gb • Organization — 2 pieces of 4Gb 16M words  32 bits  8 banks in one package — Independent 2-channel bus • Package — 253-ball FBGA, DDP (Dual Die Package)

Contextual Info: COVER DATA SHEET 16Gb DDR3 Mobile RAMTM, QDP EDFA164A1MA Specifications Features • Density: 16Gb • Organization — 4 pieces of 4Gb 16M words  32 bits  8 banks in one package — Independent 2-channel bus • Package — 253-ball FBGA, QDP (Quad Die Package)

armada 1500 ultra

Abstract: GC7000XS 88DE3218 Armada 1500 TV SOC 3D HDMI H265 Marvell armada 1500 ZSP800 emmc 5.0 h.264 Marvell
Contextual Info: Marvell ARMADA 1500 Ultra Ultra High-definition Media Processor System-on-chip with Quad-core CPU smart tv PRODUCT OVERVIEW The Marvell ARMADA® 1500 Ultra 88DE3218 ultra high-definition secure media processor is a system-on-chip (SoC) delivering multi-core CPU/GPU performance, Ultra HD video, and carrier-grade security to PayTV set-top box (STB), and retail over-the-top

au1380

Abstract: NetLogic au1380 NetLogic LPDDR-333 NAND FLASH 512MB SH7724 Spansion NAND Flash slc SODIMM-200 Spansion NAND Flash LAN9211
Contextual Info: For more information go to: www.cogcomp.com Function 1 CSB733 CSB739 CSB740 CSB751 CSB765 CSB781 Microprocessor (Core) Freescale i.MX31C (ARM1136JF-S) Atmel AT91SAM9M10 (ARM926EJ-S) TI OMAP3530 (ARM Cortex-A8) NetLogic Au1380 (MIPS 32K) Renesas SH7724 (SH-4A)

Contextual Info: Agilent U7231B DDR3 and LPDDR3 Compliance Test Application for Infiniium Series Oscilloscopes Datasheet Test, debug and characterize your DDR3 and LPDDR3 designs quickly and easily The Agilent Technologies U7231B DDR3 and LPDDR3 compliance test application provides a fast and easy

wd 969 usb

Abstract: SPEAR320-2 SD protocol SPEAr320 vxworks driver
Contextual Info: SPEAr320 Embedded MPU with ARM926 core, optimized for factory automation and consumer applications Features • ARM926EJ-S 333 MHz core ■ High-performance 8-channel DMA ■ Dynamic power-saving features ■ Configurable peripheral functions on 102 shared I/Os.

Contextual Info: SPEAr320 Embedded MPU with ARM926 core, optimized for factory automation and consumer applications Features • ARM926EJ-S 333 MHz core ■ High-performance 8-channel DMA ■ Dynamic power-saving features ■ Configurable peripheral functions on 102 shared I/Os.

LFBGA289

Abstract: ARM926 ARM926EJ-S CRC16 M95010 M95020 M95040 SPEAR320-2
Contextual Info: SPEAr320 Embedded MPU with ARM926 core, optimized for factory automation and consumer applications Features • ARM926EJ-S 333 MHz core ■ High-performance 8-channel DMA ■ Dynamic power-saving features ■ Configurable peripheral functions on 102 shared I/Os.

SPEAr320

Abstract: SPEAr320-2 Atmel touchscreen upd programmable timer 24 pin stn lcd pinout details capacitive touchscreen ARM926 ARM926EJ ARM926EJ-S LFBGA289
Contextual Info: SPEAr320 Embedded MPU with ARM926 core, optimized for factory automation and consumer applications Features • ARM926EJ-S 333 MHz core ■ High-performance 8-channel DMA ■ Dynamic power-saving features ■ Configurable peripheral functions on 102 shared I/Os. Please refer to Table 10:

i2s full duplex

Abstract: Camera Module CSI2 interface LK 1628 24 pin stn lcd pinout details SPEAr300 Mobile Camera Module motorola l7 Atmel touchscreen matrix 7x5 ms upd programmable timer CBC 307
Contextual Info: SPEAr300 Embedded MPU with ARM926 core, flexible memory support, powerful connectivity features and human machine interface Features • ARM926EJ-S core up to 333 MHz ■ High-performance 8-channel DMA ■ Dynamic power-saving features ■ Configurable peripheral functions on 102

Contextual Info: SPEAr300 Embedded MPU with ARM926 core, flexible memory support, powerful connectivity features and human machine interface Features • ARM926EJ-S core up to 333 MHz ■ High-performance 8-channel DMA ■ Dynamic power-saving features ■ Configurable peripheral functions on 102

Contextual Info: CD00250129 Rev 2.1 IN APPROVAL PAGE A ft Embedded MPU with ARM926 core, flexible memory support, powerful connectivity features and human machine interface -D ra Technical Literature Alternate Identifier s Key process 16324 Product Development Dr ISO Definition

7812 TO-3

Abstract: SPEAR310 4027 pin diagram SPEAr600 M25Pxxx LK 1628 spear3XX jtag 8bit nand flash upd programmable timer ST 7812
Contextual Info: SPEAr310 Embedded MPU with ARM926 core, flexible memory support, extended set of powerful connectivity features Features • ARM926EJ-S 333 MHz core ■ High-performance 8-channel DMA ■ Dynamic power-saving features ■ Configurable peripheral functions multiplexed

Contextual Info: SPEAr310 Embedded MPU with ARM926 core, flexible memory support, extended set of powerful connectivity features Features • ARM926EJ-S 333 MHz core ■ High-performance 8-channel DMA ■ Dynamic power-saving features ■ Configurable peripheral functions multiplexed

C4269

Abstract: Package tray 15X15 lpddr3 A1668 SPEAR300-2 d1577 15.4 lcd
Contextual Info: SPEAr300 Embedded MPU with ARM926 core, flexible memory support, powerful connectivity features and human machine interface Features • ARM926EJ-S core up to 333 MHz ■ High-performance 8-channel DMA ■ Dynamic power-saving features ■ Configurable peripheral functions multiplexed