Sumitomo CRM1076NS
Abstract: SUMITOMO g600 CRM1076NS Compound R3589DR-S TISPA79R241DR-S J-STD-22 R3680DR-S crm1076 bourns R3679DR-S
Contextual Info: THYRISTOR SURGE PROTECTORS August 2007 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team PCN Tracking Number 45 New Assembly/Test Site & Green Mold Compound Bourns is qualifying an additional assembly/test site for manufacture of overvoltage protectors in
|
Original
|
ms012tisp3082f3dr-stisp3125f3dr-stisp3150f3dr-s+16tisp3180f3dr-stisp3290f3dr-stisp3380f3dr-stisp4072f3dr-stisp4125f3dr-stisp4150f3dr-ssumitomo crm1076nssumitomo g600crm1076nscompoundr3589dr-stispa79r241dr-sj-std-22r3680dr-scrm1076bourns r3679dr-s
|
PDF
|
Sumitomo CRM1076NS
Abstract: SUMITOMO g600 G600 mold compound r3589 J-STD-22 G600 JEDEC 95 CRM1076NS TISP4072F3DR-S r36041
Contextual Info: THYRISTOR SURGE PROTECTORS August 2007 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team PCN Tracking Number 45 New Assembly/Test Site & Green Mold Compound Bourns is qualifying an additional assembly/test site for manufacture of overvoltage protectors in
|
Original
|
ms012tisp3082f3dr-stisp3125f3dr-stisp3150f3dr-s+15tisp3180f3dr-stisp3290f3dr-stisp3380f3dr-stisp4072f3dr-stisp4125f3dr-stisp4150f3dr-ssumitomo crm1076nssumitomo g600g600 mold compoundr3589j-std-22g600jedec 95crm1076nsr36041
|
PDF
|
ABLEBONd 84-1
Abstract: JESD22-B116 Ablebond 84-1 LMISR4 JESD22-A101 LMISR4 A101 G600 JESD22 9110l
Contextual Info: THYRISTOR SURGE PROTECTORS Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team May 6, 2009 PCN Tracking Number 48 Change from Gold to Copper Wire In 2Q08, Bourns qualified a change to the base metal composition of the wires used to bond overvoltage protection chips to the package terminals of the 8-pin SOP 150 mil package.
|
Original
|
jesd22j-std-020jesd22-a113tisp61089hdmr-s+11tisp8200mdr-stisp8201mdr-stisp9110ldmr-sablebond 84-1jesd22-b116ablebond 84-1 lmisr4jesd22-a101lmisr4a101g6009110l
|
PDF
|
ABLEBONd 84-1
Abstract: Ablebond 84-1 LMISR4 JESD22-B116 G600 TISP61089HDMR-S MIL-STD-883-2019 A101 B116 JESD22 TISP9110LDMR-S
Contextual Info: THYRISTOR SURGE PROTECTORS Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team May 6, 2009 PCN Tracking Number 48 Change from Gold to Copper Wire In 2Q08, Bourns qualified a change to the base metal composition of the wires used to bond overvoltage protection chips to the package terminals of the 8-pin SOP 150 mil package.
|
Original
|
jesd22j-std-020jesd22-a113tisp61089hdmr-s+10tisp8200mdr-stisp8201mdr-stisp9110ldmr-sablebond 84-1ablebond 84-1 lmisr4jesd22-b116g600mil-std-883-2019a101b116
|
PDF
|
"Sumitomo eme 6600"
Abstract: R7W120DR TISPA79R241DR R3604-3DR CRM1033D JEDEC 95 R3763 tisp2180f3ds sumitomo 6600 TISP2180F3DR
Contextual Info: CIRCUIT PROTECTION PRODUCTS April, 2006 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team Thyristor Surge Protector Product Change Notification PCN Tracking Number 42 - New Assembly/Test Site
|
Original
|
150milms012ms-012risp61521dr-s+15tisp6l7591drtisp70151dtisp7015drtisp7015l1dtisp7015l1drsumitomo eme 6600r7w120drtispa79r241drr3604-3drcrm1033djedec 95r3763tisp2180f3dssumitomo 6600tisp2180f3dr
|
PDF
|
copper bond wire
Abstract: crm-1076NS CRM1076NS Sumitomo CRM1076NS J-STD-22 0834 CRM1076 r3589 SUMITOMO g600 G600
Contextual Info: THYRISTOR SURGE PROTECTORS May, 2008 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team Thyristor Surge Protector Product Change Notification PCN Tracking Number 46 — Change from Gold to Copper Wire
|
Original
|
150milms012tisp3125f3dr-stisp3150f3dr-s+16tisp3180f3dr-stisp3290f3dr-stisp3380f3dr-stisp4072f3dr-stisp4125f3dr-stisp4150f3dr-scopper bond wirecrm-1076nscrm1076nssumitomo crm1076nsj-std-220834crm1076r3589sumitomo g600g600
|
PDF
|
CRM1076NS
Abstract: J-STD-22 r3589 Sumitomo CRM1076NS CS thyristor G600 CRM1076N
Contextual Info: THYRISTOR SURGE PROTECTORS May, 2008 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team Thyristor Surge Protector Product Change Notification PCN Tracking Number 46 — Change from Gold to Copper Wire
|
Original
|
150milms012tisp3125f3dr-stisp3150f3dr-s+13tisp3180f3dr-stisp3290f3dr-stisp3380f3dr-stisp4072f3dr-stisp4125f3dr-stisp4150f3dr-scrm1076nsj-std-22r3589sumitomo crm1076nscs thyristorg600crm1076n
|
PDF
|
CRM-1033
Abstract: JEDEC 95 CRM1033D CRM1033 Product Change Notification PCN "Sumitomo eme 6600" R3602D r3589 TISP2180F3 TISPL758LF3DR
Contextual Info: CIRCUIT PROTECTION PRODUCTS April, 2006 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team Thyristor Surge Protector Product Change Notification PCN Tracking Number 42 - New Assembly/Test Site
|
Original
|
150milms012ms-012risp61521dr-s+15tisp6l7591drtisp70151dtisp7015drtisp7015l1dtisp7015l1drcrm-1033jedec 95crm1033dcrm1033product change notification pcnsumitomo eme 6600r3602dr3589tisp2180f3tispl758lf3dr
|
PDF
|
7C80381A
Abstract: 7C80381 CY2037-2WAF CY2037AWAF S2032 Mil-Std-883 Wire Bond Pull Method 2011
Contextual Info: Cypress Semiconductor Product Qualification Report QTP# 98225VERSION 1.0 September, 2000 Single PLL Programmable Clock L28 Technology, Fab 2 CY2037AWAF CY2037-2WAF CY5037AWAF High Accuracy EPROM Programmable Die for Crystal Oscillators CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:
|
Original
|
98225versioncy2037awafcy2037-2wafcy5037awaf+8cy2037awaf/cy2037-2waf/85c/85cy2273apvc7c80381a7c80381s2032mil-std-883 wire bond pull method 2011
|
PDF
|
CY7C199
Abstract: EME-6300H JESD22 MP-8000
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97476 VERSION 1.0 December, 1997 32K x 8 Static RAM CY7C194/CY7C195/CY7C199 CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Kim Nguyen Staff Reliability Engineer 408 943-2136 Cypress Semiconductor 256K Static RAM, R28 Process, Fab 2 Qualification
|
Original
|
cy7c194/cy7c195/cy7c199cy7c19928-pin300-mil+5cy7c199-vc85c/85eme-6300hjesd22mp-8000
|
PDF
|
7C43
Abstract: 9748 CY7C42 CY7C42 qualification CY7C1049V33-VC
Contextual Info: Cypress Semiconductor Product Qualification Report QTP# 97483 VERSION 2.0 November, 2000 Low Voltage Deep Synchronous FIFO High Speed 100-MHZ Operation R42D – Fab 4 CY7C4255V/CY7C4265V/CY7C4275V/CY7C4285V 8K/16K/32K/64K x 18 CY7C4261V/CY7C4271V/CY7C4281V/CY7C4291V
|
Original
|
100-mhzcy7c4255v/cy7c4265v/cy7c4275v/cy7c4285v8k/16k/32k/64kcy7c4261v/cy7c4271v/cy7c4281v/cy7c4291v+916k/32k/64k/128kcy7c4282v/cy7c4292v64k/128kcy7c42cy7c1021v33-vc7c439748cy7c42 qualificationcy7c1049v33-vc
|
PDF
|
Ablebond 84-1LMI
Abstract: 84-1LMI JESD22 0/7C62126/7V
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97506, VERSION 1.0 May, 1998 1 Meg SRAM, R42 Technology, Fab 4 Qualification CY62126/7V 64K x 16 Static RAM, 2.7V - 3.6V Operation Cypress Semiconductor 1 Meg SRAM, R42 Technology, Fab 4 Devices:CY62126/7V Rev. A
|
Original
|
cy62126/7v44-pincy7c1021v33-vc30c/60+4ablebond 84-1lmi84-1lmijesd220/7c62126/7v
|
PDF
|
CY62135V18
Abstract: CY7C1329 8355F
Contextual Info: Cypress Semiconductor Product Qualification Report QTP# 003108 VERSION 1.0 December 2000 2 Meg FCP MoBL2 SRAM Family R52D-3, Fab 4 CY62135V18 CY62136V18/CY62137V18 128K x 16 Static RAM MoBL and More Battery life are Trade mark of Cypress Semiconductor Corporation.
|
Original
|
r52d-3cy62135v18cy62136v18/cy62137v18cy62136v18/cy62136v18/cy62137v18+4cy7c1329-ac30c/60cy7c13298355f
|
PDF
|
CY7C1350B
Abstract: CY7C1329 CY7C1351B CY7C1352B CY7C1353B
Contextual Info: Cypress Semiconductor Product Qualification Report QTP# 99245 VERSION 3.0 December, 2000 4 Meg Synchronous SRAM R52D-3 Technology, Fab 4 CY7C1350B 128K x 36 Pipeline SRAM with NoBL Architecture CY7C1351B 128K x 36 Flow Through SRAM with NoBL™ Architecture
|
Original
|
r52d-3cy7c1350bcy7c1351bcy7c1352b+4cy7c1353bcy7c1329-ac30c/60cy7c1329
|
PDF
|
|
|
QMI2419
Abstract: CY7C197 CY7C199 precondition DIP JEDEC
Contextual Info: Cypress Semiconductor Product Qualification Report QTP# 001605 VERSION 1.0 October, 2000 256K FAST ASYNCHRONOUS SRAM R42HDHA Technology, Fab 4 CY7C194/195 64K x 4 Static RAM CY7C197 256K x 1 Static RAM CY7C198/199 32K x 8 Static RAM CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:
|
Original
|
r42hdhacy7c194/195cy7c197cy7c198/199+7cy7c1997c1599gr42hd98------stresscy7c109-vcqmi2419precondition dip jedec
|
PDF
|
CY7C1021V33
Abstract: Mil-Std-883 Wire Bond Pull Method 2011 JESD22
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97211, VERSION 1.1 October, 1997 1 Meg SRAM, R42D Technology, Fab 4 Qualification CY7C1021V33 64K x 16 Static RAM Cypress Semiconductor 1 Meg SRAM, R42 Technology, Fab 4 Devices:CY7C1021V33 Package: SOJ QTP# 97211, V1.1
|
Original
|
cy7c1021v3344-pincy7c1021v33-vc30c/60+2mil-std-883 wire bond pull method 2011jesd22
|
PDF
|
Mil-Std-883 Wire Bond Pull Method 2011
Abstract: 28-pin SOJ SRAM 9749 cel 9200 8361H CY62256V JESD22
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97496, VERSION 1.1 March 1999 256K SRAM, R42 Technology, Fab 4 Qualification CY62256V* 32K x 8 Micro Power Asynchronous SRAM 2.7V - 3.6V CY62256V25* 32K x 8 Micro Power Asynchronous SRAM (2.3V - 2.7V) CY62256V18*
|
Original
|
cy62256vcy62256v25cy62256v1828-pin+10300-milcy62285c/85cy62256v-vcmil-std-883 wire bond pull method 201128-pin soj sram9749cel 92008361hjesd22
|
PDF
|
7C109A
Abstract: CY7C109
Contextual Info: Cypress Semiconductor Qualification Report QTP# 98064 VERSION 1.0 April, 1998 1 Meg SRAM, R42HD Technology, Fab 4 Qualification CY7C109/CY7C1009 128K x 8 SRAM 5V Operation Cypress Semiconductor, Inc. 128K x 8 SRAM - R42DH Technology - Fab 4 Device: CY7C109 (7C109H)
|
Original
|
r42hdcy7c109/cy7c1009r42dhcy7c109+57c109h32-pin400-milcy7c109-vc7c109a
|
PDF
|
Mil-Std-883 Wire Bond Pull Method 2011
Abstract: 82440 82440LX 82430TX 82440FX
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97403 VERSION 1.0 April 1998 Pentium and Pentium II Clock Synthesizer/Driver Pentim is a trademark of Intel Corporation CY2273 Clock Synthesizer/Driver for Intel 82430TX and Chipsets with 3 DIMM Support
|
Original
|
cy227382430txcy227482440fx+6cy227582440lxcy2276cy2277mil-std-883 wire bond pull method 201182440
|
PDF
|
CY62137V
Abstract: CY62138V
Contextual Info: Cypress Semiconductor Qualification Report QTP# 99075 VERSION 1.0 April, 1999 MoBL SRAM, R52LD Technology, Fab 4 Qualification CY62136V/CY62137V 128K x 16 Static RAM CY62138V 256K x 8 Static RAM CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Cypress Semiconductor
|
Original
|
r52ldcy62136v/cy62137vcy62138vcy62136v/62137v/62138v+47c62136/7ar52ld-3cy62137v44-pin
|
PDF
|
MP 1009 es
Abstract: BS-00001
Contextual Info: ^EDI B c e tro n lc D e s ig n i Inc. Reliability Program Quality Assurance Policy The Quality Standard at Electronic Designs Incorpo rated EDI is defect free work. No other standard is acceptable. This policy is reflected in the attention given to the
|
OCR Scan
|
mil-std-883mp 1009 esbs-00001 |
PDF
|
CEL9200
Abstract: 8361H A100R CY7C1329 JESD22
Contextual Info: Cypress Semiconductor Technology Qualification Report QTP# 99311 VERSION 2.0 December, 2000 R52D-3Technology, Fab 4 Qualification CY7C1329 64K x 32 Synchronous-Pipelined Cache RAM CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director
|
Original
|
r52d-3technologycy7c1329r52d-3cy7c1329-2meg+7pipeline00cy7c1329-ac30c/60cel92008361ha100rjesd22
|
PDF
|
plx 9030
Abstract: EIA/JEDEC JESD22-A108 pci9030-aa60pi PCI 9030 uBGA 180 Failure rate plx 9052 PCI9054-AB50PI PCI9030-AA60BI PCI9054-AA50BI PCI9080-3 PCI 9030 FIT rate
Contextual Info: Revision: Original October 2000 Website: Email: Phone: Fax: http://www.plxtech.com Rel@plxtech.com 408-774-9060 800-759-3735 408-774-2169 2000 PLX Technology, Inc. All rights reserved. PLX Technology, Inc. retains the right to make changes to this product at any time, without notice.
|
Original
|
plx 9030eia/jedec jesd22-a108pci9030-aa60pipci 9030 ubga 180 failure rate+6plx 9052pci9054-ab50pipci9030-aa60bipci9054-aa50bipci9080-3pci 9030 fit rate
|
PDF
|
40F-701-1-15
Abstract: nikon STEPPER 71007 MIL-STD-883 method 5003 INCOMING MATERIAL INSPECTION procedure harris top marking product change notification
Contextual Info: Status of Document is:RELEASED Effective from: 19-SEP-1997 14:23:42 to Date Printed: 09/24/97 7:46 AM SECTION 2.0 Controlled Document QML GENERAL NON-TECHNOLOGY SPECIFIC GENERAL Section 2.0 of this manual is written to describe the general (non-technology specific)
|
Original
|
19-sep-1997210xxx710-010-xx40f-400-0-0+640f-701-1-15nikon stepper71007mil-std-883 method 5003incoming material inspection procedureharris top marking product change notification
|
PDF
|
