MICRON MARKING CODE INFORMATION Search Results

micron marking code information

Abstract: intel date code marking Product Change Notification B80523P300512E B80522P300512E pentium II Klamath Marking Code KEY marking codes intel marking
Contextual Info: PROCESS / PRODUCT CHANGE NOTIFICATION Conversion Notification #: 699 Conversion Title: Boxed Pentium II Processor 266 and 300 MHz Process Technology Change Date of PCN Publication: July 22, 1998 Type of Notification: FYI for your information only Notification

omap2420

Abstract: mt29f1g08 MT29F2G08AAD MT29F1G08ABB MT29F1GxxABA mt29f*aad TI OMAP2420 MT29F2G16AAD Micron NAND Micron NAND flash
Contextual Info: TN-29-16: Boot-from-NAND with the TI OMAP2420 Processor Overview Technical Note Boot-from-NAND Using Micron MT29F1G08ABB NAND Flash with the Texas Instruments TI OMAP2420 Processor Overview NAND Flash memory devices are designed for applications requiring nonvolatile, highdensity, solid-state storage media. Historically, NAND Flash has been used extensively in

flash device MARKing intel

Abstract: micron marking code information INTEL flash part MARKING 28F Intel intel marking 28f Flash Memory micron MT INTEL 56BALL 56-BALL MICRON TECHNOLOGY MARKING flash 28F
Contextual Info: ADVANCE‡ 4 MEG x 16 ASYNC/PAGE/BURST FLASH MEMORY ADDENDUM FLASH MEMORY MT28F644W18 1.8V Low Voltage, Extended Temperature Refer to MT28F644W18 discrete data sheet Features Flexible 4Mb multipartition architecture Single word 16-bit data bus Support for true concurrent operation with zero

micron marking code information

Abstract: flash device MARKing intel
Contextual Info: ADVANCE‡ 4 MEG x 16 ASYNC/PAGE/BURST FLASH MEMORY ADDENDUM FLASH MEMORY MT28F644W18 1.8V Low Voltage, Extended Temperature Refer to MT28F644W18 discrete data sheet Features Flexible 4Mb multipartition architecture Single word 16-bit data bus Support for true concurrent operation with zero

Contextual Info: 1GB x72, SR 240-Pin DDR2 SDRAM FBDIMM Features 1.55V DDR2 SDRAM FBDIMM MT9RTF12872FY – 1GB Features • • • • • • • • Information in the 1.8V DDR2 FBDIMM data sheet is directly applicable to this 1.55V DDR2 FBDIMM, except where stated otherwise in this data sheet.

MT29F1G08ABCHC

Abstract: mt29c MT29F4G16A mt29f1g08 MT29F1G08ABCHC-ET MT29C1G12 MT29F2G16ABDHC MT29F4G16AB MT29F1G16ABCHC-ET micron lpddr
Contextual Info: Preliminary‡ 152-Ball NAND Flash and Mobile LPDRAM PoP TI OMAP MCP Features NAND Flash and Mobile LPDRAM 152-Ball Package-on-Package (PoP) Combination Memory (TI OMAP ) MT29C Family Current production part numbers: See Table 1 on page 3 Features Figure 1:

MT9GTF12872FY

Contextual Info: 1GB x72, SR 240-Pin DDR2 SDRAM FBDIMM Features 1.5V DDR2 SDRAM FBDIMM MT9GTF12872FY – 1GB Features • • • • • • • • Except where stated in this data sheet, information in the corresponding 1.8V DDR2 FBDIMM data sheet is directly applicable to the 1.5V DDR2 FBDIMM. For

SN11

Contextual Info: 2GB x72, DR 240-Pin DDR2 SDRAM FBDIMM Features 1.5V DDR2 SDRAM FBDIMM MT18GTF25672FDY – 2GB Features Except where stated in this data sheet, information in the corresponding 1.8V DDR2 FBDIMM data sheet is directly applicable to the 1.5V DDR2 FBDIMM. For

micron SDRAM SPD table

Contextual Info: 2GB x72, SR 240-Pin DDR2 SDRAM FBDIMM Features 1.5V DDR2 SDRAM FBDIMM MT18GTF25672F – 2GB Features Except where stated in this data sheet, information in the corresponding 1.8V DDR2 FBDIMM data sheet is directly applicable to the 1.5V DDR2 FBDIMM. For

Contextual Info: 1GB x72, SR 240-Pin DDR2 SDRAM FBDIMM Features 1.5V DDR2 SDRAM FBDIMM MT9GTF12872FY – 1GB Features • • • • • • • • Except where stated in this data sheet, information in the corresponding 1.8V DDR2 FBDIMM data sheet is directly applicable to the 1.5V DDR2 FBDIMM. For

MT29C1G12

Abstract: mt29c1g12ma MT29C1G12M MT29C1G smd code AA5 SMD MARKING CODE b21 MT29C2G24MAKLACG-6 smd code U21 marking aa5 mt29c1g1
Contextual Info: Preliminary‡ 152-Ball NAND Flash and LP-DRAM PoP TI OMAP MCP Features NAND Flash and LP-DRAM 152-Ball Package-on-a-Package (PoP) Combination Memory (TI OMAP ) Features • • • • • • Figure 1: Micron NAND Flash and LP-DRAM components RoHS-compliant, “green” package

ps3109

Abstract: u28 201 MARKING CODE U37 marking U38 DDR2-667 MO-256 PC2-5300 DDR2 pin out marking micron ddr2 sn131
Contextual Info: 4GB x72, DR 240-Pin DDR2 SDRAM FBDIMM Features 1.55V DDR2 SDRAM FBDIMM MT36RTF51272FY – 4GB Features • • • • • • • • Information in the 1.8V DDR2 FBDIMM data sheet is directly applicable to this 1.55V DDR2 FBDIMM, except where stated otherwise in this data sheet.

Contextual Info: 8GB x72, DR 240-Pin DDR2 SDRAM FBDIMM Features 1.5V DDR2 SDRAM FBDIMM MT36GTS1G72FY – 8GB Features Except where stated in this data sheet, information in the corresponding 1.8V DDR2 FBDIMM data sheet is directly applicable to the 1.5V DDR2 FBDIMM. For

MT46H64M32

Abstract: MT46H128 MT46H64M32L2CG-6 MT46H128M 152-Ball lpddr MT46H128M32 micron lpddr 128M32 MT46H128M32L4KZ
Contextual Info: 152-Ball x32 Mobile LPDDR only PoP (TI-OMAP) Features Mobile LPDDR (only) 152-Ball Package-on-Package (PoP) TI-OMAP MT46HxxxMxxLxCG MT46HxxxMxxLxKZ Features Options • VDD/VDDQ = 1.70–1.95V • Bidirectional data strobe per byte of data (DQS) • Internal, pipelined double data rate (DDR)

MT29F2G16AB

Abstract: MT29C2G24MAKLAJG-6 MT29C4G48 JW256 MT29C2G48MAKLCJI-6 mt29f4g16ab MT29F4G16A MT29F2G16ABDHC mt29c MT29F2G16ABDHC-ET
Contextual Info: Preliminary‡ 168-Ball NAND Flash and LPDRAM PoP TI OMAP MCP Features NAND Flash and Mobile LPDRAM 168-Ball Package-on-Package (PoP) MCP Combination Memory (TI OMAP ) MT29CxGxxMAxxxxx Features Figure 1: PoP Block Diagram Micron NAND Flash and LPDRAM components

Contextual Info: 8GB x72, DR 240-Pin DDR2 SDRAM FBDIMM Features 1.5V DDR2 SDRAM FBDIMM MT36GTS1G72F – 8GB Features Except where stated in this data sheet, information in the corresponding 1.8V DDR2 FBDIMM data sheet is directly applicable to the 1.5V DDR2 FBDIMM. For component specifications, refer to the 1.5V DDR2

micron SDRAM SPD table

Contextual Info: 2GB x72, DR 240-Pin DDR2 SDRAM FBDIMM Features 1.55V DDR2 SDRAM FBDIMM MT18RTF25672FDZ – 2GB Features • • • • • • • • • Information in the 1.8V DDR2 FBDIMM data sheet is directly applicable to this 1.55V DDR2 FBDIMM, except where stated otherwise in this data sheet.

MT47J256M4

Abstract: micron SDRAM SPD table MT47J256M
Contextual Info: 4GB x72, DR 240-Pin DDR2 SDRAM FBDIMM Features 1.5V DDR2 SDRAM FBDIMM MT36GTF51272FY – 4GB Features • • • • • • • • Except where stated in this data sheet, information in the corresponding 1.8V DDR2 FBDIMM data sheet is directly applicable to the 1.5V DDR2 FBDIMM. For

MT29C2G24m

Abstract: MT29C2G48 MT29C4G48M SMD MARKING CODE h23 MT29F4G16ABC JW256 MT29F4G16AB MT29C2G24MAKLAJG-6 MCP LPDDR 1Gb 512Mb marking k22 SMD
Contextual Info: Preliminary‡ 168-Ball NAND Flash and LP-DRAM PoP TI-OMAP MCP Features NAND Flash and LP-DRAM 168-Ball Package-on-a-Package (PoP) Combination Memory (TI OMAP ) Features • • • • • • Figure 1: Micron NAND Flash and LP-DRAM components RoHS-compliant, “green” package

MT29C2G24MAKLAJG-75 IT

Abstract: MT29C2G24MAKLAjg JW256
Contextual Info: Preliminary‡ 168-Ball NAND Flash and LPDRAM PoP TI OMAP MCP Features NAND Flash and Mobile LPDRAM 168-Ball Package-on-Package (PoP) MCP Combination Memory (TI OMAP ) MT29CxGxxMAxxxxx Features Figure 1: PoP Block Diagram Micron NAND Flash and LPDRAM components

Contextual Info: 4GB x72, ECC, DR 240-Pin DDR2 SDRAM RDIMM Features DDR2 SDRAM Registered DIMM MT36HTJ51272(P) – 4GB For component information, refer to the Micron’s Web site: www.micron.com/products/ddr2 Features Figure 1: • 240-pin, registered dual in-line memory module

Contextual Info: ADVANCE‡ 128Mb MULTIBANK BURST FLASH 32Mb/64Mb ASYNC/PAGE CellularRAM COMBO FLASH AND CellularRAM COMBO MEMORY MT28C128532W18/W30D MT28C128564W18/W30D Low Voltage, Wireless Temperature Features Figure 1: 77-Ball FBGA • Stacked die Combo package Includes two 64Mb Flash devices

FW643

Abstract: FX639 FX649 FY631 FY627 w18 SMD smd transistor w18 w18 smd transistor FY651 FW649
Contextual Info: ADVANCE‡ 128Mb MULTIBANK BURST FLASH 32Mb/64Mb ASYNC/PAGE CellularRAM COMBO FLASH AND CellularRAM COMBO MEMORY MT28C128532W18/W30D MT28C128564W18/W30D Low Voltage, Wireless Temperature Features Figure 1: 77-Ball FBGA • Stacked die Combo package Includes two 64Mb Flash devices

marking code micron label

Contextual Info: ADVANCE‡ 64Mb MULTIBANK ASYNC/PAGE FLASH 16Mb ASYNC CellularRAM MEMORY FLASH AND CellularRAM COMBO MEMORY MT28C64416W18AFY Low Voltage, Wireless Temperature Features Figure 1: 68-Ball FBGA Stacked die Combo package • Includes one 64Mb Flash device • Includes one 16Mb CellularRAM device