MDP00 Search Results

GAL-5

Abstract: MDP0040 MO-137 Analog Integrated Circuits
Contextual Info: DETAIL X H -V -0 S eatin g. Plane ^ 0.004 C Drawing #: MDP0040 Rev: E Date: 3 /1 9 /0 1 Units: Inches ± _± -V T- T 0.007 C A B - HIGH PERFORMANCE ANALOG INTEGRATED CIRCUITS T olerance MAX. + / - 0.002 + / - 0.004 + / - 0.004 + / - 0.008 + / - 0.004 + / - 0.009

SOL28 package

Abstract: SOL20 package S020 S028 SOL20 SOL24 SOL-28
Contextual Info: DIMENSION TABLE Sym bol SO—8 SO—14 A Al A2 b c D 1 (3) E 0.068 0.006 0.057 0.017 0.009 0.193 0.236 0.154 0.050 0.025 0.041 0.013 8 0.068 0.006 0.057 0.017 0.009 0.341 0.236 0.154 0.050 0.025 0.041 0.013 14 E l (a)(3) e L LI h N Drawing #: MDP0027 Rev: L

MDP0044

Contextual Info: Plastic Packages for Integrated Circuits Thin Shrink Small Outline Package Family TSSOP MDP0044 0.25 M C A B D THIN SHRINK SMALL OUTLINE PACKAGE FAMILY A (N/2)+1 N MILLIMETERS SYMBOL 14 LD 16 LD 20 LD 24 LD 28 LD TOLERANCE PIN #1 I.D. E E1 1 (N/2) B 0.20 C B A

207CA

Abstract: ODFN DSA00272
Contextual Info: Plastic Packages for Integrated Circuits Optical Dual Flat No-Lead Family ODFN MDP0052 0.10 C 2X D A 4 5 OPTICAL DUAL FLAT NO-LEAD FAMILY 4 MILLIMETERS 0.10 C 2X SYMBOL ODFN5 ODFN6 ODFN8 TOLERANCE A 0.70 0.70 0.70 ±0.05 A1 0.02 0.02 0.02 +0.03/-0.02 b 0.30

NX 38

Abstract: TSOT5 Y14 127
Contextual Info: Plastic Packages for Integrated Circuits TSOT Package Family MDP0049 e1 D TSOT PACKAGE FAMILY A MILLIMETERS 6 N SYMBOL 4 E1 2 E 3 0.15 C D 2X 1 5 2 N/2 0.25 C 2X N/2 TIPS e ddd M B C A-B D b NX 0.15 C A-B 1 3 D 2X TSOT5 TSOT6 TSOT8 TOLERANCE A 1.00 1.00

Contextual Info: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L38.5x7B (One of 10 Packages in MDP0046) 38 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220) A MILLIMETERS D N (N-1)

Contextual Info: Plastic Packages for Integrated Circuits Dual Flat No-Lead Package Family DFN MDP0047 A DUAL FLAT NO-LEAD PACKAGE FAMILY (JEDEC REG: MO-229) D MILLIMETERS N N-1 0.075 C 2X PIN #1 I.D. E 1 2 0.075 C B 2X TOP VIEW (D2) 4 L1 N-1 N L (N LEADS) SYMBOL DFN8 DFN10

Contextual Info: -D- r A2 a Seating Plane A l- 1 •Note 5 eA eB uuuu N /2 b2 Drawing #: MDP0031 Rev: B Date: 2 /2 6 /9 9 Units: Inches PACKAGE OUTLINE DRAWING PLASTIC DUAL INLINE PACKAGE (PDIP) FAMILY JEDEC R eg: M S -0 0 1 HIGH PERFORMANCE ANALOG INTEGRATED CIRCUITS Sem icon du ctor, Inc.

MS0P10

Contextual Info: Gauge J i Plane m V — ;i T 1 - lJ f " -3°±3° i1 ! DETAIL X i—HD 1 Seating _ Plañe IQ l 0.10Ici N Leads Drawing #: MDP0043 Rev: C Date: 6 /1 4 /9 9 Units: mm JEDEC Reg: MO-187 r m m— UM -0-|o.o8 m | c |a |b | h —c PACKAGE OUTLINE DRAWING MINI SO PACKAGE (MSOP) PACKAGE FAMILY

Contextual Info: Plastic Packages for Integrated Circuits HTSSOP Heat-Sink TSSOP Family MDP0048 0.25 M C A B D HTSSOP (Heat-Sink TSSOP) Family A (N/2)+1 N SYMBOL 14 LD 20 LD 24 LD 28 LD 38 LD TOLERANCE PIN #1 I.D. E E1 0.20 C B A 1 (N/2) 2X N/2 LEAD TIPS TOP VIEW B D1 EXPOSED

MDP0044

Contextual Info: Plastic Packages for Integrated Circuits Thin Shrink Small Outline Package Family TSSOP MDP0044 0.25 M C A B D THIN SHRINK SMALL OUTLINE PACKAGE FAMILY A SYMBOL 14 LD 16 LD 20 LD 24 LD 28 LD TOLERANCE (N/2)+1 N PIN #1 I.D. E E1 0.20 C B A 1 (N/2) B 2X N/2 LEAD TIPS

qfn44

Abstract: MO-220 QFN20 QFN28 QFN32 24 terminal jedec package MO-220 QFN-28
Contextual Info: Plastic Packages for Integrated Circuits QFN Quad Flat No-Lead Package Family MDP0046 QFN (QUAD FLAT NO-LEAD) PACKAGE FAMILY (COMPLIANT TO JEDEC MO-220) A SYMBOL QFN44 QFN38 D N (N-1) (N-2) B 1 2 3 PIN #1 I.D. MARK E (N/2) 2X 0.075 C 2X 0.075 C N LEADS TOP VIEW

TQFN 28

Abstract: MO-220 TQFN28 TQFN
Contextual Info: Plastic Packages for Integrated Circuits TQFN Thin Quad Flat No-Lead Package Family MDP0051 A D N (N-1) (N-2) B 1 2 3 SYMBOL PIN #1 I.D. MARK E (N/2) 2X 0.075 C 2X 0.075 C N LEADS TOP VIEW TQFN 28 TQFN 32 TOLERANCE NOTES A 0.75 0.75 ±0.05 - A1 0.02 0.02

MDP0052

Contextual Info: Plastic Packages for Integrated Circuits Optical Dual Flat No-Lead Family ODFN MDP0052 0.10 C 2X D A 4 5 OPTICAL DUAL FLAT NO-LEAD FAMILY 4 0.10 C 2X SYMBOL ODFN5 ODFN6 ODFN8 TOLERANCE A 0.70 0.70 0.70 ±0.05 A1 0.02 0.02 0.02 +0.03/-0.02 b 0.30 0.30 0.30

D207

Abstract: MSOP10
Contextual Info: Plastic Packages for Integrated Circuits Mini SO Package Family MSOP 0.25 M C A B D MINI SO PACKAGE FAMILY (N/2)+1 N E MDP0043 A E1 MILLIMETERS PIN #1 I.D. 1 B (N/2) e H C SEATING PLANE 0.10 C N LEADS SYMBOL MSOP8 MSOP10 TOLERANCE NOTES A 1.10 1.10 Max.

14LD20

Contextual Info: Plastic Packages for Integrated Circuits HTSSOP Heat-Sink TSSOP Family MDP0048 0.25 M C A B D HTSSOP (HEAT-SINK TSSOP) FAMILY A (N/2)+1 N MILLIMETERS SYMBOL 14 LD 20 LD 24 LD 28 LD 38 LD TOLERANCE PIN #1 I.D. E E1 1 0.20 C B A 2X N/2 LEAD TIPS (N/2) TOP VIEW

Contextual Info: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L32.5x6C (One of 10 Packages in MDP0046) 32 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220) A MILLIMETERS D N (N-1)

HSOP28

Contextual Info: Plastic Packages for Integrated Circuits 28 Lead Heatsink SO Package HSOP28 A 0.008 M C A B MDP0042 28 LEAD HEATSINK SO PACKAGE (HSOP28) SLUG-DOWN, 2 MIL STAND-OFF D 28 E 15 PIN #1 I.D. NOTCH E1 1 14 B TOP VIEW 0.010 A B (G) (J) EXPOSED HEATSINK BOTTOM VIEW

Contextual Info: HU IT r Se atin g 'Pläne' i^|0.00 4|C H S ee D etail "X” ^ • 0 .0 10 |c |Ä ] iH 1— b DETAIL X r Sym bol A Al b c D (0(3 E E l (2)(3) e L LI h N Drawing #: MDP0027 Rev: J Date: 2 /2 2 /9 9 Units: Inches JEDEC Reg: M S -0 1 2 /0 1 3 SO—8 0.068

asme y14.5m

Contextual Info: <D 0.60 - - 1.45 0.95 Seating Plane Drawing #: MDP0038 Rev: C Date: 2 /2 2 /9 9 Units: mm JEDEC Reg: M O -178 0.20 J 0.08 PACKAGE OUTLINE DRAWING 5 LEAD SO T -2 3 PACKAGE elantec HIGH PERFORMANCI ANALOG INTEGRATED CIRCUITS Semiconductor, Inc. 1—0 J-I

Contextual Info: <D<D 0.60 - - 1—0 S e a ting P lane 1q - .i._ 0.20 0.08 1o . i o | c [ Drawing #: MDP0038 Rev: D D ate: 2 / 2 2 / 9 9 U nits: m m JEDEC Reg: MO-178 i J PACKAGE OUTLINE DRAWING 5 LEAD S O T -2 3 PACKAGE eiantec HIGH PERFORMANCE ANALOG INTEGRATED CIRCUITS

MS-022

Contextual Info: Plastic Packages for Integrated Circuits Metric Plastic Quad Flatpack Packages MQFP D MDP0055 D1 14x20mm 128 LEAD MQFP (WITH AND WITHOUT HEAT SPREADER) 3.2mm FOOTPRINT 128 PIN 1 ID 1 SYMBOL 20.000 ±0.100 (E1) 19.870 ±0.100 18.500 REF E1 E 12.500 REF C0.600x0.350

DFN10

Abstract: MO-229
Contextual Info: Plastic Packages for Integrated Circuits Dual Flat No-Lead Package Family DFN MDP0047 A DUAL FLAT NO-LEAD PACKAGE FAMILY (JEDEC REG: MO-229) D N N-1 0.075 C 2X PIN #1 I.D. E 1 DFN8 DFN10 TOLERANCE A 0.85 0.90 ±0.10 A1 0.02 0.02 +0.03/-0.02 b 0.30 0.25 ±0.05

MDP0040

Abstract: QSOP16 QSOP24 QSOP28
Contextual Info: Plastic Packages for Integrated Circuits Quarter Size Outline Plastic Packages Family QSOP MDP0040 A QUARTER SIZE OUTLINE PLASTIC PACKAGES FAMILY D (N/2)+1 N E SYMBOL QSOP16 QSOP24 QSOP28 TOLERANCE NOTES PIN #1 I.D. MARK E1 1 (N/2) A 0.068 0.068 0.068 Max.