ODFN Search Results

MO-229

Abstract: JEDEC MO-229
Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L10.3x3E 10 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE ODFN Rev 0, 2/11 6 PIN #1 INDEX AREA A 3.00 6 PIN 1 INDEX AREA B 1 10 3.00 2.5 ±0.10 (4X) 2X 2.00 0.10 5 6 10X 0.20 0.10 M C A B

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L8.3x3E 8 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE ODFN Rev 0, Date 11/06 6 PIN #1 INDEX AREA 3.00 A B 6 PIN 1 INDEX AREA 0.65 (2.29) 3.00 (1.95) 0.30±0.05 (2X) 0.10 0.10 M C A B TOP VIEW

207CA

Abstract: ODFN DSA00272
Contextual Info: Plastic Packages for Integrated Circuits Optical Dual Flat No-Lead Family ODFN MDP0052 0.10 C 2X D A 4 5 OPTICAL DUAL FLAT NO-LEAD FAMILY 4 MILLIMETERS 0.10 C 2X SYMBOL ODFN5 ODFN6 ODFN8 TOLERANCE A 0.70 0.70 0.70 ±0.05 A1 0.02 0.02 0.02 +0.03/-0.02 b 0.30

TB477

Abstract: INTERSIL TRACEABILITY LOT PART MARKING land pattern for DFN Soldering guidelines pin in paste GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICES
Contextual Info: Surface Mount Assembly Guidelines for Optical Dual Flat Pack No Lead ODFN Package Technical Brief Introduction Optical Dual-in-line Flat No-lead (ODFN) packages are developed for light sensor applications. The mechanical structure of an ODFN is similar to that of a conventional

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L8.2.1x2.0 8 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE ODFN Rev 4, 5/15 2.10 A 6 PIN 1 INDEX AREA 0.15 B 0.25 6 PIN 1 INDEX AREA 0.50 1.50 2.00 1.50 0.20±0.05 4 (2X) 0.10 M C A B 0.10

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L10.4x3A 10 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE ODFN Rev 1, 4/15 A 4.00 6 PIN 1 INDEX AREA 6 PIN #1 INDEX AREA B 10 1 3.00 2.14±0.10 2X 2.00 8X 0.50 (4X) 0.10 10X 0.25 6 5 0.10 M C A B

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MDP0052

Contextual Info: Plastic Packages for Integrated Circuits Optical Dual Flat No-Lead Family ODFN MDP0052 0.10 C 2X D A 4 5 OPTICAL DUAL FLAT NO-LEAD FAMILY 4 0.10 C 2X SYMBOL ODFN5 ODFN6 ODFN8 TOLERANCE A 0.70 0.70 0.70 ±0.05 A1 0.02 0.02 0.02 +0.03/-0.02 b 0.30 0.30 0.30

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p933

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Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L10.4x3 10 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE ODFN Rev 0, 10/09 6 PIN 1 INDEX AREA PIN #1 INDEX AREA 6 A 4.00 B 3.00 (4X) 1 10 2.1 ±0.10 0.10 2X 2.00 6 10X 0.25 0.10 M C A B TOP VIEW

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L6.2x2.1 6 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE ODFN Rev 2, 6/10 2.10 A 6 PIN #1 INDEX AREA B 6 PIN 1 INDEX AREA 1 0.65 1.35 2.00 1.30 REF 4 6X 0.30±0.05 (4X) 0.10 0.10 M C A B 0.65

mark L6

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L6.1.65x1.65A 6 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE ODFN Rev 1, 4/15 1.65 0.55 (1x) 0.70 PIN #1 INDEX AREA 6 PIN 1 1.65 0.50 0.25 (6x) 4 (4X) 0.10 0.10 M CAB 0.20 TOP VIEW 0.40 0.85

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L10.3x2.6 10 LEAD OPTICAL DUAL FLAT NO-LEAD PACKAGE ODFN Rev 1, 4/15 6 PIN 1 INDEX AREA A 3.00 0.70 3.00 B 0.50 0.30 2.25 2.60 2.60 b 4 (4X) 0.25 0.10 0.10 TOP VIEW 0.10 M C A B 0.10 0.85 BOTTOM VIEW

TB466

Abstract: qfn 32 land pattern moisture sensitivity ISL29001
Contextual Info: Surface Mount Assembly Guidelines for Optical Dual FlatPack No Lead ODFN Package Technical Brief March 14, 2008 TB466.1 Introduction Part I - ODFN Board Mounting Guidelines Optical Dual-in-line Flat No-lead (ODFN) packages are developed for light sensor applications. The mechanical

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Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L8.2.1x2.0 8 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE ODFN Rev 0, 10/08 2.10 6 A PIN #1 INDEX AREA B 6 PIN 1 INDEX AREA 0.50 2.00 1.50 1.50 0.20±0.05 (2X) 0.10 M C A B 0.10 8X 0 . 35 ± 0 . 05

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L4.1.5x1.3 4 LD 1.5X1.3 OPTICAL DUAL FLAT NO-LEAD ODFN Rev 6, 4/15 1.50 (0.55) A 6 PIN #1 INDEX AREA B 6 PIN 1 INDEX AREA 1 4 1.30 0.50 0.25 ±0.07 4 3 2 (4X) 0.10 0.10 M C A B 3X 0 . 40 ± 0 . 10

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L6.2x2.1 6 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE ODFN Rev 4, 2/15 2.10 A B 6 PIN 1 INDEX AREA 1 6 PIN #1 INDEX AREA 0.65 1.35 2.00 1.30 REF 4 6x0.30 ±0.05 (4X) 0.10 0.10 M C A B 0.65

TB477

Abstract: land pattern for DFN INTERSIL TRACEABILITY LOT PART MARKING Soldering guidelines pin in paste joint filler board
Contextual Info: Surface Mount Assembly Guidelines for Optical Dual Flat Pack No Lead ODFN Package Technical Brief Introduction Optical Dual-in-line Flat No-lead (ODFN) packages are developed for light sensor applications. The mechanical structure of an ODFN is similar to that of a conventional

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6x transistor

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L6.2x2.1 6 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE ODFN Rev 0, 9/06 2.10 A 6 PIN 1 INDEX AREA B 1 6 PIN 1 INDEX AREA 0.65 2.00 1 . 35 (4X) 1 . 30 REF 0.10 6X 0 . 30 ± 0 . 05 0 . 65