MCIMX535DVV1C Search Results

pin vga CRT pinout

Abstract: samsung* lpddr2 LPDDR2-800 i.MX53 PCIMX535DVV1C emmc DDR pcb layout Samsung eMMC 4.41 LPDDR2 PoP JESD209-2 flexcan2
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 3, 7/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA PoP 12 x 12 mm

OV5642

Abstract: sony IMX 322 cmos DA9053 Atheros AR6003 AR6003 SII9022 ov5642 omnivision HSD100PXN1-A00-C11 SiI9022 HDMI transmitter wi-fi schematic miniPCIe
Contextual Info: MCIMX53SMD Board Hardware User’s Guide IMX53SMDHUG Rev. 0 9/2011 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road

SCIMX

Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4.1, 2/2012 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch

MCIMX535

Abstract: emmc DDR3 pcb layout samsung eMMC 4.5 eMMC 4.4 eMMC rja rjc emmc Pin assignment samsung NAND Flash DIE i.mx53 samsung eMMC 5.0 SCIMX
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53CEC Rev. 6, 03/2013 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch

SCIMX538DZK1C

Abstract: samsung eMMC 4.5 MCIMX535 emmc pcb layout lpddr2 pcb layout LPDDR2 PoP samsung* lpddr2* pop package N7U2 Freescale i.MX53 Quick Start Board AMBA AXI
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4.1, 2/2012 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch

MCIMX535

Abstract: MCIMX535DVV1C MCIMX535DVV IMX53CEC mc33902 tepbga-2 MCIMX538DZK1C H.263 *IMX53 emmc pcb layout
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4, 11/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch

eMMC "thermal impedance"

Abstract: PCIMX535DVV1C emmc Card connector 062N n78c 4.712 eMMC PoP emmc pcb layout 100KPD diode 4.7-16
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 2, 5/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA PoP 12 x 12 mm

lpddr2 spec

Abstract: tablet mid SAMSUNG RF MODULATORS MLC nand 2012 emmc DDR3 pcb layout MCIMX535DVV1C emmc 4.5 samsung samsung eMMC 5.1 H 204 TK1 SCIMX
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53CEC Rev. 5, 12/2012 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch

Contextual Info: w WM8325-00C Processor Power Management Subsystem DESCRIPTION FEATURES The WM8325-00C is an integrated power-management subsystem which provides a cost-effective, flexible, single-chip solution for power management. It is specifically targeted at the requirements of the Freescale i.MX53 multimedia

SCIMX

Contextual Info: Freescale Semiconductor Errata Document Number: IMX53CE Rev. 4, 06/2013 Chip Errata for the i.MX53 This document details the silicon errata known at the time of publication for the i.MX53 multimedia applications processors. The contents of this errata apply to the following devices: IMX53xA, IMX53xC,