MARKING CODE H02 Search Results

2N60 transistor

Abstract: all transistor 2N60 transistor 2n60 02N60 2N60 MOSFET MARK y2 y1 marking code transistor 2n60 application 2n60 MOSFEt marking code diode 648
Contextual Info: HI-SINCERITY Spec. No. : MOS200403 Issued Date : 2004.07.01 Revised Date : 2005.07.14 Page No. : 1/6 MICROELECTRONICS CORP. H02N60 Series H02N60 Series Pin Assignment 3-Lead Plastic TO-252 Package Code: J Pin 1: Gate Pin 2 & Tab: Drain Pin 3: Source Tab N-Channel Power Field Effect Transistor

MOSFET MARK y2

Abstract: y1 marking code transistor marking code diode 648 PB40 bridge mosfet k 61 y1 mosfet sn60 transistor mark code H1 diode marking code a2 y2 2N60S marking code 749
Contextual Info: HI-SINCERITY Spec. No. : MOS200504 Issued Date : 2005.05.01 Revised Date : 2005.09.28 Page No. : 1/6 MICROELECTRONICS CORP. H02N60S Series H02N60S Series Pin Assignment 3-Lead Plastic TO-252 Package Code: J Pin 1: Gate Pin 2 & Tab: Drain Pin 3: Source Tab

02n60

Abstract: all transistor 2N60 2N60 2N60 transistor PB40 bridge 2n60 application MOSFET MARK H1 TL 434 H02N60 H02N60E
Contextual Info: HI-SINCERITY Spec. No. : MOS200403 Issued Date : 2004.07.01 Revised Date : 2005.09.28 Page No. : 1/7 MICROELECTRONICS CORP. H02N60 Series H02N60 Series Pin Assignment 3-Lead Plastic TO-252 Package Code: J Pin 1: Gate Pin 2 & Tab: Drain Pin 3: Source Tab N-Channel Power Field Effect Transistor

H02N65

Abstract: H02N60E H02N60F h02n
Contextual Info: HI-SINCERITY Spec. No. : MOS200910 Issued Date : 2009.04.07 Revised Date : Page No. : 1/6 MICROELECTRONICS CORP. H02N65 Series H02N65 Series Pin Assignment Tab 3-Lead Plastic TO-220AB Package Code: E Pin 1: Gate Pin 2 & Tab: Drain Pin 3: Source N-Channel Power Field Effect Transistor

AJSM

Contextual Info: 1. DRAWING NO. THIRD ANGLE PROJ. MATERIALS AND FINISHES: <§> BODY - BRASS ASTM-B16 H02, C36000 , GOLD PLATING CONTACT PIN - PHOSPHOR BRONZE, GOLD PLATING INSULATOR - PTFE PER ASTM D 1710 OR EQUIV. 2. DESCRIPTION A B RELEASE TO MFG. CORRECTED TITLE BLOCK

marking code H02

Contextual Info: APH-SMAP-SMBJ NOTES: 1. DRAWING NO. THIRD ANGLE PROJ. MATERIALS AND FINISHES: <§> BODY - BRASS ASTM-B16 H02, C36000 , GOLD PLATING CONTACT PIN - BRASS, GOLD PLATING INSULATOR - PTFE PER ASTM D 1710 OR EQUIV. 2. A B DATE 9/12/06 5/25/11 RELEASE TO MFG. CORRECTED TITLE BLOCK

Contextual Info: A P H - N J -T N C J NOTES: 1. DRAWING NO. THIRD ANGLE PROJ. MATERIALS AND FINISHES: R E V IS IO N S {§> ^ REV DESCRIPTION A B R E L E A S E TO MFG. C O R R E C T E D TITLE BLO CK DATE 9 /1 2 /0 6 5 /2 5 /1 1 ECO 46262 48598 APPR CPM/ CPM/ BODY - BRASS ASTM-B16 H02, C36000 , NICKEL PLATING

DTC323TK

Contextual Info: DTC323TK Digital transistor, NPN, with 1 resistor Features Dimensions Units : mm • available in SMT3 (SMT, SC-59) package • • package marking: DTC323TK; H02 in addition to standard features of digital transistor, this transistor has: — low collector saturation voltage,

amphenol 74868 ug

Abstract: amphenol 31 74868 ug marking code H02
Contextual Info: R E V 1S I O N S 31-6101 NOTES: DRAWING MATERIALS AND BODY CONTACT INSULATOR 2. FINISHES: TH - B R A S S A S T M - B - B R A S S (A S T M - B - PTFE PER A S T M I6 16 D H02, C 3 6 0 0 0 , N I C K E L P L A T I N G ( . 0 0 0 0 8 T H I C K H02, C 3 6 0 0 0 ) , G O L D P L A T I N G ( . 0 0 0 0 3

1303c

Abstract: 31611 448-61
Contextual Info: NOTES: 1 . MA T E R I A L S OF CONSTRUCTION: BODY, R E T A I N E R R ING, S H E L L , TOP HAT 4 HEX NUT = BRASS A S T M - B 1 6 H02, C 3 6 0 0 0 , NIC K EL PLATED INSULATORS ( 2 ) = PTFE PER ASTM D 1710 OR EOUIV FEMALE CONTACT - B ER Y L L IU M COPPER ( Q Q - C - 5 3 0 ) , GOLD PLATE ( . 0 0 0 0 3 0 MIN T H I C K )

nec b1007

Abstract: T79 code marking C3206 marking s16 marking code C1H qfn marking t88 C3H marking NE02107 T79 marking C3206G
Contextual Info: California Eastern Laboratories Package Dimensions PART NUMBER DESCRIPTION NE68018 NEC part numbers are specified by die and package number. NE680 Die "18" Package PACKAGE MARKINGS NEC devices are marked with various indications which indicate part type, lot code year and month . Due to size constraints,

jd 1803

Abstract: otc114 E2p 93 transistor 2SD1834 B14A DTC143YKA DTC143ZKA transistor marking w9 2SA1690 UMW10
Contextual Info: The Class and Basic Ordering Units for Standard and Semi-standard Products T o m a k e it e a sier for th e cu sto m er to s e le c t th e ty p e o f product b est suited to specific applications, we offer transistors in three types. : an d 1 sta n d a rd ,

marking code H02

Contextual Info: DTC323TU / DTC323TK / DTC323TS DTC343TK / DTC343TS Transistors IDigital transistors built-in resistors DTC323TU / DTC323TK / DTC323TS •A b s o lu te maximum ratings ( T a = 2 5 t ) •Features In addition to the features of regular digital transistors,

CDR03 receiver

Abstract: varistor 250v 592 PH 105k 250v ceramic disc Piezoelectric crystal 1mhz ultrasonic FUSE T2A 250v Motorola transistor smd marking codes smps 10w 5V 230 AC to 5V dc smps capacitor type 104z 50v SR 0805 X7R capacitor
Contextual Info: MLC Capacitors Tantalum Capacitors Microwave Capacitors Thin Film Capacitors Glass Capacitors Chip Resistors Networks EMI Filters Bulk Filters Saw Filters Dielectric Filters Resonators Oscillators Thin Film Inductors Thin Film Fuses Voltage Suppressors Acoustical Piezos

iso 1043-1

Abstract: DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray
Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container

Contextual Info: 4 H REVISIONS DIST - P H J NOTES: J1 1 DRAWING REPRESENTS PART VERSION "A3". 2 PLATING: 3,70 0,05 1,2µm MIN. NICKEL ALL OVER COPLANARITY OF SOLDER SURFACES 0,08 MAX. 4 DIMENSION DEPENDS ON DISTANCE BETWEEN R0,30 REF PWB AND BATTERY, SEE TABLE ON SHEET 4.

F873FN254M760

Abstract: GE Capacitor 23C
Contextual Info: EMI Suppressors Metallized Polypropylene F873 EMI Capacitors Class X1, 760VAC Construction Metallized polypropylene film encapsulated with selfextinguishing resin in a box of material recognized to UL 94 V–0. Benefits • • • • • • • • •

F873FN254M760

Abstract: F873DH473M760 F873DH473M7602 F873RU185M760 F873RP824M760 F873DB123 F873FO254 F873DB103 F873DP104M760 KEC DATE code
Contextual Info: EMI Suppressors Metallized Polypropylene F873 EMI Capacitors Class X1, 760VAC Construction Metallized polypropylene film encapsulated with self-extinguishing resin in a box of material recognized to UL 94 V–0. Benefits • • • • • • • • •

Contextual Info: EMI Suppressors Metallized Polypropylene F873 EMI Capacitors Class X1, 760VAC Construction Metallized polypropylene film encapsulated with self-extinguishing resin in a box of material recognized to UL 94 V–0. Benefits • • • • • • • • •

Contextual Info: LESHAN RADIO COMPANY, LTD. Dual Integrated Circuit LBSS138V3.3T1G N-Channel/PN Duals • We declare that the material of product compliance with RoHS requirements. MAXIMUM RATING Symbol Value Unit VDSS 50 Vdc Gate–to–Source Voltage – Continuous VGS ± 20

LBSS138

Contextual Info: LESHAN RADIO COMPANY, LTD. LBSS138V3.3T1G S-LBSS138V3.3T1G Dual Integrated Circuit N-Channel/PN Duals • We declare that the material of product compliance with RoHS requirements. • S- Prefix for Automotive and Other Applications Requiring Unique Site and

marking code H02

Contextual Info: THIS 15 ISSUED tN STRICT CONFIDENCE ON CONDITION THAT IT IS NOT USED AS A BASIS FOR MANUFACTURE OR SALE, AND THAT IT 5 NOV COPIED, REPRINTED OR DISCLOSED TO A THIRD PARTY WHOLLY OR IN PART WITHOUT THE PftlOR WRITTEN CONSENT OF ITT POMONA. Ph: (909 469-2900

LGA 1156 PIN OUT diagram

Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and

F881

Contextual Info: EMI Suppressors Metallized Polypropylene F881 EMI Capacitors Class Y2, 300VAC Construction Metallized polypropylene film encapsulated with self-extinguishing resin in a box of material recognized to UL 94 V–0. Benefits • • • • • • • • •