LFBGA73 Search Results

sot826

Contextual Info: PDF: 2003 Aug 05 Philips Semiconductors Package outline SOT826-1 LFBGA73: plastic low profile fine-pitch ball grid array package; 73 balls; body 7 x 7 x 0.9 mm B D A ball A1 index area A A2 A1 E detail X C e1 e 1/2 e ∅v M b ∅w M M L K J H G F E D C B A

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA73 package SOT826-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline SOT826-1 LFBGA73: plastic low profile fine-pitch ball grid array package; 73 balls; body 7 x 7 x 0.9 mm B D A ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅w M C M L K J H G F E D C B A ball A1 index area y y1 C ∅v M C A B b e e2

M29DW324D

Abstract: M76DW52004TA Stacked 4MB NOR FLASH
Contextual Info: M76DW52004TA M76DW52004BA 32Mbit 4Mb x8/ 2Mb x16, Dual Bank, Boot Block Flash Memory and 4Mbit (256Kb x16) SRAM, Multiple Memory Product PRELIMINARY DATA FEATURES SUMMARY • MULTIPLE MEMORY PRODUCT Figure 1. Package – 32 Mbit (4Mb x8 or 2Mb x16), Dual Bank, Boot

Stacked 4MB NOR FLASH & SRAM

Abstract: m76 symbol M76 switch M29DW323D M76DW52003BA M76DW52003TA
Contextual Info: M76DW52003TA M76DW52003BA 32Mbit 4Mb x8/ 2Mb x16, Dual Bank, Boot Block Flash Memory and 4Mbit (256Kb x16) SRAM, Multiple Memory Product PRELIMINARY DATA FEATURES SUMMARY • MULTIPLE MEMORY PRODUCT Figure 1. Package – 32 Mbit (4Mb x8 or 2Mb x16), Dual Bank, Boot

A0-A21

Abstract: M29DW640D M76DW62000A M76DW63000A
Contextual Info: M76DW63000A M76DW62000A 64Mbit x8/ x16, Multiple Bank, Boot Block Flash Memory and 8Mbit/4Mbit SRAM, 3V Supply, Multiple Memory Product PRELIMINARY DATA FEATURES SUMMARY • MULTIPLE MEMORY PRODUCT – 64 Mbit (8Mb x8 or 4Mb x16), Multiple Bank, Page, Boot Block, Flash Memory

A0-A21

Abstract: M29DW640D M69AW048B M74DW66500B
Contextual Info: M74DW66500B 2x 64Mbit x8/ x16, Multiple Bank, Boot Block Flash Memory and 32Mbit Pseudo SRAM, 3V Supply, Multiple Memory Product PRELIMINARY DATA FEATURES SUMMARY • MULTIPLE MEMORY PRODUCT Figure 1. Package – Two 64Mbit (8M x8 or 4M x16), Multiple Bank,

BGB202

Abstract: Infineon Specific HCI Commands bluetooth 8038 waveform audio generator "BGP" MBL387
Contextual Info: PCF87852 Bluetooth baseband controller Rev. 01 — 19 August 2004 Product data 1. General description The PCF87852 combines the Bluetooth protocol stack, Link Controller LC , Link Manager (LM), and Host Controller Interface (HCI) firmware of the Bluetooth (BT)

M72DW64000B

Abstract: e2p 25 A0-A21 M29DW640D M69AW024B
Contextual Info: M72DW64000B 64Mbit x8/ x16, Multiple Bank, Boot Block Flash Memory and 16Mbit Pseudo SRAM, 3V Supply, Multiple Memory Product PRELIMINARY DATA FEATURES SUMMARY • MULTIPLE MEMORY PRODUCT Figure 1. Package – 64Mbit (8M x8 or 4M x16), Multiple Bank, Page,

bgb102

Abstract: block diagram bluetooth headset Bluetooth Module adc circuit diagram for wireless headsets "bluetooth system" applications of vlsi in antennas CRC Bluetooth microcontroller controlling wireless headset BGB101 PCF87852
Contextual Info: PCF87852 Bluetooth baseband controller Rev. 01 — 23 April 2004 Preliminary data 1. General description The PCF87852 combines the Bluetooth protocol stack, Link Controller LC , Link Manager (LM), and Host Controller Interface (HCI) firmware of the Bluetooth system