SOT826 Search Results

sot826

Contextual Info: PDF: 2003 Aug 05 Philips Semiconductors Package outline SOT826-1 LFBGA73: plastic low profile fine-pitch ball grid array package; 73 balls; body 7 x 7 x 0.9 mm B D A ball A1 index area A A2 A1 E detail X C e1 e 1/2 e ∅v M b ∅w M M L K J H G F E D C B A

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA73 package SOT826-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline SOT826-1 LFBGA73: plastic low profile fine-pitch ball grid array package; 73 balls; body 7 x 7 x 0.9 mm B D A ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅w M C M L K J H G F E D C B A ball A1 index area y y1 C ∅v M C A B b e e2

BGB202

Abstract: Infineon Specific HCI Commands bluetooth 8038 waveform audio generator "BGP" MBL387
Contextual Info: PCF87852 Bluetooth baseband controller Rev. 01 — 19 August 2004 Product data 1. General description The PCF87852 combines the Bluetooth protocol stack, Link Controller LC , Link Manager (LM), and Host Controller Interface (HCI) firmware of the Bluetooth (BT)