LAND PATTERN FOR TSSOP Search Results

SOD-323 land pattern

Abstract: SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern
Contextual Info: Application Note Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and

qfn 32 land pattern

Abstract: hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782
Contextual Info: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and

200123K

Abstract: QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
Contextual Info: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction Surface Mount Guidelines for Leadless Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP10 package SOT552-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP24 package SOT355-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP38 package SOT510-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP8 package SOT505-2 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP8 package SOT530-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of TSSOP14 package SOT402-1 Hx Gx P2 0.125 (0.125) Hy By Gy Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land occupied area

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP80 package SOT647-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP16 package SOT403-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land

land pattern for TSsOP 16

Abstract: 8 PIN Plastic DIP land pattern maxim 1584 land pattern for TSSOP 24 pin land pattern for TSSOP land pattern for SOIC 16
Contextual Info: 19-1539; Rev 0; 2/00 High-Speed, Single-Supply, Quad, SPST Analog Switches Features Applications Test Equipment Sample-and-Hold Circuits Disk Drives Guidance and Control Systems Tape Drives Military Radios Audio and Video Communications Systems Switching PBX, PABX

Contextual Info: 19-1339; Rev 9; 2/07 ±15kV ESD-Protected, 1µA, 1Mbps, 3.0V to 5.5V, RS-232 Transceivers with AutoShutdown Plus The MAX3224E/MAX3225E/MAX3226E/MAX3227E/ MAX3244E/MAX3245E are 3V-powered EIA/TIA-232 and V.28/V.24 communications interfaces with automatic shutdown/wakeup features, high data-rate capabilities, and enhanced electrostatic discharge ESD

nec 151

Contextual Info: DATA SHEET MOS FIELD EFFECT TRANSISTOR µ PA2503 N-CHANNEL MOS FIELD EFFECT TRANSISTOR FOR SWITCHING DESCRIPTION PACKAGE DRAWING Unit: mm 0.10 M • Low on-state resistance +0.1 spreader. The land size is same as 8-pin TSSOP. 0.25 −0.05 • µ PA2503 has a thin surface mount package with a heat

Contextual Info: DATA SHEET MOS FIELD EFFECT TRANSISTOR µ PA2510 P-CHANNEL MOS FIELD EFFECT TRANSISTOR FOR SWITCHING DESCRIPTION PACKAGE DRAWING Unit: mm 0.10 M • Low on-state resistance +0.1 spreader. The land size is same as 8-pin TSSOP. 0.25 −0.05 • µ PA2510 has a thin surface mount package with a heat

Contextual Info: DATA SHEET MOS FIELD EFFECT TRANSISTOR µ PA2502 N-CHANNEL MOS FIELD EFFECT TRANSISTOR FOR SWITCHING DESCRIPTION 1 2 3 4 3 ±0.1 0.10 S 5.8 ±0.1 6.4 ±0.1 0.17 ±0.05 spreader. The land size is same as 8-pin TSSOP. 8 7 6 5 0.10 M • µ PA2502 has a thin surface mount package with a heat

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing M24.173 24 LEAD THIN SHRINK SMALL OUTLINE PACKAGE TSSOP Rev 1, 5/10 A 1 3 7.80 ±0.10 SEE DETAIL "X" 13 24 6.40 PIN #1 I.D. MARK 4.40 ±0.10 2 3 0.20 C B A 1 12 0.15 +0.05 -0.06 B 0.65 TOP VIEW

land pattern for TSsOP 16

Abstract: m16173 land pattern for TSSOP
Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing M16.173 16 LEAD THIN SHRINK SMALL OUTLINE PACKAGE TSSOP Rev 2, 5/10 A 1 3 5.00 ±0.10 SEE DETAIL "X" 9 16 6.40 PIN #1 I.D. MARK 4.40 ±0.10 2 3 0.20 C B A 1 8 B 0.65 0.09-0.20 END VIEW TOP VIEW

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing M28.173 28 LEAD THIN SHRINK SMALL OUTLINE PACKAGE TSSOP Rev 1, 5/10 A 9.70± 0.10 1 3 SEE DETAIL "X" 15 28 6.40 PIN #1 I.D. MARK 4.40 ± 0.10 2 3 0.20 C B A 1 14 0.15 +0.05 -0.06 B 0.65 TOP VIEW

land pattern for TSSOP

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing M20.173 20 LEAD THIN SHRINK SMALL OUTLINE PACKAGE TSSOP Rev 2, 5/10 A 1 3 6.50 ±0.10 6.40 PIN #1 I.D. MARK 4.40 ±0.10 2 SEE DETAIL "X" 10 20 3 0.20 C B A 1 9 B 0.65 0.09-0.20 TOP VIEW END VIEW

land pattern for TSSOP

Abstract: or gate
Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing M14.173 14 LEAD THIN SHRINK SMALL OUTLINE PACKAGE TSSOP Rev 3, 10/09 A 1 3 5.00 ±0.10 SEE DETAIL "X" 8 14 6.40 PIN #1 I.D. MARK 4.40 ±0.10 2 3 1 0.20 C B A 7 B 0.65 0.09-0.20 TOP VIEW END VIEW

land pattern for TSSOP

Abstract: land pattern for TSsOP 8
Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing M8.173 8 LEAD THIN SHRINK SMALL OUTLINE PACKAGE TSSOP Rev 2, 01/10 A 2 4 3.0 ±0.5 SEE DETAIL "X" 5 8 6.40 CL 4.40 ±0.10 3 4 PIN 1 ID MARK 0.20 C BA 1 4 0.09-0.20 B 0.65 TOP VIEW END VIEW

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing M48.240 48 LEAD THIN SHRINK SMALL OUTLINE PACKAGE TSSOP Rev 1, 11/10 0.50 B 0.09-0.20 48 8.1 C L 6.1±0.10 4 0.20 C A B 2X N/2 TIPS 123 PIN 1 ID 0.17-0.27 SEE DETAIL "A" 0.08 M C A B 5 BOTTOM VIEW

land pattern for sot109-1

Abstract: TSSOP-8 footprint and soldering sot-23 SOD87 footprint
Contextual Info: Packages Package cross reference 88 Packing methods 90 Minimized outline drawings and reflow soldering footprint 96 Package overview 86 107 87 Package cross reference Package cross reference 88 types in bold represent new products types in bold represent new products