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    LAND PATTERN BGA 0.75 Search Results

    LAND PATTERN BGA 0.75 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    84512-202LF
    		Amphenol Communications Solutions 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free PDF
    74221-201LF
    		Amphenol Communications Solutions 400 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free PDF
    84500-002
    		Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array PDF
    84500-102
    		Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array PDF
    84517-001
    		Amphenol Communications Solutions 200 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array PDF

    LAND PATTERN BGA 0.75 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    land pattern BGA 0.75

    Abstract: land pattern BGA 0,50 FBGA 63 flip chip
    Contextual Info: BGA LAND PATTERN DIMENSIONS b2 b e e b2 Unit : mm Land Pattern Dimensions Pin pitch e 1.50 P-BGA 0.63 P-BGA (Flip Chip type) P-BGA(C/D) (Advanced type) P-FBGA P-FBGA (Flip Chip type) T-BGA (TAB type) T-FBGA (Wire type) Land dimeter φ b 2 1.27 1.00 0.80


    Original     		PDF

    BGA Package 0.35mm pitch

    Abstract: E-tec Interconnect .65mm bga land pattern 1072 Diode, SMD 3M Touch Systems bpw 50 TEC Driver 8 pin ic base socket round pin type lead qualitek BGA reflow guide
    Contextual Info: Ball / Land Grid Array Sockets Twist Lock Type E-tec is now the leading BGA socket manufacturer. EP patents 0829188, 0897655 US patents 6190181, 6249440 Patented in other countries. Twist lock sockets are available for any chip size and grid pattern. The SMT socket is simply placed


    Original     		CH-1072 BGA Package 0.35mm pitch E-tec Interconnect .65mm bga land pattern 1072 Diode, SMD 3M Touch Systems bpw 50 TEC Driver 8 pin ic base socket round pin type lead qualitek BGA reflow guide PDF

    sm 0038

    Abstract: SF-BGA256B-B-11
    Contextual Info: D Package Code: BGA256B C 19.05mm [0.750"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] X 19.05mm [0.750"] Top View reference only 2 1.27 mm [0.050"] 0.64mm [0.025"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]


    Original     		BGA256B FR4/G10 SF-BGA256B-B-11 sm 0038 PDF

    16X16

    Abstract: SF-BGA256F-B-11
    Contextual Info: D Package Code: BGA256F C 19.05mm [0.750"] See BGA pattern code to the right for actual pattern layout Y 0.69mm [0.027"] 0.64mm [0.025"] X 19.05mm [0.750"] Top View reference only 1.27mm typ. [0.050"] 0.64mm [0.025"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]


    Original     		BGA256F 16X16 SF-BGA256F-B-11 16X16 PDF

    16X19

    Abstract: SF-BGA303A-B-11
    Contextual Info: D Package Code: BGA303A C 19.05mm [0.750"] See BGA pattern code to the right for actual pattern layout Y 1.27mm [0.050"] 22.86mm [0.900"] X Top View reference only 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] Ø 0.64mm pad [Ø 0.025"] B 1 3 Top View: Recommended PCB Layout


    Original     		BGA303A 16X19 SF-BGA303A-B-11 16X19 PDF

    sm 0038

    Abstract: SF-BGA252A-B-11
    Contextual Info: D Package Code: BGA252A C 19.05mm [0.750"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] 0.64mm [0.025"] X 19.05mm [0.750"] Top View reference only 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]


    Original     		BGA252A FR4/G10 SF-BGA252A-B-11 sm 0038 PDF

    LS-BGA860A-41

    Contextual Info: Top View 0.75mm [0.030"] 0.75mm [0.030"] 42.50mm [1.673"] 1.00mm [0.039"] 42.50mm [1.673"] Side View 1 1.68mm [0.066"] 3.76mm [0.148"] 0.20mm [0.008"]±0.0005" 2 41.00mm [1.614"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.


    Original     		FR4/G10 42x42 LS-BGA860A-41 PDF

    LS-BGA1704A-41

    Contextual Info: Top View 0.75mm [0.030"] 42.50mm [1.673"] 1.00mm [0.039"] 0.75mm [0.030"] 42.50mm [1.673"] Side View 1 1.68mm [0.066"] 3.76mm [0.148"] 0.20mm [0.008"]±0.0005" 2 41.00mm [1.614"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.


    Original     		FR4/G10 42x42 LS-BGA1704A-41 PDF

    LS-BGA1696A-41

    Contextual Info: Top View 42.50mm [1.673"] 0.75mm [0.030"] 1.00mm [0.039"] 0.75mm [0.030"] 42.50mm [1.673"] Side View 1 1.68mm [0.066"] 3.76mm [0.148"] 0.20mm [0.008"]±0.0005" 2 41.00mm [1.614"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.


    Original     		FR4/G10 42x42 LS-BGA1696A-41 PDF

    LS-BGA625C-61

    Contextual Info: Top View 21mm [0.827"] 0.9mm [0.035"] 0.9mm [0.035"] 21mm [0.827"] 0.8mm typ. 19.2mm square [0.756"] 1 3.52mm [0.139"] 2 1.68mm [0.066"] 0.2mm dia. [0.008"] Side View 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. non


    Original     		FR4/G10 25x25 LS-BGA625C-61 PDF

    16x16 bga

    Abstract: LS-BGA256B-31
    Contextual Info: 21.00mm [0.827"] Top View 0.98mm [0.038"] 1.27mm typ. 0.98mm [0.038"] 21.00mm [0.827"] Side View 1 1.68mm [0.066"] 3.76mm [0.148"] 0.20mm [0.008"]±0.0005" 2 19.05mm [0.750"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.


    Original     		FR4/G10 16x16 LS-BGA256B-31 16x16 bga PDF

    land pattern BGA 0.75

    Abstract: BGA reflow guide BGA and CSP bo 137
    Contextual Info: T W H E O R L D L E A D E R I N L O G I C P R O D U C T S Design Summary for 96GKE/114GKF MicroStar BGA Packages TM PCB Design Guidelines Package Via to Board Land Area Configuration MicroStar BGA Package Package ball via Near-Sn/Pb eutectic solder with liquidus


    Original     		96GKE/114GKF com/design/flcomp/packdata/297846 land pattern BGA 0.75 BGA reflow guide BGA and CSP bo 137 PDF

    Solder Paste, Indium 5.8

    Abstract: SOT996-2 VSSOP8 MICROPAK XX SOT103 WLCSP stencil design J-STD-020D SOT996 sot1049 XQFN10U
    Contextual Info: AN10343 MicroPak soldering information Rev. 2 — 30 December 2010 Application note Document information Info Content Keywords MicroPak, footprint, Ball Grid Array BGA , Wafer-Level Chip Scale Package (WLCSP) Abstract This application note describes evaluation of recommended solder land


    Original     		AN10343 Solder Paste, Indium 5.8 SOT996-2 VSSOP8 MICROPAK XX SOT103 WLCSP stencil design J-STD-020D SOT996 sot1049 XQFN10U PDF

    AN-1126

    Abstract: AN-1205 land pattern BGA 0.75 TMCL ACLV MO-151 fbga Substrate design guidelines bga Shipping Trays pcb warpage after reflow Epoxy, glass laminate gold embrittlement
    Contextual Info: Table of Contents Introduction . 2 Package Overview . 3


    Original     		AN-1126 AN-1126 AN-1205 land pattern BGA 0.75 TMCL ACLV MO-151 fbga Substrate design guidelines bga Shipping Trays pcb warpage after reflow Epoxy, glass laminate gold embrittlement PDF

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G PDF

    SF-BGA256B-B-05

    Contextual Info: 28.725mm [1.131"] 2.50mm [0.098"] 19.05mm [0.750"] 2.50mm [0.098"] 2.71mm [0.107"] 2.34mm [0.092"] 28.725mm [1.131"] 2.54mm [0.100"] 19.05mm [0.750"] 23.725mm [0.934"] 1.27mm typ. [0.050"] 5.08mm [0.200"] Top View Ø 0.70mm typ. [Ø 0.028"] 0-80 Threaded Insert


    Original     		725mm FR4/G10 Sn63Pb37 00lating. SF-BGA256B-B-05 PDF

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga PDF

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance PDF

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160 PDF

    BFG95

    Contextual Info: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		UG112 UG072, UG075, XAPP427, BFG95 PDF

    FBGA-484

    Abstract: A54SX32A-CQ256 actel FG484 package mechanical drawing B22 filament base CQ256 land pattern QFP 208 SX72 A54SX32A-FG484 silicone paste p4 FG484
    Contextual Info: Actel CQFP – FBGA484 Adapter Boards SI-SX32-ACQ256SFG484 and SI-SX72-ACQ256SFG484 Contents 1). Introduction 2). Appendix A – SI-SX32-ACQ256SFG484 Mechanical Drawing and Assembly instructions 3). Appendix B – SI-SX72-ACQ256SFG484 Mechanical Drawing and Assembly


    Original     		FBGA484 SI-SX32-ACQ256SFG484 SI-SX72-ACQ256SFG484) SI-SX72-ACQ256SFG484 CQ256 FG484 SI-SX72ACQ256SFG484) FBGA-484 A54SX32A-CQ256 actel FG484 package mechanical drawing B22 filament base land pattern QFP 208 SX72 A54SX32A-FG484 silicone paste p4 PDF

    smd transistor mark E13

    Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4
    Contextual Info: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015B Third Edition – September 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue


    Original     		SSYZ015B smd transistor mark E13 Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4 PDF

    diode b6 k 450

    Abstract: RT1300B6TR13 CTS RESISTOR NETWORK RT1300B6 RT1300B6TR7 TR13 UCC561
    Contextual Info: LVD SCSI Terminator Technical Data Features • 9 Line LVD Termination Network • Ultra2, Ultra3 Compliant • Low Channel Capacitance Less than 0.25pF • Excellent High Frequency Performance • Slim BGA Package • 1% Resistor Tolerance • Low Channel to Channel Cross Talk


    Original     		PDF

    sn63pb37 solder wire

    Abstract: BGA reflow guide BGA PROFILING size 0204 100C TL-TORQUEDRIVER-09 sn63pb37 solder wire shelf life TL-TORQUEDRIVER-01
    Contextual Info: GHz BGA Socket User Manual Tel: 800 404-0204 www.ironwoodelectronics.com GHZ BGA SOCKET USER MANUAL Table of Contents Selecting a BGA socket Socket Mechanics PCB Requirements Backing Plate BGA Socket Assembly MLF (QFN) Socket Assembly: Torque Driver Vacuum Pen


    Original     		PDF