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    LAND PATTERN BGA 0.75 Search Results

    LAND PATTERN BGA 0.75 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    84501-001
    		Amphenol Communications Solutions 300 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array PDF
    84500-002LF
    		Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free PDF
    84553-101LF
    		Amphenol Communications Solutions 300 Position BGA Receptacle, 8mm Component Height, 1.27mm x 1.27mm Array, Lead-free PDF
    84520-102LF
    		Amphenol Communications Solutions 400 Position BGA Plug, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free PDF
    55724-101LF
    		Amphenol Communications Solutions 200 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free PDF

    LAND PATTERN BGA 0.75 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    land pattern BGA 0.75

    Abstract: land pattern BGA 0,50 FBGA 63 flip chip
    Contextual Info: BGA LAND PATTERN DIMENSIONS b2 b e e b2 Unit : mm Land Pattern Dimensions Pin pitch e 1.50 P-BGA 0.63 P-BGA (Flip Chip type) P-BGA(C/D) (Advanced type) P-FBGA P-FBGA (Flip Chip type) T-BGA (TAB type) T-FBGA (Wire type) Land dimeter φ b 2 1.27 1.00 0.80


    Original     		land pattern bga 0.75land pattern bga 0,50fbga 63flip chip PDF

    pitch 0.75mm BGA

    Abstract: BOX21151 LS-BGA54C-61
    Contextual Info: Tooling hole X2 BGA54C 3.75mm [0.148"] See BGA pattern code to the right for actual pattern layout Y 6.00mm [0.236"] 0.75mm typ. Top View (reference only) X Ø 0.41mm [Ø 0.016"] 3.52mm [0.139"] BGA pad 1.93mm [0.076"] 1 0.20mm [0.008"] dia. Top View of Land Pattern


    Original     		bga54cfr4/g10ls-bga54c-61box21151+1pitch 0.75mm bga PDF

    bga48

    Abstract: BOX21151 LS-BGA48N-61 pitch 0.75mm BGA
    Contextual Info: Tooling hole X2 BGA48N 5.25mm [0.207"] See BGA pattern code to the right for actual pattern layout Y 3.75mm [0.148"] 0.75mm typ. Top View (reference only) X Ø 0.41mm [Ø 0.016"] 3.52mm [0.139"] BGA pad 1.93mm [0.076"] 1 0.20mm [0.008"] dia. Top View of Land Pattern


    Original     		bga48nfr4/g10ls-bga48n-61box21151+2bga48pitch 0.75mm bga PDF

    BGA Package 0.35mm pitch

    Abstract: E-tec Interconnect .65mm bga land pattern 1072 Diode, SMD 3M Touch Systems bpw 50 TEC Driver 8 pin ic base socket round pin type lead qualitek BGA reflow guide
    Contextual Info: Ball / Land Grid Array Sockets Twist Lock Type E-tec is now the leading BGA socket manufacturer. EP patents 0829188, 0897655 US patents 6190181, 6249440 Patented in other countries. Twist lock sockets are available for any chip size and grid pattern. The SMT socket is simply placed


    Original     		ch-1072bga package 0.35mm pitche-tec interconnect65mm bga land pattern+71072 diode, smd3m touch systemsbpw 50tec driver8 pin ic base socket round pin type leadqualitekbga reflow guide PDF

    SF-BGA255A-B-11

    Contextual Info: D SF-BGA255A-B-11 C 19.05mm [0.750"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] 0.64mm [0.025"] X Top View reference only 19.05mm [0.750"] 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"] [0.210"]


    Original     		sf-bga255a-b-11fr4/g10 PDF

    sm 0038

    Abstract: SF-BGA256B-B-11
    Contextual Info: D Package Code: BGA256B C 19.05mm [0.750"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] X 19.05mm [0.750"] Top View reference only 2 1.27 mm [0.050"] 0.64mm [0.025"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]


    Original     		bga256bfr4/g10sf-bga256b-b-11sm 0038 PDF

    16X16

    Abstract: SF-BGA256F-B-11
    Contextual Info: D Package Code: BGA256F C 19.05mm [0.750"] See BGA pattern code to the right for actual pattern layout Y 0.69mm [0.027"] 0.64mm [0.025"] X 19.05mm [0.750"] Top View reference only 1.27mm typ. [0.050"] 0.64mm [0.025"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]


    Original     		bga256f16x16sf-bga256f-b-11 PDF

    16X19

    Abstract: SF-BGA303A-B-11
    Contextual Info: D Package Code: BGA303A C 19.05mm [0.750"] See BGA pattern code to the right for actual pattern layout Y 1.27mm [0.050"] 22.86mm [0.900"] X Top View reference only 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] Ø 0.64mm pad [Ø 0.025"] B 1 3 Top View: Recommended PCB Layout


    Original     		bga303a16x19sf-bga303a-b-11 PDF

    sm 0038

    Abstract: SF-BGA252A-B-11
    Contextual Info: D Package Code: BGA252A C 19.05mm [0.750"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] 0.64mm [0.025"] X 19.05mm [0.750"] Top View reference only 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]


    Original     		bga252afr4/g10sf-bga252a-b-11sm 0038 PDF

    1.27mm pitch zif socket 3M 21X21

    Abstract: 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432
    Contextual Info: Ironwood Electronics SK.1 Sockets and Receptacles Ironwood offers the industry's widest array of high quality sockets and receptacles for BGA, MGA, PGA, QIP, and QFP packages. We also offer parts that provide sockets for in-circuit emulators. • • • •


    Original     		sk-mgaxx/xxxx-03sk-mgaxx/xxxx-01sk-mgaxx/xxxx-02mga10/100a-+101.27mm pitch zif socket 3m 21x211155 lga socket pins17x17* bga 2891155 lga socketpga zif socket 289amp bga 25x25bga169ctextool 15x15 pgaam29040bga432 PDF

    LS-BGA860A-41

    Contextual Info: Top View 0.75mm [0.030"] 0.75mm [0.030"] 42.50mm [1.673"] 1.00mm [0.039"] 42.50mm [1.673"] Side View 1 1.68mm [0.066"] 3.76mm [0.148"] 0.20mm [0.008"]±0.0005" 2 41.00mm [1.614"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.


    Original     		fr4/g1042x42ls-bga860a-41 PDF

    LS-BGA1704A-41

    Contextual Info: Top View 0.75mm [0.030"] 42.50mm [1.673"] 1.00mm [0.039"] 0.75mm [0.030"] 42.50mm [1.673"] Side View 1 1.68mm [0.066"] 3.76mm [0.148"] 0.20mm [0.008"]±0.0005" 2 41.00mm [1.614"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.


    Original     		fr4/g1042x42ls-bga1704a-41 PDF

    LS-BGA1696A-41

    Contextual Info: Top View 42.50mm [1.673"] 0.75mm [0.030"] 1.00mm [0.039"] 0.75mm [0.030"] 42.50mm [1.673"] Side View 1 1.68mm [0.066"] 3.76mm [0.148"] 0.20mm [0.008"]±0.0005" 2 41.00mm [1.614"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.


    Original     		fr4/g1042x42ls-bga1696a-41 PDF

    LS-BGA625C-61

    Contextual Info: Top View 21mm [0.827"] 0.9mm [0.035"] 0.9mm [0.035"] 21mm [0.827"] 0.8mm typ. 19.2mm square [0.756"] 1 3.52mm [0.139"] 2 1.68mm [0.066"] 0.2mm dia. [0.008"] Side View 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. non


    Original     		fr4/g1025x25ls-bga625c-61 PDF

    land pattern BGA 0.75

    Abstract: BGA reflow guide BGA and CSP bo 137
    Contextual Info: T W H E O R L D L E A D E R I N L O G I C P R O D U C T S Design Summary for 96GKE/114GKF MicroStar BGA Packages TM PCB Design Guidelines Package Via to Board Land Area Configuration MicroStar BGA Package Package ball via Near-Sn/Pb eutectic solder with liquidus


    Original     		96gke/114gkfcom/design/flcomp/packdata/297846land pattern bga 0.75bga reflow guide+2bga and cspbo 137 PDF

    Solder Paste, Indium 5.8

    Abstract: SOT996-2 VSSOP8 MICROPAK XX SOT103 WLCSP stencil design J-STD-020D SOT996 sot1049 XQFN10U
    Contextual Info: AN10343 MicroPak soldering information Rev. 2 — 30 December 2010 Application note Document information Info Content Keywords MicroPak, footprint, Ball Grid Array BGA , Wafer-Level Chip Scale Package (WLCSP) Abstract This application note describes evaluation of recommended solder land


    Original     		an10343solder paste, indium 5.8sot996-2vssop8+7micropak xxsot103wlcsp stencil designj-std-020dsot996sot1049xqfn10u PDF

    handbook philips ic26 packaging

    Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
    Contextual Info: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3


    Original     		an01026bga256ot466-1ot471-1+13bga292ot489-1bga304ot550-1bga316handbook philips ic26 packagingland pattern bga 0.75bga outline drawingbga and qfp packagelfbga80lr-735stencil tensionland pattern bga 0,50 PDF

    AN-1126

    Abstract: AN-1205 land pattern BGA 0.75 TMCL ACLV MO-151 fbga Substrate design guidelines bga Shipping Trays pcb warpage after reflow Epoxy, glass laminate gold embrittlement
    Contextual Info: Table of Contents Introduction . 2 Package Overview . 3


    Original     		an-1126an-1205land pattern bga 0.75tmcl aclv+6mo-151fbga substrate design guidelinesbga shipping trayspcb warpage after reflowepoxy, glass laminategold embrittlement PDF

    samtec ASP

    Abstract: ASP-65067-01 LA-BGA92D-DDR2-SDRAM-01 LS-BGA92D-61 land pattern BGA 0.75 0.8mm pitch BGA Mictor
    Contextual Info: 30.00mm [1.181"] Top View 11.00mm 35.00mm [1.378"] 19.00mm 1 DDR IC not included Side View SMT interface 3.25mm [0.128"] LS-BGA92D-61 (Sold separately) 2 3 1 4.67mm [0.184"] assembled 2 11.00mm Pins: material- Brass Alloy 360 1/2 hard; finish- 0.25µm [10µ"] Au over 1.27µm [50µ"]


    Original     		ls-bga92d-6163sn37pbfr4/g10la-bga92d-ddr2-sdram-01+5samtec aspasp-65067-01land pattern bga 0.750.8mm pitch bgamictor PDF

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		ug112ug072ug075xapp427+10xilinx topside markingxilinx part markingpcb footprint fs48, and fsg48smd code v36cf1752reballingrecommended layout csg324bga reflow guidexc2vp7 reflow profilesmd marking code c1g PDF

    SF-BGA256B-B-05

    Contextual Info: 28.725mm [1.131"] 2.50mm [0.098"] 19.05mm [0.750"] 2.50mm [0.098"] 2.71mm [0.107"] 2.34mm [0.092"] 28.725mm [1.131"] 2.54mm [0.100"] 19.05mm [0.750"] 23.725mm [0.934"] 1.27mm typ. [0.050"] 5.08mm [0.200"] Top View Ø 0.70mm typ. [Ø 0.028"] 0-80 Threaded Insert


    Original     		725mmfr4/g10sn63pb3700lating+1sf-bga256b-b-05 PDF

    SF-BGA256B-B-05F

    Contextual Info: RoHS COMPLIANT 28.725mm [1.131"] 2.50mm [0.098"] 19.05mm [0.750"] 2.50mm [0.098"] 2.71mm [0.107"] 2.34mm [0.092"] 28.725mm [1.131"] 2.54mm [0.100"] 19.05mm [0.750"] 23.725mm [0.934"] 1.27mm typ. [0.050"] 5.08mm [0.200"] Top View Ø 0.70mm typ. [Ø 0.028"]


    Original     		725mmfr4/g10sf-bga256b-b-05f PDF

    BGA reflow guide

    Abstract: sn63pb37 solder SPHERES 1mm pitch BGA socket TL-VACUUMPEN-01 sn63pb37 solder wire ultra fine pitch BGA sn63pb37 0.4mm 20mm light dependent resistors 23M1 fine BGA thermal profile
    Contextual Info: Tel: 800 404-0204 • (651) 452-8100 Fax: (651) 452-8400 PO Box 21151 • St. Paul, MN 55121 • USA www.ironwoodelectronics.com GHz BGA Socket User Manual Selecting BGA socket: You need to have the IC package drawing ready to select the right BGA socket. Go to


    Original     		bga reflow guidesn63pb37 solder spheres1mm pitch bga sockettl-vacuumpen-01+6sn63pb37 solder wireultra fine pitch bgasn63pb37 0.4mm20mm light dependent resistors23m1fine bga thermal profile PDF

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		ug112ug072ug075xapp427+10qfn 3x3 tray dimensionxcdaisybfg95xc5vlx330t-1ff1738ipcb footprint fs48, and fsg48ws609jedec so8 wire bond gapxc3s400an-4fg400iffg676xc4vlx25 cmos 668 fcbga PDF