LAND PATTERN BGA 0.75 Search Results

qfn 3x3 tray dimension

Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the

smd transistor mark E13

Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4
Contextual Info: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015B Third Edition – September 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue

Contextual Info: LVD SCSI Terminator Technical Data Features • 9 Line LVD Termination Network • Ultra2, Ultra3 Compliant • Low Channel Capacitance Less than 0.25pF • Excellent High Frequency Performance • Slim BGA Package • 1% Resistor Tolerance • Low Channel to Channel Cross Talk

Contextual Info: MODEL BB1020DT PRELIMINARY DATA Low Voltage Differential LVD SCSI Termination Network CUSTOM POWER MODULES DESCRIPTION The BB1020DT is an LVD termination network designed to terminate high performance SPI-2 (Ultra2) and SPI-3 (Ultra3) bussed applications. Wide SCSI bus applications

Intel reflow soldering profile BGA

Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
Contextual Info: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems

Turn-Key

Abstract: Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets
Contextual Info:  RoHS ISO w i t h 900 d 08 20 i g n : 1 es Certified Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . 2 Catalog 26 Receptacles . . . . . . . . . . . . . . . . . . . . . 22 Package Conversion For Production Applications . . . . 24-25

Cu3Sn

Abstract: ipc 610 non-wetting
Contextual Info: AN10365 Surface mount reflow soldering Rev. 6 — 30 July 2012 Application note Document information Info Content Keywords surface mount, reflow soldering, component handling Abstract This application note provides guidelines for the board mounting and handling of NXP semiconductor packages.

Contextual Info: CL02M550-01 - Rev L - Page 1 of 2 Product Family: Chip Style Delay Line - Single Ended Part Number Series: CL1 Series Construction: Features: •         High Purity Alumina Substrate Micro-strip construction

pcb design of zigbee

Abstract: FBGA 17X17 DRAWING AN3345 LGA71 an3553 lga 115 71-Contact AN2731 AN3003 QFN-32
Contextual Info: Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout Considerations Reference Manual Document Number: ZHDCRM Rev. 1.3 08/2009 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor

land pattern for PSOP

Contextual Info: Plastic dual in-line package PDIP 20 pin 300 mil Min A Al B b c D E El c tA L a S 0.010 0.046 0.018 0.008 28 pin 300 mil Max 0.175 0.054 0.024 0.014 0.980 0.310 0.290 0.263 0.293 0.100 BSC 0.310 0.3S0 0.130 0.110 0° 15° 0.040 Min 0.010 0.0.58 0.016 C.008

footprint jedec MS-026 TQFP 128

Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
Contextual Info: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

footprint jedec MS-026 TQFP

Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
Contextual Info: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

Contextual Info: Spartan-6 FPGA PCB Design and Pin Planning Guide UG393 v1.3 October 17, 2012 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the

xc6s

Abstract: UG393 SPARTAN 6 UG393 v1.1 recommended layout CSG324 SPARTAN 6 UG393 DSP48A1 spartan 6 LX150 hyperlynx TUTORIALS xilinx FFT CSG324
Contextual Info: Spartan-6 FPGA PCB Design and Pin Planning Guide UG393 v1.1 April 29, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the

Contextual Info: FDZ7064N 30V N-Channel Logic Level PowerTrench BGA MOSFET General Description Features Combining Fairchild’s 30V PowerTrench process with state of the art BGA packaging, the FDZ7064N minimizes both PCB space and RDS ON . This BGA MOSFET embodies a breakthrough in packaging

Cu3Sn

Abstract: Solder Paste, Indium, Type 3 SSOP20 LAND PATTERN Solder Paste Indium reflow process control Solder Paste, Indium 5.1, Type 3 HVQFN48 SSOP20 philips pb-free products SOT266-1 LAND PATTERN
Contextual Info: AN10365 Surface mount reflow soldering description Rev. 02 — 26 July 2006 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.

aaei

Contextual Info: DRB GQV, ZQV TPA6203A1 DGN www.ti.com. SLOS364F – MARCH 2002 – REVISED JUNE 2008 1.25-W MONO FULLY DIFFERENTIAL AUDIO POWER AMPLIFIER

TPA6203A1

Abstract: TPA6203A1DGN TPA6203A1DGNG4 TPA6203A1DGNR TPA6203A1DGNRG4 TPA6203A1DRB TPA6203A1GQVR TPA6203A1ZQVR
Contextual Info: DRB GQV, ZQV TPA6203A1 DGN www.ti.com. SLOS364F – MARCH 2002 – REVISED JUNE 2008 1.25-W MONO FULLY DIFFERENTIAL AUDIO POWER AMPLIFIER

Contextual Info: DRB GQV, ZQV TPA6203A1 DGN www.ti.com. SLOS364F – MARCH 2002 – REVISED JUNE 2008 1.25-W MONO FULLY DIFFERENTIAL AUDIO POWER AMPLIFIER

Contextual Info: DRB GQV, ZQV TPA6203A1 DGN www.ti.com. SLOS364F – MARCH 2002 – REVISED JUNE 2008 1.25-W MONO FULLY DIFFERENTIAL AUDIO POWER AMPLIFIER

Contextual Info: DRB GQV, ZQV TPA6203A1 DGN www.ti.com. SLOS364F – MARCH 2002 – REVISED JUNE 2008 1.25-W MONO FULLY DIFFERENTIAL AUDIO POWER AMPLIFIER

TPA6203A1

Abstract: TPA6203A1DGN TPA6203A1DGNG4 TPA6203A1DGNR TPA6203A1DGNRG4 TPA6203A1DRB TPA6203A1GQVR TPA6203A1ZQVR
Contextual Info: DRB GQV, ZQV TPA6203A1 DGN www.ti.com. SLOS364F – MARCH 2002 – REVISED JUNE 2008 1.25-W MONO FULLY DIFFERENTIAL AUDIO POWER AMPLIFIER

Contextual Info: TSM8405P Single P-Channel 1.8V Specified MicroSURFTM MOSFET D D S Lateral Power for Load Switching and PA Switch S S G D G VDS = - 12V RDS on , Vgs @ - 4.5V, Ids @ - 4.9A = 50mΩ RDS (on), Vgs @ - 2.5V, Ids @ - 4.4A = 70mΩ RDS (on), Vgs @ - 1.8V, Ids @ - 4.0A = 90mΩ

28F160

Abstract: 28F160B3 BGA thermal resistance 6x8 intel 28f160 s5 SOP JEDEC tray A576 ubga package BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS TRANSPORT MEDIA AND PACKING
Contextual Info: The Micro Ball Grid Array µBGA* Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than