JEDEC TRAY STANDARD 13 Search Results

DAEWON tray drawing

Abstract: daewon 7x7 DAEWON JEDEC TRAY IA7 B DAEWON JEDEC TRAY 10 X 10 KY 717 atmel 717 daewon tray 7x7 atmel 367 daewon CABGA
Contextual Info: MIE APPROVAL 02/24/98 KY KW SEE DETAIL 'D' — 6.35 ►0.20 0 A Xd •0.20(0) A ZQ — 7.62 - 311.15-+0.25 -0.13 -132.08- +0.25 -0.13 +0.25 -0.13 - 311.66 - - +0.25 -0.13 - 132.59 - - ^10.20(0)1 A| X(R)| •0-10.20(0)1A|Z(0)| 135.9 92.1 SECTIDN

DAEWON JEDEC TRAY 10 X 10

Abstract: DAEWON JEDEC TRAY DAEWON JEDEC TRAY CABGA 7 X 7 DAEWON tray drawing DAEWON drawing daewon tray 41AL daewon JEDEC TRAY 10 X 10
Contextual Info: M IE APPROVED 06/85/99 SB KVMC — 6.35 rx l /“ SEE DETAIL 'D' 10.20 0 a zq O.gQWlAlXj — 7.62 in 311.15- • +0.25 -0.13 - 132.08- -I +0.25 -0.13 +0.25 -0.13 311.66 -■ +0.25 -0.13 - 132.59- - 0.20(H lA|xq <IH0.20 (R) 1A1Z (R) 92.1 SECTIDN 'X-X*

DAEWON JEDEC TRAY 10 X 10

Abstract: daewon MPSU 140 LEI-4 DAEWON JEDEC TRAY CABGA 7 X 7 JEDEC TRAY 10 X 10
Contextual Info: <322.65 — 6.35 • 315.0 - VACUUM PICKUP CELLS 14 PLACES 12 CENTER CELLS, 2 SIDE CELI — 7.62 V BBUMPS l 7 PLACES = 1 E jE E T ilB D ii] mo.20(H iAiz(n>i - 311.15-+0.25 -0.13 - 132.08-+0.25 -0.13 Vj r a X H* Da +0.25 -0.13 - 132.59-M0.20(H)IAIZ<H>

JEDEC TRAY DIMENSIONS

Abstract: JEDEC tray standard OT-007TM-01 JEDEC tray QFP JEDEC tray JEDEC tray standard 10 TRAY MATERIAL
Contextual Info: 39.57 135°C MAX 77.46 29.22 135.9 OT-007TM-01 UNIT : mm A 50.56 31.10 A' 39.57 252.8 315 322.6 <SECTION A - A'> 4.12 6.35 7.62 39.57 48.8 Tray OT-007TM-01 (JEDEC Tray) Material Carbon PPO Heat Proof Temp. Surface resistance 135°C 12 less than 1 x 10 Ω /

Contextual Info: OGN-SMD Fuseholder Blocks & Clips www.schurter.com/pg02b Fuseholder Open Design, 5 x 20 mm, SMD, var. Covers, IEC 60335-1 250 VAC • 4 W / 10 A VDE · 500 VAC/DC · 10 A (UL/CSA) Description Applications - For appliances in unattended use - Glow wire tests acc. to IEC 60695-2-12 and -13

DAEWON JEDEC TRAY 10 X 10

Abstract: DAEWON JEDEC TRAY DAEWON tray drawing JEDEC tray standard 17 x 17 TRAY JEDEC DAEWON DAEWON JEDEC TRAY CABGA 7 X 7 JEDEC TRAY 10 X 10
Contextual Info: 06/09/8000 SA CHUNG • 322.6 - -6.35 SEE DETAIL 'D' V A C U U M PICKUP CELLS 14 PLACES (IE CENTER CELLS, 2 SIDE CELI ■0.20 A Xd -7.62 V BUMPS \17 PLACES 0IO.2O®IAIZ®I - 132.08- +0.25 -0.13 ♦ +H+0 * +0.25 -0.13 - 132.59- - XaESAlrií5,9 010.20®! Al Z ®

DDR2-400

Abstract: DDR2-533 DDR2-667 DDR2-800 JEDEC tray standard 13
Contextual Info: Jun.2010 DDR2 Code Information Component K4TXXXXXXX - XXXXXXX 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 1. Memory K 11. "─" 2. DRAM : 4 12. Package Z : FBGA (Lead-Free) J : FBGA DDP (Lead-Free) H : FBGA (Lead-Free & Halogen-Free) M : FBGA DDP (Lead-Free & Halogen-Free)

Contextual Info: SMM5138XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier • Conversion Gain : -13dB • Input Third Order Intercept IIP3 : +22dBm • LO-RF Isolation : 30dBc

DAEWON JEDEC TRAY

Abstract: DAEWON JEDEC TRAY 10 X 10 JEDEC tray standard 17 x 17 JEDEC tray standard 13 jedec tray scale TRAY DAEWON MPSU DAEWON JEDEC TRAY CABGA 7 X 7 JEDEC TRAY 10 X 10
Contextual Info: 06/09/8000 SA CHUNG • 3 2 2 .6 - -6.35 SEE DETAIL 'D' VACUUM PICKUP C E L L S 14 P L A C E S (IE CENTER CELLS, 2 SIDE CELI ■0.20 A Xd -7.62 V BUMPS \17 P L A C E S 0IO.2O®IAIZ®I - 132.08- +0.25 -0.13 ♦ +H+0 * +0.25 -0.13 - 132.59- - XaESAlrií5,9

Contextual Info: This document was generated on 05/13/2011 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0546987003 Planned for Obsolescence 0.80mm .031" Pitch S.O. DIMM Socket, Right Angle, Surface Mount, 5.20mm (.205") Mounted Height, 144 Circuits, 3.3V Power Supply, Hard Tray Packaging, Height

Contextual Info: SMM5138XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier • Conversion Gain : -13dB • Input Third Order Intercept IIP3 : +22dBm • LO-RF Isolation : 30dBc

JEDEC tray standard 490

Abstract: JEDEC TRAY DIMENSIONS JEDEC tray standard 14490
Contextual Info: TRAY CONTAINER NEC 119.6 135°C MAX. A' A 4.25 9.20 FBGA4x4ESP 8.15 4.25 8.80 7.90 299.2 315.0 322.6 SECTION A-A' 4.25 (6.11) 7.62 4.00 (5.62) 135.9 PPE 14×35=490 UNIT : mm Applied Package 36-pin Plastic FLGA (4×4) Quantity (pcs) 490 MAX. FBGA 4×4 ESP

JEDEC TRAY DIMENSIONS

Abstract: PACKAGE TRAY jedec bga tray tray jedec BGA tray bga JEDEC tray standard
Contextual Info: TRAY CONTAINER UNIT : mm 6x15=90 17.25 107.0 NEC 135°C MAX. A' 14.45 21.40 FBGA17×17A-1 135.9 PPE A 20.50 17.25 287.0 14.00 315.0 322.6 SECTION A – A' 17.25 (6.05) (5.62) 7.62 17.00 Applied Package 256-pin Plastic BGA (17×17) Quantity (pcs) 90 MAX.

JEDEC tray standard 490

Abstract: FBGA
Contextual Info: TRAY CONTAINER NEC 119.6 135°C MAX. A' A 4.25 9.20 FBGA4x4ESP 8.15 4.25 8.80 7.90 299.2 315.0 322.6 SECTION A-A' 4.25 (6.11) 7.62 4.00 (5.62) 135.9 PPE 14×35=490 UNIT : mm Applied Package 49-pin Plastic FBGA (4×4) 64-pin Plastic FBGA (4×4) Quantity (pcs)

JEDEC qfn tray

Abstract: QFn Package tray JEDEC tray standard 13 QFN tray JEDEC TRAY QFN Package tray JEDEC TRAY DIMENSIONS QFN QFN JEDEC TRAY JEDEC tray standard JEDEC TRAY DIMENSIONS
Contextual Info: TRAY CONTAINER A' 7.39 10.00 7.50 7.39 A 135° C MAX. 10.10 7.35 QFN7x7B NEC 121.2 135.9 PPE 13 × 31=403 UNIT : mm 300.0 315.0 322.6 SECTION A-A' 5.92 6.35 7.62 7.39 Applied Package Quantity (pcs) 48-pin Plastic WQFN (7×7) 403 MAX. Tray QFN 7×7B Material

tray datasheet bga

Abstract: jedec tray BGA
Contextual Info: TRAY CONTAINER UNIT : mm A' 7 150° C MAX. 41.45 BGA50 x 50A 50.15 53.00 51.50 50.15 NEC 53.00 135.9 2 × 5=10 PPE A 212.0 315.0 322.6 SECTION A-A' 8.10 8.50 11.50 50.15 Applied Package Quantity (pcs) 2209-pin Plastic BGA (50×50) (FLIP CHIP TYPE) 10 MAX.

JEDEC TRAY DIMENSIONS ssop

Abstract: H649 JEDEC TRAY DIMENSIONS JEDEC TRAY ssop SOP JEDEC tray JEDEC tray standard
Contextual Info: TRAY CONTAINER UNIT : mm HEAT PROOF PPE 7 105.0 NEC 10.3 135°C MAX. 15.00 15.45 375mil48p SSOP A' 15.75 22.00 14.50 286.0 315.0 322.6 SECTION A – A' 5.27 (6.35) 15.75 7.62 135.9 8x14=112 A Applied Package Quantity (pcs) 48-pin • Plastic Shrink SOP (1.7 mm thick)

LQFP1414-8bt Package tray

Abstract: LQFP Package tray h658 LQFP1414-8BT
Contextual Info: TRAY CONTAINER HEAT PROOF 7 A' 15.45 18.0 6x15=90 21.00 A 135°CMAXPPE 105.0 NEC LQFP1414−8BT 15.40 18.0 20.30 284.2 315.0 322.6 < SECTION A – A' > 18.0 5.62 (6.35) 13.85 7.62 135.9 UNIT : mm Applied Package 64-pin Plastic LQFP (1.4mm thick) 80-pin Plastic LQFP (1.4mm thick)

JEDEC TRAY DIMENSIONS

Abstract: JEDEC tray standard JEDEC tray standard 490
Contextual Info: TRAY CONTAINER 3.35 8.80 7.90 3.35 135° C MAX. A' 9.20 8.15 FBGA3 x 3ESP A NEC 119.6 135.9 PPE 14 × 35=490 UNIT : mm 299.2 315.0 322.6 SECTION A-A' 3.35 5.62 (6.07) 7.62 3.00 Applied Package Quantity (pcs) 25-pin Plastic FLGA (3×3) 490 MAX. Tray FBGA3×3 ESP

nec 2565

Abstract: 2565 nec fBGA package tray JEDEC TRAY DIMENSIONS FBGA JEDEC tray standard
Contextual Info: TRAY CONTAINER 19.65 135°C MAX NEC 102.6 A' 16.65 25.65 FBGA 19x19ESP A 19.65 22.00 286.0 14.50 315.0 322.6 SECTION A-A' (5.62) (5.85) 19.65 19.00 7.62 135.9 PPE 5×14=70 UNIT : mm Applied Package Quantity (pcs) 305-pin Plastic FBGA (19×19) FBGA19×19ESP

h744

Abstract: JEDEC TRAY DIMENSIONS FBGA
Contextual Info: TRAY CONTAINER UNIT : mm 14 x 35=490 NEC 119.6 135° CMAX. 4.8 8.15 9.20 FBGA4.5 × 4.5ESP 135.9 PPE A' A 4.8 8.80 7.90 299.2 315.0 322.6 SECTION A-A' (6.41) (5.62) 7.62 4.80 4.38 Applied Package 48-pin Tape FBGA (4.38×4.38) 48-pin Plastic FBGA (4.38×4.38)

JEDEC tray standard

Abstract: JEDEC TRAY DIMENSIONS JEDEC tray standard tsop TRAY TSOP TSOP package tray H6115 TSOP TRAY TRAY DIMENSIONS SSD-A-H6115-2
Contextual Info: TRAY CONTAINER HEAT PROOF A' 12.00 7 135°C MAX. PPE 109.36 13.67 13.27 A NEC TSOP 2 400MIL21 9x13=117 21.10 22.96 19.74 275.52 315.0 (322.6) SECTION A – A' 21.10 5.62 (6.35) 18.00 7.62 135.9 UNIT : mm Applied Package Quantity (pcs) 32-pin Plastic TSOP (II)

TRAY DIMENSIONS TQFP 64

Contextual Info: TRAY CONTAINER 150°C MAX 12.60 A' 10x25=250 11.25 A 12.20 11.10 9.1 113.4 TQFP7×7×1.0mm 135.9 UNIT : mm 9.1 292.8 315.0 322.6 SECTION A – A' Applied Package 48-pin Plastic TQFP (Fine Pitch)(1.0mm thick) 64-pin Plastic TQFP (Fine Pitch)(1.0mm thick)

JEDEC tray standard

Abstract: JEDEC TRAY DIMENSIONS FBGA 97PIN TRAY DIMENSIONS fBGA package tray 12
Contextual Info: TRAY CONTAINER NEC 119.6 8.80 6.50 299.2 315.0 322.6 7.90 6.50 6.00 (5.62) (6.16) Section A – A' 7.62 6.50 135° CMAX. FBGA6 x 6C A' A 8.15 9.20 135.9 PPE 14 × 35=490 UNIT : mm Applied Package Quantity (pcs) 64-pin Plastic FBGA (6×6) 65-pin Plastic FBGA (6×6)