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    JEDEC TRAY BGA Search Results

    JEDEC TRAY BGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TMP139AIYAHR
    		Texas Instruments JEDEC DDR5 temperature sensor with 0.5 °C accuracy 6-DSBGA -40 to 125 Visit Texas Instruments Buy
    SN74SSQE32882ZALR
    		Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments
    SN74SSQEA32882ZALR
    		Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments Buy
    SN74SSQEB32882ZALR
    		Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments Buy
    SN74SSQEC32882ZALR
    		Texas Instruments JEDEC SSTE32882 Compliant Low Power 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments Buy

    JEDEC TRAY BGA Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    tray datasheet bga

    Abstract: BGA35
    Contextual Info: Mounting Pad Packing Name JEDEC Tray T-657 352 pin BGA 35 x 35 A S B C D P J H R K L φM F E I G M NOTE Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition. ITEM A MILLIMETERS 35.00±0.15


    Original     		T-657 P352S1-F6 tray datasheet bga BGA35 PDF

    Teradyne connector

    Abstract: 470-2075-100 470-2105-100 337 BGA footprint 471-2045-100 471-1045-100 471-1025-100 470-2235-100 BGA PROFILING Teradyne
    Contextual Info: TB-2082 DFM and SMT Assembly Guideline Revision “C“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 Initial Release Update stencil design, JEDEC tray info, add weight


    Original     		TB-2082 Teradyne connector 470-2075-100 470-2105-100 337 BGA footprint 471-2045-100 471-1045-100 471-1025-100 470-2235-100 BGA PROFILING Teradyne PDF

    tray datasheet bga

    Abstract: S 657 A S352S1-F6-1
    Contextual Info: Packing Name Mounting Pad JEDEC Tray T-657 352 pin BGA 35 x 35 A B S C D P Index mark J R I H F K L φM E G M NOTE Each lead centerline is located within φ 0.3 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition. NEC CODE S352S1-F6-1


    Original     		T-657 S352S1-F6-1 tray datasheet bga S 657 A S352S1-F6-1 PDF

    tray datasheet bga

    Abstract: F5 MARK S313S1-F5-1
    Contextual Info: Packing Name Mounting Pad JEDEC Tray T-657 313 pin BGA 35 x 35 A B S C D P Index mark J R I H T K L φM M NOTE E G F Each lead centerline is located within φ 0.3 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition. NEC CODE S313S1-F5-1


    Original     		T-657 S313S1-F5-1 tray datasheet bga F5 MARK S313S1-F5-1 PDF

    trays

    Abstract: QFN Shipping Trays PEAK TRAY bga
    Contextual Info: S PEC I FI C AT I ON SHE E T Matrix Trays Matrix T r ay s UltraLite designs Available Now Open Tooling for all popular configurations Quick-tur n, custom tooling ser vices Peak Matrix Trays conform to JEDEC standards and are available in a number of tray types including Pin Grid Array, Plastic Quad


    Original     		PDF

    tray datasheet bga

    Abstract: F5 MARK
    Contextual Info: Mounting Pad Packing Name JEDEC Tray T-657 313 pin BGA 35 x 35 A S B B A C D P Index mark J I R A H S T E G F L φM φN M S A B M S *1 *2 detail of A part ITEM MILLIMETERS INCHES A 35.00±0.20 1.378±0.008 B 30.0 1.181 C 30.0 1.181 D E 35.00±0.20 2.26


    Original     		T-657 Y313S1-F5 tray datasheet bga F5 MARK PDF

    tray datasheet bga

    Contextual Info: Packing Name Mounting Pad JEDEC Tray TBGA 40x40 500 pin T-BGA H/Sp (40 × 40) A A B Q A1 R ST D BW A2 X C Y Index mark J A S H B G F L M P M M E S A B *1 S *2 ITEM A MILLIMETERS 40.00±0.20 INCHES 1.575±0.008 A1 23.00 MAX. 0.906 MAX. A2 23.00 MAX. 0.906 MAX.


    Original     		S500N7-H6 tray datasheet bga PDF

    hsp35

    Abstract: C0016
    Contextual Info: Packing Name Mounting Pad JEDEC Tray TBGA 35x35 352 pin T-BGA H/Sp (35 × 35) A A B Q A1 R S T BW A2 D X C Index mark Y J H S A G B K φM φP L S M M F E S A B S ∗2 detail of A part ∗1 detail of B part (Z) N ITEM MILLIMETERS INCHES A 35.00±0.20 1.378±0.008


    Original     		S352N7-F6-1 hsp35 C0016 PDF

    h 033

    Abstract: P119S1-R4 bga 84
    Contextual Info: Packing Name Mounting Pad JEDEC Tray NX BG1422 2.0 119 pin BGA 14 x 22 A S B T C 7 6 5 4 3 2 1 D U T R P NM L K J HG F E DC B A P J I R H K F E G L ITEM MILLIMETERS INCHES A B 22.0±0.2 19.5 0.866±0.008 0.768 C 12.0 0.472 D E 14.0±0.2 0.84 0.551±0.008


    Original     		BG1422 P119S1-R4 h 033 P119S1-R4 bga 84 PDF

    hsp35

    Abstract: 1362 597G
    Contextual Info: Mounting Pad Packing Name JEDEC Tray TBGA 35x35 420 pin T-BGA H/Sp (35 × 35) A A B Q A1 R S T B W A2 D X C Y Index mark J A S H B G F L M P M M E S A B *1 S *2 ITEM A MILLIMETERS 35.00±0.20 INCHES 1.378±0.008 A1 20.50 MAX. 0.807 MAX. A2 20.50 MAX. 0.807 MAX.


    Original     		S420N7-F6 hsp35 1362 597G PDF

    BGA 8 x 8 tray

    Abstract: tray datasheet bga S576N7
    Contextual Info: Mounting Pad Packing Name JEDEC Tray TBGA 40x40 576 pin T-BGA H/Sp (40 × 40) A A B Q A1 R S T BW A2 D X C Y Index mark J S A H B G F L M P M M E S A B *1 S *2 detail of A part (Z) detail of B part K S N NOTES *1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of


    Original     		S576N7-H6 BGA 8 x 8 tray tray datasheet bga S576N7 PDF

    256-pin

    Contextual Info: Mounting Pad Packing Name JEDEC Tray TBGA 27x27 256 pin T-BGA H/Sp (45 × 45) B A A Q A1 R S T B W A2 D X C Y Index mark A S J H B G F L M P M M E S A B *1 S *2 detail of A part detail of B part (Z) K S N NOTES *1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of


    Original     		25MIN. S256N7-B6 256-pin PDF

    transistor h9

    Contextual Info: Mounting Pad Packing Name JEDEC Tray TBGA 40x40 696 pin T-BGA H/Sp (40 × 40) A U B A1 A Q R S T BW V D A2 X C Index mark J H S A G B K φM φP L S M M detail of A part F S A B S ∗2 ∗1 E detail of B part Z N NOTE ∗1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of


    Original     		S696N7-H9 transistor h9 PDF

    WY transistor

    Abstract: tray datasheet bga 256-pin BGA S256S1-B6-1
    Contextual Info: Mounting Pad Packing Name JEDEC Tray T-651 256 pin BGA 27 x 27 A S B C D Y WV U T R P N M L K J H G F E D C B A P Index mark R H K L 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 φM F E I J G M NOTE Each lead centerline is located within φ 0.3 mm (φ 0.012 inch) of


    Original     		T-651 S256S1-B6-1 WY transistor tray datasheet bga 256-pin BGA S256S1-B6-1 PDF

    tray datasheet bga

    Abstract: 256-pin BGA BGA L WY transistor
    Contextual Info: Packing Name Mounting Pad JEDEC Tray T-651 256 pin BGA 27 x 27 A S B B A C 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D YWV U T R P N M L K J H G F E D C B A P Index mark J R I A H S F L φM φN M S A B M S E G *1 *2 detail of A part K S NOTES * 1 Each lead centerline is located within φ 0.30 mm (φ 0.012 inch) of


    Original     		T-651 Y256S1-B6 tray datasheet bga 256-pin BGA BGA L WY transistor PDF

    strapack s-669

    Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
    Contextual Info: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,


    Original     		PDF

    S146

    Abstract: S514 S144 200POS IT3D-200S-BGA37 IT3D-100S-BGA BGA reflow guide S142 PEAK TRAY bga hirose it3
    Contextual Info: NEW High-Speed 10+Gbps BGA Mezzanine Connectors IT3 Series •Flexibility Hirose’s IT3 mezzanine connector system is as comfortable in today’s data rates of PCIe and XAUI as it is in tomorrow’s 10+Gbps systems. With the ability to transmit differential, single-ended,


    Original     		15mmH misali6-2-2557-7351 S146 S514 S144 200POS IT3D-200S-BGA37 IT3D-100S-BGA BGA reflow guide S142 PEAK TRAY bga hirose it3 PDF

    BGA package tray 40 x 40

    Abstract: ST-BG272720TJ-1-1-Y-1 676 BGA package tray tray datasheet bga TRAY JEDEC BGA 5 6 BGA-544P-M04 tray bga PBGA 484P SDP91-PS,PBGA,496P BGA-676P-M07
    Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET BGA 256, 320, 352, 420, 484, 543, 544, 554, 676 PBGA 256, 352, 416, 420, 480, 484, 496 Maximum storage capacity PKG code Maximum storage capacity PKG code pcs/tray pcs/inner box pcs/outer box BGA-484P-M07 40 400 1600 1600 BGA-484P-M09


    Original     		BGA-484P-M07 BGA-484P-M09 BGA-496P-M02 BGA-543P-M01 BGA-320P-M06 BGA-544P-M01 BGA-352P-M36 BGA-544P-M02 BGA-352P-M41 BGA-544P-M04 BGA package tray 40 x 40 ST-BG272720TJ-1-1-Y-1 676 BGA package tray tray datasheet bga TRAY JEDEC BGA 5 6 BGA-544P-M04 tray bga PBGA 484P SDP91-PS,PBGA,496P BGA-676P-M07 PDF

    BGA PACKAGE TOP MARK intel

    Abstract: 144 bga 12B-1013-G13 BGA PACKAGE TOP MARK 28F160F3 BGA package tray 64 tray bga 17 intel Easy BGA TOP MARK
    Contextual Info: Preliminary Mechanical and Shipping Media Information for Easy BGA Packages May 2000 Document Number: 298049-007 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any


    Original     		28F160F3 US048641 RD33708SW RD33716SW 12B-1013-G13 BGA PACKAGE TOP MARK intel 144 bga 12B-1013-G13 BGA PACKAGE TOP MARK 28F160F3 BGA package tray 64 tray bga 17 intel Easy BGA TOP MARK PDF

    JEDEC TRAY DIMENSIONS

    Abstract: PACKAGE TRAY jedec bga tray tray jedec BGA tray bga JEDEC tray standard
    Contextual Info: TRAY CONTAINER UNIT : mm 6x15=90 17.25 107.0 NEC 135°C MAX. A' 14.45 21.40 FBGA17×17A-1 135.9 PPE A 20.50 17.25 287.0 14.00 315.0 322.6 SECTION A – A' 17.25 (6.05) (5.62) 7.62 17.00 Applied Package 256-pin Plastic BGA (17×17) Quantity (pcs) 90 MAX.


    Original     		FBGA17 256-pin SSD-A-H7511 JEDEC TRAY DIMENSIONS PACKAGE TRAY jedec bga tray tray jedec BGA tray bga JEDEC tray standard PDF

    tray datasheet bga

    Abstract: jedec tray BGA
    Contextual Info: TRAY CONTAINER UNIT : mm A' 7 150° C MAX. 41.45 BGA50 x 50A 50.15 53.00 51.50 50.15 NEC 53.00 135.9 2 × 5=10 PPE A 212.0 315.0 322.6 SECTION A-A' 8.10 8.50 11.50 50.15 Applied Package Quantity (pcs) 2209-pin Plastic BGA (50×50) (FLIP CHIP TYPE) 10 MAX.


    Original     		BGA50 2209-pin BGA50 SSD-A-H7711 tray datasheet bga jedec tray BGA PDF

    nec 2565

    Abstract: NEC C 324 C 2565 nec nec 1026 JEDEC TRAY DIMENSIONS BGA package tray tray bga
    Contextual Info: TRAY CONTAINER 135°C MAX 19.65 NEC 102.6 A' 16.65 25.65 FBGA 19x19A A 19.65 22.00 286.0 14.50 315.0 322.6 SECTION A-A' (5.62) (5.80) 19.65 19.00 7.62 135.9 PPE 5×14=70 UNIT : mm Applied Package Quantity (pcs) 324-pin Plastic BGA (19×19) 70 MAX. Tray


    Original     		324-pin BGA19 SSD-A-H7599 nec 2565 NEC C 324 C 2565 nec nec 1026 JEDEC TRAY DIMENSIONS BGA package tray tray bga PDF

    nec 575

    Abstract: 484-pin BGA NEC C 324 C jedec tray BGA 324-PIN tray datasheet bga JEDEC tray standard tray bga TRAY DIMENSIONS TRAY CONTAINER
    Contextual Info: TRAY CONTAINER UNIT : mm 5x12=60 PPE 135°C MAX. 16.95 25.50 23.25 BGA23×23ESP NEC 102.0 A' 25.50 135.9 A 23.25 17.25 280.5 315.0 322.6 Section A – A' 23.25 (6.07) (6.35) 7.62 23.00 Applied Package Quantity (pcs) 324-pin Plastic BGA (23×23) 352-pin Plastic BGA (23×23)


    Original     		BGA23 23ESP 324-pin 352-pin 484-pin 575-pin SSD-A-H7317-4 nec 575 484-pin BGA NEC C 324 C jedec tray BGA tray datasheet bga JEDEC tray standard tray bga TRAY DIMENSIONS TRAY CONTAINER PDF

    nec 2565

    Abstract: tray bga 576 tray datasheet bga
    Contextual Info: TRAY CONTAINER HEAT PROOF 7 150°C MAX PPE 40.25 84.6 42.30 A' 25.65 A TBGA 40x40 3×7=21 135.9 Unit : mm 40.25 42.30 253.8 30.60 315.0 322.6 SECTION A – A' 5.82 7.62 (6.35) 40.25 Applied Package 500-pin • Plastic BGA 40×40 576-pin • Plastic BGA 40×40


    Original     		500-pin 576-pin SSD-A-H6757-1 nec 2565 tray bga 576 tray datasheet bga PDF