J937 Search Results

J9610

Abstract: J9620 J9400 J9600 J930 FLD5F15CX-J j9540 j9530
Contextual Info: 1,550nm DWDM Direct Modulation DFB Laser FLD5F15CX-J FEATURES • Direct Modulation Laser for WDM systems • Optimized for Long Distance Transmission Dispersion 1800ps/nm • Peak wavelength 1527.99 to 1563.05nm (C-band: 191.8 to 196.2THz, 100GHz spacing)

J1039

Contextual Info: 1300 Henley Court Pullman, WA 99163 509.334.6306 www.digilentinc.com Universal Development Board Reference Manual Revised January 15, 2014 This manual applies to the UDB rev. E Table of Contents Table of Contents . 1

el 803

Contextual Info: A U S T IN SEMICONDUCTOR IN C hQZ D T 0 0 5 1 1 7 OOGOS^O 1R3 « A U S T M T 5 8 C 1 6 1 8 D IE 1 6K X 18 S Y N C H R O N O U S S R A M MICRON T MILITARY SRAM DIE 4 f c - Z .V & 16K x 18 SRAM WITH CLOCKED, REGISTERED INPUTS FEATURES • • • • • •

J9099B

Abstract: MSM466 J4858C
Contextual Info: Data sheet HP MSM Controller Series Key features • Ease of use, scalability, and redundancy • Enhanced architecture for flexible network design • IEEE 802.11a/b/g/n AP and access device support • Comprehensive WLAN security • Appliance and blade form factors

Contextual Info: Data sheet HP MSM775 zl Premium Controller Module Product overview Working in unison with HP MSM and Unified Access Points, the IEEE 802.11ac-ready HP MSM775 zl Premium Controller Module J9840A delivers a high-performance networking solution. The enhanced controller architecture scales to new WLAN

5550H

Abstract: Bos 6K
Contextual Info: MICRON TECHNOLOGY INC SSE D • b l l l S 4 cî GOGS'ìb'l TS7 URN MT58C1618 DIE 1ÔK X ¡8 SYNCHRONOUS SRAM f f lI C R D M MILITARY SRAM DIE 16K X 18 SRAM WITH CLOCKED, REGISTERED INPUTS FEATURES • • • • DIE OUTLINE Top View Fast access times: 20,25 and 35ns

schematic diagram atx Power supply 500w

Abstract: pioneer PAL 012A 1000w inverter PURE SINE WAVE schematic diagram 600va numeric ups circuit diagrams winbond bios 25064 TLE 9180 infineon smsc MEC 1300 nu TBE schematic diagram inverter 2000w DK55 circuit diagram of luminous 600va UPS
Contextual Info: QUICK INDEX NEW IN THIS ISSUE! Detailed Index - See Pages 3-24 Digital Signal Processors, iCoupler , iMEMS® and iSensor . . . . . 805, 2707, 2768-2769 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 28-568 RF Connectors . . . . . . . . . . . . . . . . . . . . . . Pages 454-455

J927-ND

Abstract: J948-ND J935 128-0711-201 J943-ND J933-ND J928-ND J958-ND J924-ND J983CT-ND
Contextual Info: Fixed Length Cables and Adapters Cont. Adapters Dimensions in (mm) 17.22 Fig. 1 7.92 (Hex) Fig. 8 19.48 Fig. 3 14.93 6.35 Across Flats 7.92 (Hex) Fig. 7 Fig. 2 16.38 Ø 7.14 6.35 Across Flats Fig. 9 17.58 6.35 Across Flats 21.56 14.02 Fig. 4 Ø 7.14 Fig. 10

PBT-GFI5

Abstract: J937 1123343-2 779j AB76
Contextual Info: 3 THIS C DRAWING IS U N P U B L I S H E D . RELEASED FOR ALL C O P Y R I G H T 20 I I 20 1 I PUBLICATION RIGHTS LO C REVISIONS m RESERVED. LTR -R- 00.425 DESCRIPTION D4 6 4 ± 0 . 025 15.5 - . 0 0 . 45 ( TO D OF 2±0 DW N DATE APVD REF R A A © -A B ©

MT5C1008

Abstract: ET 2314 J937
Contextual Info: AUSTIN SEMICONDUCTOR INC büE D • *1002117 0000327 124 M A U S T I MT5C1008 DIE 128K X 8 SRAM I^ IIC R O N 128Kx 8 SRAM MILITARY SRAM DIE WITH DUAL CHIP ENABLE FEATURES DIE OUTLINE Top View 21 1 1 1 1 1 1 1 1 1 0 9 8 7 6 5 4 3 2 1 0 9 8 7 6 5 4 3 2 OOOOOOODOO OO OOO OO OO

C2818

Contextual Info: A U ST IN S E M I C O N D U C T O R INC bOE D • 'îDDSll? 0 0 0 G 35 7 =ibl « A U S T MICRON 16K X MT5C2818 DIE 18 LATCHED SRAM 'T 'M MILITARY SRAM DIE f e '2 3 - O 16Kx 18 SRA M WITH ADDRESS/ DATA INPUT LATCHES FEATURES DIE OUTLINE (Top View OPTIONS

Mil-Std-883 Wire Bond Pull Method 2011

Contextual Info: AUSTIN SEMICONDUCTOR INC büE D • TG02117 0000375 ifl? H A U S T 1 MT58C1616 DIE 16K X 16 SYNCHRONOUS SRAM | u iic = n o N - ■ ' P M W . ' ì - ' S MILITARY SRAM DIE 16Kx 16 SRAM WITH CLOCKED, REGISTERED INPUTS FEATURES •

Mil-Std-883 Wire Bond Pull Method 2011

Contextual Info: MICRON TECHNOLOGY INC blU S H T SSE ]> OOOSÛTB 3^5 • MRN MT5C2568 DIE 32K X 8 SRAM pilC R O N MILITARY SRAM DIE 32K X 8 SRAM FEATURES High speed: 20,25 and 35ns High-performance, low-power, CMOS process _ Single +5V +10% power supply Easy memory expansion with CE and OE options

RJ45 splitter

Abstract: Cable-RJ45-02-R 50394-8100 crimping RJ45 AMP Molex 51021-0200 Molex utp cat 5e renishaw interface stegmann MC58120 MC58220
Contextual Info: Prodigy /CME PC/104 User’s Guide Performance Motion Devices, Inc. 55 Old Bedford Road Lincoln, MA 01773 Revision 1.2, December 2009 NOTICE This document contains proprietary and confidential information of Performance Motion Devices, Inc., and is protected by federal copyright law. The contents of this document may not be disclosed to third parties, translated, copied,

XILINX virtex SLVS

Abstract: XC18V01sog GRM033R60J104K MAX4250EUK fpga256 c86 sot23 j926 PCB-0603 XC18V01SOG20C C139
Contextual Info: 19-4287; Rev 1; 8/09 MAX1437B Evaluation Kit The MAX1437B evaluation kit EV kit is a fully assembled and tested circuit board that contains all the components necessary to evaluate the MAX1437B octal, 12-bit, 50Msps analog-to-digital converter (ADC). The MAX1437B accepts differential analog

jmicron

Abstract: MT58C1
Contextual Info: SSE D MICRON TECHNOLOGY INC IC R O N • b l l i s m 0005^53 LIT 16K X IPIRN MT58C1616 DIE 16 SYNCHRONOUS SRAM -T MILITARY SRAM DIE 16Kx 16 SRAM WITH CLOCKED, REGISTERED INPUTS FEATURES • • • • • • • • Fast access times: 20,25 and 35ns

J937

Contextual Info: MICRON TECHNOLOGY INC SSE ]> ICRÜN LI 1 1 5 ^ 0005^ 35 b74 16K X 18 MT5C2818 DIE .ATCHED SRAM I MRN 'T M b -Z Z -Q . MILITARY SRAM DIE 16Kx 18 SRAM WITH ADDRESS/ DATA INPUT LATCHES FEATURES • Fast access times: 20,25 and 35ns • Single +5V ±10% power supply

3SB140

Contextual Info: blllSMT O O C ^ D S SSE D MICR ON T E C H N O L O G Y INC T37 MT5C1008 DIE 128K X 8 SRAM M IC R O N MILITARY SRAM DIE 128Kx 8 SRAM WITH DUAL CHIP ENABLE FEATURES High speed: 20,25,35 and 45ns High-performance, low-power, CMOS process Easy memory expansion with CE1, CE2 and OE

FLEX10K20

Abstract: POWER GRID CONTROL THROUGH PC project J940 J546 j2c10 J944 BYTEBLASTER transistor j6 J2-C12 j931
Contextual Info: Constellation flex 10k Hardware Development System Constellation is a powerful hardware development system that delivers the flexibility, and ease of use, necessary for rapid prototype development. It is a low cost, off-the-shelf product that provides support

220v AC voltage stabilizer schematic diagram

Abstract: LG color tv Circuit Diagram tda 9370 1000w inverter PURE SINE WAVE schematic diagram schematic diagram atx Power supply 500w TV SHARP IC TDA 9381 PS circuit diagram wireless spy camera 9744 mini mainboard v1.2 sony 279-87 transistor E 13005-2 superpro lx
Contextual Info: QUICK INDEX NEW IN THIS ISSUE! Detailed Index - See Pages 3-24 AD9272 Analog Front End, iMEMS Accelerometers & Gyroscopes . . . . . . 782, 2583 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 28-528 Acceleration and Pressure Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . Page 2585

Mil-Std-883 Wire Bond Pull Method 2011

Abstract: T5C6408
Contextual Info: M I CR ON T E C H N O L O G Y INC b l l l S H T O O D S Ô ? ^ T1S SS E D MICRON MRN M T5C6408 DIE 8K X 8 S R A M ^ r-a u -7 ^ -i7 MILITARY SRAM DIE 8K X 8 SRAM FEATURES DIE OUTLINE Top View OPTIONS 3 3 3 2 2 2 2 2 2 2 2 2 2 2 1 0 9 8 7 6 5 4 3 2 1 0 □□□□□□□□□□□□a

JM7000

Abstract: ltx credence tester ltx ts80 teradyne flex tester credence tester sic wafer j937 optocoupler NAND SiC-JFET ceramic pin grid array package wire bond
Contextual Info: Custom Product Capabilities Micross Components formerly Austin Semiconductor has loyally served the Military & Hi-Rel custom assembly and test marketplace for over 22 years. Custom support has been the company foundation since its inception, with the philosophy that if it can be defined by the customer, Micross will support the

XC18V01S020

Abstract: SLVS MAX1434EVKIT MAX1436EVKIT MAX1437ECQ MAX1437EVKIT MAX1438EVKIT C74 8pin BD5N C139
Contextual Info: 19-3741; Rev 0; 6/05 MAX1434/MAX1436/MAX1437/MAX1438 Evaluation Kits The MAX1434/MAX1436/MAX1437/MAX1438 evaluation kits EV kits are fully assembled and tested circuit boards that contain all the components necessary to evaluate the performance of this family of octal 10-/12bit analog-to-digital converters (ADCs). These ADCs

J9610

Abstract: fujitsu F50 FLD5F15CX-J9620 J9400 dfb 1550 10dbm single frequency laser 1550 butterfly Fujitsu laser direct J9600 j-9610 j9340
Contextual Info: 1,550nm MQW-DFB DWDM Direct Modulation Laser FLD5F15CX-J FEATURES • • • • • • • Direct Modulated MQW DFB Laser Built-in TEC, Thermistor and Monitor PIN-PD Package: 14-Pin Butterfly Type Module Output Power: 10dBm Low Residual Chirp Optimized for 2.5 Gb/s Modulation Rates