IO191 Search Results

RT3PE600L

Abstract: RT3PE3000L AES-128 PAC10 LG484 ProASICPLUS Flash Family FPGAs Advanced v0.1
Contextual Info: Advance v0.1 Radiation-Tolerant ProASIC3 Low-Power SpaceFlight Flash FPGAs with Flash*Freeze Technology Features and Benefits • High-Performance, Low-Skew Global Network • Architecture Supports Ultra-High Utilization MIL-STD-883 Class B Qualified Packaging

Advanced Boot Block Flash

Abstract: AES-128 CS201 CS281 CS289 AGLP125
Contextual Info: v1.5 IGLOO PLUS Low-Power Flash FPGAs with Flash*Freeze Technology Features and Benefits Low Power • • • • • 1.2 V to 1.5 V Core Voltage Support for Low Power Supports Single-Voltage System Operation 5 µW Power Consumption in Flash*Freeze Mode

A3P600

Abstract: A3P060 A3P1000 A3P125 A3P250 AECQ100 AEC-Q100 FG144 FG256 FG484
Contextual Info: v1.0 Automotive ProASIC3 Flash Family FPGAs Features and Benefits Low Power • 1.5 V Core Voltage • Support for 1.5-V-Only Systems • Low-Impedance Flash Switches High-Temperature AEC-Q100–Qualified Devices • Grade 2 105°C TA 115°C TJ • Grade 1 125°C TA (135°C TJ)

A3PE1500

Abstract: A3PE3000 IO23PDB0V2 IO23NDB0V2 IO30PDB1V1 IO05PDB0V0 IO06PDB0V1 IO32PDB1V1 IO10PDB0V1 IO283PDB7V1
Contextual Info: ProASIC3E Packaging 3 – Package Pin Assignments 208-Pin PQFP 1 208 208-Pin PQFP Note: This is the top view of the package. Note For Package Manufacturing and Environmental information, visit the Resource Center at .

A3PE3000L FG484

Abstract: Actel pdf on radio emitter A3PE3000L FG144 FG256 FG324 FG484 PQ208 TDP 245 Y
Contextual Info: v1.3 ProASIC3L Low-Power Flash FPGAs with Flash*Freeze Technology Features and Benefits Low Power • Dramatic Reduction in Dynamic and Static Power Savings • 1.2 V to 1.5 V Core and I/O Voltage Support for Low Power • Low Power Consumption in Flash*Freeze Mode Allows for

A3P250

Abstract: A3P060 A3P1000 Datasheet A3P125 IO97RSB2 IO52NDB1 FBGA A3P250 fbga 256 A3P250 ACTEL ACTEL FBGA 144
Contextual Info: Automotive ProASIC3 Packaging 3 – Package Pin Assignments 100-Pin VQFP 100 1 Note: This is the top view of the package. Note For Package Manufacturing and Environmental information, visit the Resource Center at .

729-Pin

Abstract: Axcelerator FPGAs AX125 IO126PB3F11 AG18 FBGA 896 896-Pin Axcelerator Family FPGAs
Contextual Info: Axcelerator Family FPGAs Package Pin Assignments 180-Pin CSP A1 Ball Pad Corner 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P Figure 3-1 • 180-Pin CSP Bottom View Note For Package Manufacturing and Environmental information, visit Resource center at

Contextual Info: Revision 22 IGLOO Low Power Flash FPGAs with Flash*Freeze Technology Features and Benefits Low Power • • • • • 1.2 V to 1.5 V Core Voltage Support for Low Power Supports Single-Voltage System Operation 5 µW Power Consumption in Flash*Freeze Mode

AES-128

Abstract: FG256 FG484
Contextual Info: v2.0 IGLOOe Low-Power Flash FPGAs with Flash*Freeze Technology Features and Benefits Low Power • • • • 1.2 V to 1.5 V Core Voltage Support for Low Power Supports Single-Voltage System Operation Low-Power Active FPGA Operation Flash*Freeze Technology Enables Ultra-Low Power

Contextual Info: Revision 15 ProASIC3 Flash Family FPGAs with Optional Soft ARM Support Features and Benefits Advanced I/O High Capacity • 15 K to 1 M System Gates • Up to 144 Kbits of True Dual-Port SRAM • Up to 300 User I/Os Reprogrammable Flash Technology • 130-nm, 7-Layer Metal 6 Copper , Flash-Based CMOS

Microcontroller Family SAB 8051 Pocket Guide

Abstract: pin diagram of ic 8032 80513-P SAB 8051a p Microcontroller Family SAB 8051A Pocket Guide 8032b-p B158-H6497-X-X-7600 siemens 8032 SAB 8051 p 8052B-P
Contextual Info: S1E D • a23Sb05 SIEM ENS 0044641 515 « S I E G SIEMENS AKTI ENGESELLSCHAF - ¡ ^ « - 1 ^ - 0 5 8-Bit Single-Chip Microcontroller SAB 8052/8032 Family Preliminary SAB 8052B Microcontroller with factory-maskprogrammable ROM 8K SAB 80513 Microcontroller with factory mask-programmable ROM (16 K)

ARMv6

Abstract: cortex a15 core Cortex-m1 Cortex R4 TRANSISTOR ww1 AES-128 FG256 FG484 T8 851
Contextual Info: v1.2 IGLOOe Low-Power Flash FPGAs with Flash*Freeze Technology Features and Benefits Low Power • • • • 1.2 V to 1.5 V Core Voltage Support for Low Power Supports Single-Voltage System Operation Low-Power Active FPGA Operation Flash*Freeze Technology Enables Ultra-Low Power

CPLD

Abstract: CS-289
Contextual Info: Revision 14 IGLOO PLUS Low Power Flash FPGAs with Flash*Freeze Technology Features and Benefits Advanced I/O Low Power • • • • • 1.2 V to 1.5 V Core Voltage Support for Low Power Supports Single-Voltage System Operation 5 µW Power Consumption in Flash*Freeze Mode

ProASIC3 Flash Family

Contextual Info: Revision 5 Automotive ProASIC3 Flash Family FPGAs Features and Benefits Low Power • 1.5 V Core Voltage • Support for 1.5-V-Only Systems • Low-Impedance Flash Switches Extended Temperature AEC-Q100–Qualified Devices • Grade 2: –40°C to 105°C TA 115°C TJ

AES-128

Abstract: FG256 FG484 ARMv6
Contextual Info: Revision 8 IGLOOe Low Power Flash FPGAs with Flash*Freeze Technology Features and Benefits Low Power • • • • 1.2 V to 1.5 V Core Voltage Support for Low Power Supports Single-Voltage System Operation Low-Power Active FPGA Operation Flash*Freeze

RT3PE3000

Abstract: RT3PE600L RT3PE3000L CCGA AES-128 PAC10 IO72NDB4V0
Contextual Info: Advance v0.1 Radiation-Tolerant ProASIC3 Low-Power SpaceFlight Flash FPGAs with Flash*Freeze Technology Features and Benefits • High-Performance, Low-Skew Global Network • Architecture Supports Ultra-High Utilization MIL-STD-883 Class B Qualified Packaging

A3PE600

Contextual Info: v1.0 ProASIC3E Flash Family FPGAs with Optional Soft ARM® Support Features and Benefits High Capacity • 600 k to 3 Million System Gates • 108 to 504 kbits of True Dual-Port SRAM • Up to 620 User I/Os Reprogrammable Flash Technology • • • •

LGA 478 SOCKET PIN LAYOUT

Abstract: RTAX2000
Contextual Info: v5.2 RTAX-S/SL RadTolerant FPGAs Radiation Performance Leading-Edge Performance • • • • • • • • • • SEU-Hardened Registers Eliminate the Need for TripleModule Redundancy TMR – Immune to Single-Event Upsets (SEU) to LETTH > 37 MeV-cm2/mg

Contextual Info: ProASIC 3 Datasheet P ro du c t Br ie f 1 – ProASIC®3 Flash Family FPGAs with Optional Soft ARM® Support Features and Benefits • • • • • 30 k to 1 Million System Gates Up to 144 kbits of True Dual-Port SRAM Up to 300 User I/Os Reprogrammable Flash Technology

Contextual Info: v1.0 IGLOO Low-Power Flash FPGAs with Flash*Freeze Technology Features and Benefits Advanced I/O Low Power • • • • • 1.2 V or 1.5 V Core and I/O Voltage for Low Power Supports Single-Voltage System Operation 5 µW Power Consumption in Flash*Freeze Mode

1100 847 e11

Abstract: c 1383
Contextual Info: v1.0 Automotive ProASIC3 Flash Family FPGAs Features and Benefits Low Power • 1.5 V Core Voltage • Support for 1.5-V-Only Systems • Low-Impedance Flash Switches High-Temperature AEC-Q100–Qualified Devices • Grade 2 105°C TA 115°C TJ • Grade 1 125°C TA (135°C TJ)

peak china qfn 9 x 9 tray drawing

Abstract: semi catalog AGL1000-FG484
Contextual Info: IGLOO Handbook IGLOO Handbook Table of Contents Low-Power Flash Device Handbooks Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . i Section I – IGLOO Datasheet IGLOO Low-Power Flash FPGAs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I

Contextual Info: Product Brief 1 – IGLOO PLUS Low-Power Flash FPGAs with Flash*Freeze Technology Features and Benefits High-Performance Routing Hierarchy Low Power Advanced I/O • Segmented, Hierarchical Routing and Clock Structure • • • • • 1.2 V or 1.5 V Core Voltage for Low Power

connect usb in vcd player circuit diagram

Abstract: DIODE MARKING 534
Contextual Info: IGLOOe Handbook IGLOOe Handbook Table of Contents Low-Power Flash Device Handbooks Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . i Section I – IGLOOe Datasheet IGLOOe Low-Power Flash FPGAs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I