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    HQFP256 Search Results

    HQFP256 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    PRQP0256LA-B

    Abstract: d192
    Contextual Info: JEITA Package Code P-HQFP256-28x28-0.40 RENESAS Code PRQP0256LA-B Previous Code FP-256G/FP-256GV MASS[Typ.] 5.4g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 192 129 193 128 HE b1 Reference


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    p-hqfp256-28x28-0prqp0256la-bfp-256g/fp-256gvd192 PDF

    Contextual Info: HQFP256-C-3636-0.50 Radiation fin Metal cap 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 アルミナ コバール Ni/Au (Au: ≥1.5µm) 24.5 TYP.


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    hqfp256-c-3636-0 PDF

    Al2O3

    Abstract: HQFP256-C-3636-0 kovar
    Contextual Info: HQFP256-C-3636-0.50 Radiation fin Metal cap 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Al2O3 Kovar Ni/Au (Au: ≥1.5µm) 24.5 TYP.


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    hqfp256-c-3636-0al2o3kovar PDF

    HQFP256-P-2828-0

    Abstract: CA2E
    Contextual Info: 256P6K-E Plastic 256pin 28✕28mm body HQFP EIAJ Package Code HQFP256-P-2828-0.40 Weight g JEDEC Code – Under Planning HD D 256 Lead Material Cu Alloy 193 E HE 192 1 Symbol 64 129 128 65 A L1 F b y A1 c A2 e L Detail F A A1 A2 b c D E e HD HE L L1 y Dimension in Millimeters


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    256p6k-e256pinhqfp256-p-2828-0ca2e PDF

    pitch 0.4 QFP 256p

    Abstract: SH-432 TWT Wiring HQFP256 MB86290A MB86292 MB86293 MB86833 V832 Hitachi DSA0079
    Contextual Info: MB86293 <CORAL_LQ> Graphics Controller Specifications Revision 1.1 14th Jan, 2003 Copyright FUJITSU LIMITED 2001 ALL RIGHTS RESERVED • The specifications in this manual are subject to change without notice. Department before purchasing the product described in this manual.


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    mb86293f256025s-c-2-3pitch 0.4 qfp 256psh-432+7twt wiringhqfp256mb86290amb86292mb86833v832hitachi dsa0079 PDF

    LQFP216

    Abstract: 26 pins connector LQFP-216 CSP-240 HQFP256
    Contextual Info: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog


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    14-pinlqfp21626 pins connectorlqfp-216+2csp-240hqfp256 PDF

    TFBGA208

    Abstract: aseram SH7706 SH7751 EPF10K20RC208-3 SHE10 lqfp-216
    Contextual Info: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog


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    tfbga208aseramsh7706sh7751+3epf10k20rc208-3she10lqfp-216 PDF

    hitachi sh3

    Abstract: fujitsu fr-v HQFP208 HQFP256 MB86290A MB86291 MB87J2120 uPD72254Y bga256 power dissipation Bluetooth Base band controller
    Contextual Info: MICROCONTROLLER WORKSHOPS Graphic Controller 1 1 30-Jan-01 Microcomponents Marketing FUJITSU MICROELECTRONICS EUROPE www.fujitsu-fme.com 1 PC graphics sets standards 2 30-Jan-01 Microcomponents Marketing FUJITSU MICROELECTRONICS EUROPE www.fujitsu-fme.com


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    30-jan-01hitachi sh3fujitsu fr-vhqfp208+7hqfp256mb86290amb86291mb87j2120upd72254ybga256 power dissipationbluetooth base band controller PDF

    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Contextual Info: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


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    dip8-p-300-2dip14-p-300-2dip16-p-300-2dip18-p-300-2+12mil-m-38510mil-std-883lga 1156 pin out diagramqsj-44403lga 1150 socket pin diagramlga 1155 socket pin diagramic107-26035-20-glga 1151 pin diagramreflow lga socket 1155ic107-3204-gtb 2929 h alternativelga 1155 pin diagram PDF

    DG3 GI 428 diode

    Abstract: Fujitsu FP 410 diode dg3 gi 428 dg3 gi 428 m*86293 TWT Wiring HQFP256 MB86290A MB86292 MB86293
    Contextual Info: MB86293 <CORAL_LQ> Graphics Controller Specifications Revision 1.4a 19th April, 2004 Copyright FUJITSU LIMITED 2001 ALL RIGHTS RESERVED <Notes> • The specifications in this manual are subject to change without notice. Contact our Sales Department before purchasing the product described in this manual.


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    mb86293dg3 gi 428 diodefujitsu fp 410diode dg3 gi 428+6dg3 gi 428m*86293twt wiringhqfp256mb86290amb86292 PDF

    425M

    Abstract: DIP18 DIP20 DIP28 DIP32 DIP40 SOJ28-P-400-1 PGA wire bonding IPGA400-C-S33U-1 PGA240
    Contextual Info: 2. 外形寸法図 2. 外形寸法図 2 2-1. パッケージ外形寸法 - 2 2-1-1. パッケージ寸法表示記号 - 2 2-1-2. リード位置許容値について - 3


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    p-lfbga144-1313-0p-bga256-2727-1p-bga352-3535-1p-bga420-3535-1+12p-bga560-3535-1p-tflga32-0806-0425mdip18dip20dip28dip32dip40soj28-p-400-1pga wire bondingipga400-c-s33u-1pga240 PDF

    BSV 78 PHILIPS SEMICONDUCTOR

    Abstract: MB86294S 12AH, SC SF L3C analog L4W 74 MB86294 TWT Wiring HQFP256 MB86290A MB86292
    Contextual Info: MB86294/294S <CORAL_LB> Graphics Controller Specifications Revision 1.2 19th Apr, 2004 Copyright FUJITSU LIMITED 2001 ALL RIGHTS RESERVED <Notes> • The specifications in this manual are subject to change without notice. Contact our Sales Department before purchasing the product described in this manual.


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    mb86294/294sbsv 78 philips semiconductormb86294s12ah, sc sf+7l3c analogl4w 74mb86294twt wiringhqfp256mb86290amb86292 PDF

    pitch 0.4 QFP 256p

    Abstract: L3C analog TWT Wiring HQFP256 MB86290A MB86292 MB86294 MB86294S MB86833 PBGA256
    Contextual Info: MB86294/294S <CORAL_LB> Graphics Controller Specifications Revision 1.0 31st Jan, 2003 Copyright FUJITSU LIMITED 2001 ALL RIGHTS RESERVED • The specifications in this manual are subject to change without notice. Department before purchasing the product described in this manual.


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    mb86294/294sf256025s-c-2-3pitch 0.4 qfp 256pl3c analog+8twt wiringhqfp256mb86290amb86292mb86294mb86294smb86833pbga256 PDF

    TSOP 173 g

    Abstract: TSOP 056 P150 P151 SSOP20 SSOP30 SSOP32 TSOPI32-P-814-0 JU-11T QFP304
    Contextual Info: 4. 表面実装型パッケージ(SMD) の実装における参考情報 4. 表面実装型パッケージ(SMD)の実装 における参考情報 4-1. フットパターン - 4 4-1-1. フットパターンの設計方法 - 4


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    10secqfp56-p-910-ksnpb9557030ju-11t+1030sectsop 173 gtsop 056p150p151ssop20ssop30ssop32tsopi32-p-814-0qfp304 PDF

    koki solder paste

    Abstract: BGA256 koki ju-11t QFP128-P-1420-0 JU-11T "the package information document consisting of 8 chapters in total" QFP128-P-2828-0 SSOP20-P-250-0 SSOP30-P-56-0 SSOP32-P-430-1
    Contextual Info: This version: Apr. 2001 Previous version:Jun. 1997 PACKAGE INFORMATION 4. OUTLINE OF SURFACE MOUNTING TECHNOLOGY This document is Chapter 4 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 4. OUTLINE OF SURFACE MOUNTING TECHNOLOGY


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    ju-11tkoki solder pastebga256koki ju-11t+6qfp128-p-1420-0the package information document consisting of 8 chapters in totalqfp128-p-2828-0ssop20-p-250-0ssop30-p-56-0ssop32-p-430-1 PDF

    QFP160-P-2828-0

    Abstract: QFP304 TSOP 66 pin Package thermal resistance TSOP 48 thermal resistance bga 208 PACKAGE QFJ32-P-R450-1 SDIP64-P-750-1 SOJ28-P-400-1 QFP208-P-2828-0 TSOP 48 thermal resistance junction to case
    Contextual Info: This version: Apr. 2001 Previous version:Jun. 1997 PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE This document is Chapter 5 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE


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    qfp160-p-2828-0qfp304tsop 66 pin package thermal resistancetsop 48 thermal resistance+6bga 208 packageqfj32-p-r450-1sdip64-p-750-1soj28-p-400-1qfp208-p-2828-0tsop 48 thermal resistance junction to case PDF

    SMD IC 2025 bl

    Abstract: ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20
    Contextual Info: J2T0011-38-60 ま え が き 平素は「沖半導体製品」を御愛用いただき厚く御礼 申し上げます。 エレクトロニクス分野におきましては 半導体製品 の応用はますます広がりをみせており、その性能 機


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    j2t0011-38-60copyright1998okielectricindustrycoj2t0002-38-60bga-388+14bga-4202144-9028-01-x5x1mil-m-38510mil-std-883smd ic 2025 blssop64d560mk 50075 nqfp package 128 lead .5mmdip16-c-300-2r400s115960ffpq20 PDF

    BLH alpha

    Abstract: Black and wite TV HQFP256 MB86290A MB86292 MB86833 V832 MRC D19 MB3516A 64-MBIT
    Contextual Info: MB86292< <ORCHID> > Graphics Controller Specifications Revision 0.10 Oct2003 Copyright FUJITSU LIMITED 1998, 1999 ALL RIGHTS RESERVED All Rights Reserved The information in this document has been carefully checked and is believed to be reliable. However, Fujitsu Limited assumes no responsibility for inaccuracies.


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    oct2003blh alphablack and wite tvhqfp256+7mb86290amb86292mb86833v832mrc d19mb3516a64-mbit PDF