HITACHI ASSEMBLY DATE CODE Search Results

sumitomo

Abstract: en4065 SUMITOMO eme 5274A 50C24 hitachi trace code hitachi assembly date code Sumitomo 1000 SN74FB1650 SN74FB1651
Contextual Info: TEXAS INSTRUMENTS Final Notification of Qualification for the 100 Pin PCA and 120 Pin PCB Packages at the Hiji, Japan Assembly Site February 5, 1997 Abstract Texas Instruments Standard Linear and Logic SLL is adding Hiji as a qualified assembly site for

TMS57002DPHA

Abstract: TMS57002 identification trace code texas 50C40 F312993PAG TMS57002DPH F312185PJM tms57002d hitachi assembly date code F312993
Contextual Info: Texas Instruments Incorporated Transfer the Assembly Production for the TMS57002DPHA Device from HIJI to TIPI and the Transfer the Wafer Fab Source from MIHO5 to HFAB SAMPLE REQUEST / FINAL NOTIFICATION LETTER PCN# 20020411001 May 28, 2002 Dear Customer: The following notes apply to this correspondence:

84-3MV

Abstract: twl3025 PTWL3025BZGM TWL3025BZGM TWL3025BZGMR identification trace code texas A07s texas instruments lot trace code t3025bggm twl3025bzqwr
Contextual Info: 12500 TI Boulevard, MS 8640, Dallas, Texas 75243 PCN# 20050304000 New Wafer Fab for IOTA A07s Final Change Notification Dear Customer: This is a final announcement of change to a device that is currently offered by Texas Instruments. The details of this change are on the following pages.

hitachi assembly date code

Abstract: Nippon capacitors
Contextual Info: HB56SW3272ESNK-6A/7A 256MB Unbuffered EDO DRAM DIMM 32M-word x 72-bit, 4k Refresh, 2 Bank Module 36 pieces of 16M x 4 components HITACHI ADE-203-840 (Z) Preliminary Rev. 0.0 Oct. 29, 1997 Description The HB56SW3272ESNK is a 32M X 72 dynamic RAM module, mounted 36 pieces of 64-Mbit DRAM

Ablebond 8390

Abstract: ESDA6V2HPRL CLP190ERL LM358DT ESDA6V2HP CLP190 LM324DT M74HC14RM13TR LM2904DT 16 g700
Contextual Info: PRODUCT/PROCESS CHANGE NOTIFICATION PCN DSG/03/380 DSG-DISCRETES & STANDARD IC s- LEADFREE PLATING FOR SOP, TSSOP, SSOP, QSOP PACKAGES. 2003/11/28 PCN DSG/03/380 Product Family /Commercial Product All products in SOP, TSSOP, SSOP, QSOP PACKAGES. Type Of Change

testo rs232 cable

Abstract: hitachi cmon F000000 us7032evb1 0xF000000-F001FFF Hitachi DSA00502
Contextual Info: Hitachi Europe Ltd. ISSUE : TUT/005/1.0 TUTORIAL DATE : 15/11/95 SH1 EVALUATION BOARD TUTORIAL ABSTRACT The following tutorial is designed for someone using the gnu software development tools to generate code for the SH1-evaluation board from Hitachi Europe. It contains code examples

Hitachi DIP Marking Code

Abstract: hitachi PLC cg-40 date CODE hitachi plcc hitachi lot marking hitachi assembly date code Hitachi Date Code
Contextual Info: INTRO DUCTIO N OF PACKAGES H itachi microcomputer devices include various types of package which meet a lot o f requirements such as ever smaller, thinner and more versatile electric appliances. When selecting a package suitable for the customers' use. please refer to the

Contextual Info: HB56SW3272ESNK-6A/7A 256MB Unbuffered EDO DRAM DIMM 32M-word x 72-bit, 4k Refresh, 2 Bank Module 36 pieces of 16M x 4 components HITACHI ADE-203-840 (Z) Preliminary Rev. 0.0 Oct. 29, 1997 Description The HB56SW3272ESNK is a 32M x 72 dynamic RAM module, mounted 36 pieces of 64-Mbit DRAM

Contextual Info: Through Hole Lamp Product Data Sheet LTL17KCBH5D-0G1A Spec No.: DS20-2011-0052 Effective Date: 05/22/2012 Revision: A LITE-ON DCC RELEASE BNS-OD-FC001/A4 LITE-ON Technology Corp. / Optoelectronics No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.

EN4900GC

Abstract: NC7720 CEL9220HF10 EME-G760L EME-G760 HL832nxa Yizbond Hitachi EN4900GC CEL9220 DS-7409HG
Contextual Info: PCN No: PCN1-110704 Qualification of selected products at additional assembly and test sites Initial Change Notification Date: 7/04/2011 This is an initial announcement of change to a device that is currently offered by Energy Micro. The details of this change are on the following pages.

20LMB

Contextual Info: SCD#QM5259 Upscreening/Manufacturing Specification FT7C109-20LMB Title Page . List of Effective Pages . Change List .

ISO-780

Abstract: D-4196 hardwood based plywood B-131-F B727 HITACHI EPP foam dc9300 top markings on hitachi XPEDX pre-stretch wrap
Contextual Info: Dec 31, 2003 Hitachi GST Packaging Requirements Manual, Document Number: 219261-11 Page 1 of 54 PACKAGING and HANDLING Supplier and Interplant Requirements This booklet is the property of Hitachi GST. Its use is only authorized for responding to a request

Contextual Info: Through Hole Lamp Product Data Sheet LTL17KCGP4J-012A Spec No.: DS20-2010-0124 Effective Date: 05/22/2012 Revision: A LITE-ON DCC RELEASE BNS-OD-FC001/A4 LITE-ON Technology Corp. / Optoelectronics No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.

Contextual Info: HB56SW464DBJ Series 4,194,304-word x 64-bit High Density Dynamic RAM Module HITACHI ADE-203-688A Z Rev. 1.0 May. 30, 1997 Description The HB56SW464DBJ is a 4M x 64 dynamic RAM Small Outline Dual In-line Memory Module (S.O.DIMM), mounted 16 pieces of 16-Mbit DRAM (HM51W17805) sealed in TCP package and 1 piece

LTL-1CHJGTHT

Abstract: H08A H08B circuit diagram for alcohol sensor with 10mm LED 15000 mcd
Contextual Info: LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Features * High luminous intensity output. * Low power consumption. * High efficiency. * Versatile mounting on P.C. Board or panel. * I.C. Compatible/low current requirement. * 3.1 mm diameter package.

6AL7

Abstract: Nippon capacitors
Contextual Info: HB56HW465DB Series 4196304-word x 64-bit High Density Dynamic RAM Module HITACHI ADE-203-666A Z Rev. 1.0 May. 20, 1997 Description The HB56HW465DB Series is a 4 M x 64 Dynamic RAM Small Outline Dual In-line Memory Module (S. O. DIMM), mounted 4 pieces of 64-Mbit DRAM (HM5165165ATT/ALTT) sealed in TSOP package and 1

Contextual Info: HB56UW865DB-A Series 8388608-word x 64-bit High Density Dynamic RAM Module HITACHI ADE-203-828A Z Rev. 1.0 Sep. 17, 1997 Description The HB56UW865DB-A Series is a 8 M x 64 Dynamic RAM Small Outline Dual In-line Memory Module (S. 0 . DIMM), mounted 8 pieces of 64-Mbit DRAM (HM5165805A/AL) sealed in TSOP package and 1

do 24C02

Abstract: Nippon capacitors
Contextual Info: HB56SW464DBJ Series 4,194,304-word x 64-bit High Density Dynamic RAM Module HITACHI ADE-203-688A Z Rev. 1.0 May. 30, 1997 Description The HB56SW464DBJ is a 4M x 64 dynamic RAM Small Outline Dual In-line Memory Module (S.O.DIMM), mounted 16 pieces of 16-Mbit DRAM (HM51W17805) sealed in TCP package and 1 piece

Contextual Info: HB56SW864DBK Series 8,338,608-word x 64-bit High Density Dynamic RAM Module HITACHI ADE-203-777A Z Rev. 1.0 Jun. 18, 1997 Description The HB56SW864DBK is a 8M x 64 dynamic RAM Small Outline Dual In-line Memory Module (S.0 .DIMM), mounted 32 pieces of 16-Mbit DRAM (HM51W16405) sealed in TCP package and 1 piece

6AU7

Abstract: hitachi assembly date code Nippon capacitors
Contextual Info: HB56HW465DB Series * 4196304-word x 64-bit High Density Dynamic RAM Module HITACHI ADE-203-666A Z Rev. 1.0 May. 20, 1997 Description The HB56HW465DB Series is a 4 M x 64 Dynamic RAM Small Outline Dual In-line Memory Module (S. O. DIMM), mounted 4 pieces of 64-Mbit DRAM (HM5165165ATT/ALTT) sealed in TSOP package and 1

Contextual Info: HB56UW1672EJN-5/6 128MB Unbuffered EDO DRAM DIMM 16-Mword X 72-bit, 8k Refresh, 1 Bank Module 18 pcs of 16M X 4 components HITACHI ADE-203-902A (Z) Rev. 1.0 Mar. 25, 1998 Description The HB56UW1672EJN belongs to 8-byte DIMM (Dual in-line Memory Module) family , and has been

Contextual Info: HB56UW264DB Series 2,097,152-word x 64-bit High Density Dynamic RAM Module HITACHI ADE-203-735B Z Rev.2.0 Jun. 12, 1997 Description The HB56UW264DB is a 2M x 64 dynamic RAM Small Outline Dual In-line Memory Module (S.O.DIMM), mounted 8 pieces of 16-Mbit DRAM (HM51W17805) sealed in TSOP package and 1 pieces

6AL7

Abstract: Nippon capacitors
Contextual Info: HB56UW865DB-A Series 8388608-word x 64-bit High Density Dynamic RAM Module HITACHI ADE-203-828A Z Rev. 1.0 Sep. 17, 1997 Description The HB56UW865DB-A Series is a 8 M x 64 Dynamic RAM Small Outline Dual In-line Memory Module (S. O. DIMM), mounted 8 pieces of 64-Mbit DRAM (HM5165805A/AL) sealed in TSOP package and 1

c0-toc

Abstract: ADE-203-665A Nippon capacitors
Contextual Info: HB56UW865DB Series 8388608-word x 64-bit High Density Dynamic RAM Module HITACHI ADE-203-665A Z Rev. 1.0 May. 20,1997 Description The HB56UW865DB Series is a 8 M x 64 Dynamic RAM Small Outline Dual In-line Memory Module (S. O. DIMM), mounted 8 pieces of 64-Mbit DRAM