GSI CROSS Search Results

AN1007

Abstract: DSP56652 GSI cross GS71024 GS73024 DSP56300 DSP56600 DSP56690 ADSP-2100 ADSP2106
Contextual Info: AN1007 APPLICATION NOTE Pushing Your DSP to the Limit with GSI Technology SRAMs A broad range of digital signal processor applications in the telecommunications infrastructure feature large signal-processing tasks and require the very highest computational performance. New server

1N007

Abstract: fri07 1N007 rectifier MDA 2500 1Ns408 MDA 2506 by164 philips wiom BY225-200 ITT 1N4005
Contextual Info: FAGQR ELECTRONICS 57E D WÊ 3 ^ 3 2 5 Q000LS3 T31 « F G R S CROSS REFERENCE COMPETITIVE SERIES COMPETITOR FAGOR SERIES 1 5SKE 8 2 - 1 5KE 300 1 SKE 8 2 A -1 5KE 300 A THOM/CS1/MOT/GI THOM/GSI/MOT/GI 1 SKE 8 2 C -1 5KE 300 C 1 5SE 12 - 1 SSE 300 1 5SE 12 A • 1 5SE 300 A

AN15853

Abstract: td501 ANI5853A
Contextual Info: A P P f'O Y F n X T Fi-'?.' /• ID ocN o.|sD SC-PSE-tff0tSfr3,rt Prepared Product Specifications Checked A N 15853A Approved Type Total Page 21 Page No. 1 /J 1 S C ' S \ i oam i V gSiä n y Silicon M onolithic Bipolar IC Package Application 36-U SO Pin Plastic Package U SO N F-36D )

K6X0808C1D-BF55

Abstract: HY6264P AS6C1008-55SIN samsung p28 K6R4016V1D-UC10 as6c4008-55sin HYNIX IS61LV25616AL-10KLI GS71116AGP-10 uPD431000ACZ-70L
Contextual Info: cross_reference Density Organization Alliance Alliance Part Number Alliance Package Alliance Speed Samsung Samsung Part Number Cypress Cypress Part Number Cypress Package Cypress Package Code Cypress Speed IDT Part Number IDT Package IDT Package Code IDT Speed ISSI

um61256

Abstract: PM25LV040 SST25LF040B Pm25LV016 PM25LV010A PM25LV080 SST25LF512A HY514264 M5M418 hynix hy57v281620
Contextual Info: Cross Reference Your Memory Supplier part number brand AMIC part number Description µPD4218165 µPD4218165 µPD424260 µPD431000A µPD43256B µPD441000L-B µPD442000L-B µPD442012L-XB µPD444012L-B A29F002 AM29DL162C/D AM29DL163C/D AM29DL164C/D AM29F002B

1H08S

Abstract: PI6C2405A-1HW ASM706CUA SOIC-6 microchip ADM809RAR ADM705AN MAX809SEUR T ASM5P2309-1H-16-S K7N163601B MAX810JEUR
Contextual Info: Supervisors Cross Reference Guide Alliance Maxim/Dallas IMP ASM1232LP DS1232LPS-2 IMP1232LP ASM1232LPCMA DS1232LP IMP1232LPCMA ASM1232LPEMA DS1232LP IMP1232LPEMA ASM1232LPN DS1232LP IMP1232LPN Analog Devices Micrel Microchip MIC1232N TC1232CPA - - - - - -

Contextual Info: Product Preview GS815018/36AB-357/333/300/250 119-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 36 18Mb Register-Register Late Write SRAM 250 MHz–357 MHz 2.5 V VDD 1.5 V or 1.8 V HSTL I/O Features Functional Description • Register-Register Late Write mode, Pipelined Read mode

Contextual Info: Product Preview GS8150V18/36AB-357/333/300/250 119-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 36 18Mb Register-Register Late Write SRAM 250 MHz–357 MHz 1.8 V VDD 1.5 V or 1.8 V HSTL I/O Features Functional Description • Register-Register Late Write mode, Pipelined Read mode

Contextual Info: Product Preview GS815018/36AB-357/333/300/250 119-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 36 18Mb Register-Register Late Write SRAM Features 250 MHz – 357 MHz 2.5 V VDD 1.5 V or 1.8 V HSTL I/O GS815018/36A support pipelined reads utilizing a rising-edgetriggered output register. They also utilize a Dual Cycle

Contextual Info: Product Preview GS8150V18/36AB-357/333/300/250 119-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 36 18Mb Register-Register Late Write SRAM Features 250 MHz – 357 MHz 1.8 V VDD 1.5 V or 1.8 V HSTL I/O GS8150V18/36A support pipelined reads utilizing a risingedge-triggered output register. They also utilize a Dual Cycle

B180

Contextual Info: GS84018/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Single Cycle Deselect SCD operation • 3.3 V +10%/–5% core power supply

B180

Contextual Info: GS84018/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Single Cycle Deselect SCD operation • 3.3 V +10%/–5% core power supply

GS832236E-150I

Abstract: GS832218 GS832218B-200 GS832218B-225 GS832218B-250 GS832272
Contextual Info: GS832218 B/E /GS832236(B/E)/GS832272(C) 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp 2M x 18, 1M x 36, 512K x 72 36Mb S/DCD Sync Burst SRAMs Features 250 MHz–133 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O either linear or interleave order with the Linear Burst Order (LBO)

GS816218B

Abstract: GS816218BB-150 GS816218BB-200 GS816218BB-250 GS816236B GS816236BB-200 GS816236BB-250 GS816236bD-150I
Contextual Info: GS816218/36B B/D 1M x 18, 512K x 36 18MbS/DCD Sync Burst SRAMs 119- & 165-Bump BGA Commercial Temp Industrial Temp Features 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O Flow Through/Pipeline Reads • FT pin for user-configurable flow through or pipeline operation

GS832132AGD-150I

Contextual Info: Preliminary GS832118/32/36AD-400/375/333/250/200/150 400 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 2M x 18, 1M x 32, 1M x 36 36Mb Sync Burst SRAMs 165-Bump BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline

GS882V18B

Abstract: GS882V18BB-250 GS882V18BB-300 GS882V18BB-333 GS882V36B
Contextual Info: GS882V18/36BB/D-333/300/250/200/150 119- and 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 1.8 V VDD 1.8 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable

GS8160V18B

Abstract: GS8160V32B GS8160V36B
Contextual Info: Preliminary GS8160V18/32/36BT-250/200/150 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect SCD operation

GS816032BT-150

Contextual Info: GS816018/32/36BT-250/200/150 100-Pin TQFP Commercial Temp Industrial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation

GS88118B

Abstract: GS88118BT-250 GS88118BT-300 GS88118BT-333 GS88132B GS88136B
Contextual Info: GS88118B T/D /GS88132B(T/D)/GS88136B(T/D) 100-pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • IEEE 1149.1 JTAG-compatible Boundary Scan

B180

Contextual Info: GS840H18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Single Cycle Deselect SCD operation • 3.3 V +10%/–5% core power supply

Contextual Info: Preliminary GS816218/36D B/D -xxxV 1M x 18, 512K x 36 18Mb S/DCD Sync Burst SRAMs 119 & 165 BGA Commercial Temp Industrial Temp Features 333 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O Flow Through/Pipeline Reads The function of the Data Output register can be controlled by the

Contextual Info: GS881E18 T/D /GS881E32A(D)/GS881E36A(T/D) 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 36 9Mb Synchronous Burst SRAMs Features • Dual Dycle Deselect (DCD) operation • IEEE 1149.1 JTAG-compatible Boundary Scan • 2.5 V or 3.3 V +10%/–10% core power supply

GS88237BB-200

Abstract: GS88237B GS88237BB-250 GS88237BB-300 GS88237BB-333 GS88237BB-333I GS88237BB-250I
Contextual Info: GS88237BB/D-333/300/250/200 119- & 165-Bump BGA Commercial Temp Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features 333 MHz–200 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O SCD and DCD Pipelined Reads The GS88237BB/D is a SCD Single Cycle Deselect and

150-IV

Contextual Info: GS880E18/32/36CT-xxxV 100-Pin TQFP Commercial Temp Industrial Temp 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • 1.8 V or 2.5 V +10%/–10% core power supply • 1.8 V or 2.5 V I/O supply • LBO pin for Linear or Interleaved Burst mode